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Details for "MSP430F2132TRHBT" ACTIVE

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Current Product Information

TI part number Lead finish/Ball material MSL rating/Peak reflow Assembly site Package | Pins Package body size (mm) Total device mass (mg) *
MSP430F2132TRHBT NIPDAU Level-2-260C-1 YEAR TI MALAYSIA A/T RHB | 32 5.0x5.0x0.9 68.000000

*Total device mass (mg)
The summary mass is a rounded value and will be within approximately +/- 10% of the detailed mass value.

Environmental Ratings Information

RoHS REACH Green status IEC 62474 DB
Yes Yes Yes Yes

Component Information

  Homogeneous Material Level Component Level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys Copper 7440-50-8 0.134995 97.585571 975856 0.198474 1985
Nickel and Its Alloys Nickel 7440-02-0 0.000001 0.000723 7 0.000001 0
Not Categorized Proprietary Materials 0.000015 0.010843 108 0.000022 0
Precious Metals Palladium 7440-05-3 0.003320 2.399970 24000 0.004880 49
Precious Metals Silver 7440-22-4 0.000004 0.002892 29 0.000006 0
Sub-Total     0.138335 100 1000000 0.203384 2034
Die Attach Adhesive
Other Inorganic Materials Silica 7631-86-9 0.034191 2.000029 20000 0.050269 503
Precious Metals Silver 7440-22-4 1.179572 68.999985 690000 1.734241 17342
Thermoplastics Epoxy 85954-11-6 0.495762 28.999985 290000 0.728884 7289
Sub-Total     1.709525 100 1000000 2.513393 25134
Lead Frame
Copper and Its Alloys Copper 7440-50-8 29.923875 99.250000 992500 43.994953 439950
Other Nonferrous Metals and Alloys Chromium 7440-47-3 0.078390 0.260000 2600 0.115250 1153
Other Nonferrous Metals and Alloys Tin 7440-31-5 0.075375 0.250000 2500 0.110819 1108
Zinc and Its Alloys Zinc 7440-66-6 0.072360 0.240000 2400 0.106390 1064
Sub-Total     30.150000 100 1000000 44.327408 443274
Lead Frame Plating
Nickel and Its Alloys Nickel 7440-02-0 0.516502 95.120074 951201 0.759376 7594
Precious Metals Gold 7440-57-5 0.004235 0.779926 7799 0.006226 62
Precious Metals Palladium 7440-05-3 0.022263 4.100000 41000 0.032732 327
Sub-Total     0.543000 100 1000000 0.798334 7983
Mold Compound
Other Inorganic Materials Fused Silica 60676-86-0 27.047738 90.500001 905000 39.766372 397664
Other Plastics and Rubber Carbon Black 1333-86-4 0.149435 0.500000 5000 0.219704 2197
Thermoplastics Epoxy 85954-11-6 2.689830 9.000000 90000 3.954670 39547
Sub-Total     29.887003 100 1000000 43.940742 439407
Semiconductor Device
Ceramics / Glass Doped Silicon 7440-21-3 5.588746 100.000000 1000000 8.216737 82167
Sub-Total     5.588746 100 1000000 8.216737 82167

Total

    68.016609     100 1000000

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