Quality & reliability


Material content search

Details for "SN74AHC14DG4"

Choose a download method for component information:

Or

Current Product Information

TI part number Lead/ball finish MSL / reflow ratings Assembly site Package | pins Package body size (mm) Total device mass (mg) *
SN74AHC14DG4 CU NIPDAU Level-1-260C-UNLIM TI MALAYSIA A/T D | 14 3.91X8.65X1.58 206.600000

*Total device mass (mg)
The summary mass is a rounded value and will be within approximately +/- 10% of the detailed mass value.

Environmental Ratings Information

RoHS status REACH status Green status IEC 62474 DB
Y Y Y Y

Component Information

  Homogeneous Material Level Component Level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Copper and Its Alloys Copper 7440-50-8 0.067942 99.998528 999985 0.032885 329
Precious Metals Silver 7440-22-4 0.000001 0.001472 15 0.000000 0
Sub-Total     0.067943 100 1000000 0.032886 329
Die Attach Adhesive
Precious Metals Silver 7440-22-4 0.122973 80.000130 800001 0.059522 595
Thermoplastics Epoxy 85954-11-6 0.030743 19.999870 199999 0.014880 149
Sub-Total     0.153716 100 1000000 0.074402 744
Lead Frame
Copper and Its Alloys Copper 7440-50-8 97.375000 97.375000 973750 47.132000 471317
Copper and Its Alloys Iron 7439-89-6 2.600000 2.600000 26000 1.300000 12585
Copper and Its Alloys Phosphorus 7723-14-0 0.015000 0.015000 150 0.007000 73
Other Nonferrous Metals and Alloys Lead 7439-92-1 0.010000 0.010000 100 0.000000 48
Sub-Total     100.000000 100 1000000 48.402000 484023
Lead Frame Plating
Nickel and Its Alloys Nickel 7440-02-0 4.375520 95.120000 951200 2.117850 21179
Precious Metals Gold 7440-57-5 0.035880 0.780000 7800 0.017370 174
Precious Metals Palladium 7440-05-3 0.188600 4.100000 41000 0.091300 913
Sub-Total     4.600000 100 1000000 2.226510 22265
Mold Compound
Other Inorganic Materials Fused Silica 60676-86-0 89.123826 88.000000 880000 43.137967 431380
Other Plastics and Rubber Carbon Black 1333-86-4 0.303831 0.300000 3000 0.147061 1471
Other Plastics and Rubber Organic Phosphorus 1330-78-5 0.557024 0.550000 5500 0.269612 2696
Thermoplastics Epoxy 85954-11-6 11.292394 11.150000 111500 5.465777 54658
Sub-Total     101.277075 100 1000000 49.020417 490204
Semiconductor Device
Ceramics / Glass Doped Silicon 7440-21-3 0.503090 100.000000 1000000 0.243510 2435
Sub-Total     0.503090 100 1000000 0.243510 2435

Total

    206.601824     100 1000000

Important Information/Disclaimer

TI bases its material content information on information provided by third-party suppliers and has taken, and continues to take, reasonably diligent steps to provide any required or available information. TI may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers may consider certain information to be proprietary, and thus certain information may not be available for release by TI. The material content information is provided by TI "as is."
For additional information, please contactTI customer support