MSP430 ultra-low-power MCUs – Design & development
TI provides kits, programmers, debuggers, software, GUIs and IDEs to help customers evaluate and develop with MSP430™ microcontrollers (MCUs) for sensing and measurement applications. From easy-to-use LaunchPad™ development kits with code examples and libraries to more advanced application-specific EVMs, GUIs and software, as well as online training and the TI E2E forum, TI provides everything you need to get your design started.
Featured offerings from TI and third parties are included below.
Programmers and debuggers
TI offers programmers and debuggers that allow users to quickly begin application development on MSP430 ultra-low-power MCUs.
|MSP-FET programmer and debugger||The MSP-FET provides a debug communication pathway between a host computer and the target MSP430 MCU. It also provides a backchannel UART connection between the computer’s USB interface and the MCU's UART.|
|MSP-GANG production programmer||Enables the programming of up to eight identical MSP430 MCUs at the same time through a host PC using a standard RS-232 or USB connection and provides flexible programming options that allow the user to fully customize the process.|
|MSP430 CapTIvate MCU programmer||The programmer/debugger board can be used with the BOOSTXL-CAPKEYPAD BoosterPack module and includes EnergyTrace™ technology to measure energy consumption with the Code Composer Studio™ IDE.|
Flash programming: services and tools
TI offers several hardware and software solutions for performing both in-system and off-board programming MSP devices. In-system programming is a method to program the MSP device after it has been installed on the PCB. This is useful if the device needs to have firmware updates at the last minute, such as in manufacturing to store product calibration values or product-specific ID information.
Off-board programming is a method to program the MSP device before it has been installed on the PCB. This is typically performed on multiple devices at the same time, allowing for a high volume throughput. We understand that the programming solutions offered directly from TI may not meet every customer’s needs.
Below is a non-comprehensive list of known third parties that support MSP430 during various stages of your MSP430 programming journey.
|Programming tool / provider||What is this tool?||Tool/service type||Capacity (throughput)||Location|
|MSP-FET||Debugging, in-system programming, off board programming||Units in parallel: 1||Global|
|MSP-GANG||Mass production in-system and off board programming||Units in parallel: 8||Global|
|MSP BSL||In-system programming||Global|
|EPS||World-wide programming service provider with programming and tape & reel service offerings||Global|
|Action Circuits||Europe-based programming service provider with programming and tape & reel services offering||Global|
|Dediprog||Programmer and programming service (Taiwan-based) provider||Taiwan|
|Flatek||Programmer and programming service (Taiwan-based) provider||Taiwan|
|Elprotronic||Flash & Gang programmer and software provider||Units in parallel: 64||Global|
|Olimex||MSP430 JTAG hardware programmer provider||Units in parallel: 1||Europe|
|Elnec||Europe-based production and universal programmer provider||Single-site||Europe|
|Phyton||In-system and universal programmer provider||Single-site||Americas|
|Data IO||Volume throughput: > 1000||Global|
|BPM Micro||Provides a complete ecosystem of manual and automated universal programming solution||Volume throughput: > 1000||Global|
|Acroview||China-based universal programmer and programming service provider||China|
|Hi-Lo Systems||Automated programming system and programming service provider||Single-site||America|
|Xeltek||Universal programmer provider||Single-site||Global|
|SMH Technologies||In-system programming tool provider||Single-site||America|
MSP MCU development kits and evaluation modules consist of an array of low-cost and advanced options ranging from LaunchPad development kits and BoosterPack™ plug-in modules to application specific EVMs. Depending on the embedded developer's needs, the full range of hardware development boards are designed to help beginners and experienced engineers move from evaluation to production quickly.
LaunchPad development kits
LaunchPad development kits are low-cost, easy-to-use development and evaluation tools to get started with MSP430 MCUs. Learn more about the LaunchPad ecosystem and available BoosterPack modules at www.ti.com/LaunchPad.
|MSP430FR2355 LaunchPad kit||32KB of FRAM memory, configurable smart analog combos (12-bit DACs and PGAs), a 12-bit ADC and two enhanced comparators as well as 24MHz operation, 44 GPIOs and 4 timers.|
|MSP430FR2433 LaunchPad kit||16KB of FRAM memory, a 10-bit ADC, 19 IO and four timers.|
|MSP430FR2311 LaunchPad kit||4KB of FRAM memory, an integrated transimpedance amplifier (TIA), Op Amp and 10-bit ADC, and enhanced comparator.|
|MSP430FR4133 LaunchPad kit||16KB of FRAM memory, LCD support, a 10-bit ADC, three 16-bit timers with 60 GPIO.|
|MSP430FR5994 LaunchPad kit||256KB of FRAM memory and an integrated low-energy accelerator for signal processing. The EVM has a microSD card slot and super capacitor for use without an external power supply|
|MSP430FR6989 LaunchPad kit||128KB of FRAM memory, 320-segment LCD controller, 12-bit ADC and AES256 with direct access to the extended scan interface - a dual AFE for low-power rotation detection|
|MSP430FR5969 LaunchPad kit||64KB of FRAM memory with 12-bit ADC, 5x 16-bit timers, 16 channel comparator, AES256, and a 3 channel internal DMA.|
|MSP430F5529 LaunchPad kit||128KB of flash and USB 2.0 support with a 16 channel 12-bit ADC, four 16-bit timers and a 12 channel comparator.|
|MSP430G2x LaunchPad kit||16KB of flash with two 16-bit timers, 8-channel comparator and 8-channel 10-bit ADC now with an on-board EZ-FET emulator with EnergyTrace technology and a 14/20-pin DIP socket.|
|MSP430FR2476 LaunchPad kit||64 KB of FRAM memory, a 12-bit ADC, enhanced comparator, four 16-bit timers and 43 GPIOs|
BoosterPack plug-in modules
MSP430 BoosterPack plug-in modules can be paired with LaunchPad development kits to provide additional features and functionality including sensing capabilities, LCDs, and battery packs. Learn more about the LaunchPad ecosystem and available BoosterPack modules at www.ti.com/LaunchPad.
|Capacitive touch keypad BoosterPack module||Easily evaluate capacitive touch sensing with a 12-button, backlit capacitive touch keypad. The BoosterPack module can be used with a LaunchPad development kit, the CapTIvate development kit or CapTIvate programmer board.|
|Audio BoosterPack module||Adds audio input functionality from a microphone, audio output through an on-board speaker as well as headphone input and output.|
|Infrared (IR) BoosterPack module||Provides simple integration of Infrared (IR) transceiver functionality to start developing remote control applications using the on-board keypad, IR LED transmitter, and IR receiver/demodulator.|
|Fuel Tank / Battery BoosterPack module||Allows LaunchPad development kits to be powered from the included rechargeable lithium polymer battery. The BoosterPack module also includes an on-board lithium polymer battery charger and gas gauge.|
|Educational BoosterPack module||Provides various analog and digital inputs/outputs are at your disposal including an analog joystick, environmental and motion sensors, RGB LED, microphone, buzzer, color LCD display, and more.|
Evaluation modules and target development boards
TI provides application-specific evaluation modules (EVMs) along with software and documentation speed your time to market. TI also offers target development boards across the family to program and debug the MSP430 MCU in-system through the JTAG interface or the Spy Bi-Wire (2-wire JTAG) protocol. Target development boards are specific to packages and families. For more information on which target board to use for a specific device, please refer to the product’s datasheet.
|MSP430FR6047 ultrasonic sensing EVM||Develop ultrasonic water metering solutions with direct interface to transducers ranging from 150KHz to 2.5MHz, display measurement parameters with an on-board LCD and connect to RF communication modules.|
|Capacitive touch development kit||A comprehensive capacitive touch sensing development kit with the MSP430FR2633-based processor board, a programmer/debugger board, and sensor boards for evaluating self-capacitance, mutual capacitance, gesture and proximity sensing.|
|MSP430FR6989 EVM||Develop flow meter designs for water, gas and heat meters with an extended scan interface. It has three boards – a primary MSP430FR6989 MCU board with an LCD; a sensor board for inductor-capacitor sensors; and a motor board to simulate water/gas flow.|
|Capacitive touch through metal add-on board||Add-on board for the CapTIvate Development Kit allows designers and engineers evaluate touch through metal technology.|
Software, GUIs and IDEs
TI offers best-in class software development tools, GUIs and support for multiple IDEs for rapid development with MSP430 MCUs including TI-owned software libraries and IDEs as well as open source and third party compilers and IDEs.
|MSP430Ware™ software||All MSP430 MCUs||A collection of design resources for developing with MSP430 MCUs including a wide selection of highly abstracted software libraries. The software is available as a component of Code Composer Studio™ IDE desktop and cloud versions, or as a standalone package.|
|CapTIvate Design Center||Capacitive touch||Tools, documentation and software examples to simplify and accelerate capacitive touch designs using MSP430 CapTIvate MCUs. Drag and drop capacitive buttons, sliders, wheels and proximity sensors to the workspace and use the GUI to generate code, configure and tune in real time.|
|Ultrasonic Design Center||Ultrasonic Sensing MCUs||Tools, a GUI, documentation, software library and application examples for developing ultrasonic sensing solutions. The GUI allows users to configure and customize parameters related to transducers and pipe size as well as analyze and capture waveforms.|
|Energy Measurement Design Center||MSP430i20xx and MSP430F67xx flash-based MCUs||A rapid development tool that enables energy measurement. The design center includes a GUI, documentation, software library and examples that can simplify development and accelerate designs in a wide range of power monitoring and energy measurement applications.|
|Code Composer Studio IDE||All MSP430 MCUs||A suite of tools used to develop and debug embedded applications. It includes an optimizing C/C++ compiler, source code editor, project build environment, debugger, profiler, and many other features.|
|Energia IDE||Supports devices with LaunchPad development kits||An open source & community-driven IDE and software framework. Based on the Wiring framework, Energia provides an intuitive coding environment as well as a robust framework of easy-to-use functional APIs & libraries for programming a microcontroller.|
|IAR Embedded Workbench®||All MSP430 MCUs||A complete debugger and C/C++ compiler toolchain for building and debugging embedded applications based on MSP430 MCUs. The debugger is fully integrated for source and disassembly-level debugging with support for complex code and data breakpoints.|
|GCC open source packages||All MSP430 MCUs||Free, complete debugger and open source C/C++ compiler toolchains for building and debugging embedded applications using MSP430 MCUs without code size limitations. The compilers can be used standalone from the command-line or used within the Code Composer Studio IDE.|
Capacitive sensing EVMs
Capacitive touch evaluation has never been faster and easier. TI offers several capacitive sensing development kits to evaluate and design with CapTIvate technology including full-featured development kits, BoosterPack modules and other add-on boards to quickly prototype your design.
MSP CapTIvate MCU development kit
Evaluate the 16KB MSP430FR2633 or 64KB MSP430FR2676 MCUs with a comprehensive suite of sensor boards and programmer/debugger boards. Explore combinations of button, slider, and wheel designs and confi
The EVM430-CAPMINI is a portable board for evaluating the MSP430FR2512 CapTIvate MCU powered by either USB or a CR1632 coin battery. It demonstrates a simple user interface with 4 buttons, status LEDs
The BOOSTXL-CAPKEYPAD is an easy-to-use EVM for the MSP430FR2522 capacitive touch sensing MCU. The BoosterPack can be used in three different ways - with a LaunchPad™ development kit, with the CapTIva
Ultrasonic sensing EVMs
Get started developing water, heat and gas meters in minutes vs. hours with application specific EVMs using TI’s ultrasonic and performance sensing MCUs. From ultrasonic sensing EVMs to those with enhanced processing capabilities including the low-energy accelerator with 40x the performance of Arm® Cortex®-M0+ MCUs, TI has an EVM to start your evaluation.
The EVM430-FR6047 evaluation kit enables engineers to quickly develop ultrasonic sensing solutions with MSP430FR6047 MCUs. The EVM can directly interface transducers ranging from 150KHz to 2.5MHz, display measurement parameters with an on-board LCD and connect to RF communication modules.
The EVM430-FR6043 evaluation kit is a development platform that can be used to evaluate the performance of the MSP430FR6043 for ultrasonic sensing applications, specifically smart gas meters and water meters.
The MSP-EXP430FR5994 demonstrates the benefits of the MSP430FR5994 MCU’s integrated low-energy accelerator (LEA) for energy-efficient digital signal processing. This accelerator delivers 40x the performance of Arm® Cortex®-M0+ MCUs to efficiently process data.