Carrier pack material lookup

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TMS320C6713BZDP225 ACTIVE

Tray

Chamfer on Tray corner indicates Pin 1 orientation of packed units.

Device TMS320C6713BZDP225
Package name ZDP
Package type BGA
Pins 272
SPQ 40
Unit array matrix 4x10
Max temperature (°C) 150
L (mm) 315
W (mm) 135.9
K0 (μm) 7620
P1 (mm) 29.2
CL (mm) 26.1
CW (mm) 24.15

Images above are just a representation of the carrier. Actual carrier may vary. Please reference the dimensions provided in the table.