Packaging information

Die-Size Ball Grid Array (WCSP) (DSBGA)

Die Size Ball Grid Array (DSBGA), also known as Wafer Chip Scale Package (WCSP), refers to packaging an IC in wafer form, in contrast to packaging an IC after it has been singulated from the wafer. It uses a copper redistribution layer to connect the silicon interconnect to an array of solder balls. The package size is equal to the silicon die size, enabling WCSP to have the smallest form factor compared to other package types. WCSP is a great package solution for space-constrained applications such as mobile or wearables.

chip  395 total package options for the Texas Instruments Die-Size Ball Grid Array (WCSP) (DSBGA).
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