Packaging information

Land Grid Array (LGA)

Land Grid Array (LGA) is a laminate substrate-based package that uses metal pads for external electrical connection instead of solder balls (as in the ball grid array). These metal pads, which are called 'lands', are arranged in a grid or array at the bottom of the package body. The grid arrangement of the lands of the LGA package allows it to have a high land count, making it a popular packaging option for devices with high I/O requirements.

chip  53 total package options for the Texas Instruments Land Grid Array (LGA).
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