Buck modules (integrated inductor)

The simplest and smallest option for step-down DC/DC voltage conversion

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Our step-down (buck) modules provide you with a fully integrated power solution. Often resulting in a smaller solution size, these solutions pack our latest and greatest converter technologies in power dense, high-performance solutions that enable a faster and more efficient design process. We feature the industry's most diverse portfolio of power modules with input voltages up to 65 VIN and output current up to 120 A with a variety of packaging options to choose from.

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MicroSiP™ power modules

Small solution size and high power density for space-constrained applications.

QFN

QFN modules with leadless packaging provide a small footprint for high-current and high-density designs.

Open frame

Buck modules built on PC board substrates with SMD or through-hole interface pins.

Leaded

Robust, exposed-lead packaging represents the ultimate in ease-of-use DC/DC design, with low pin-counts and visual inspection capability.

New products

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TLVM13620 NEW
TLVM13620 ACTIVE

3.6-V to 36-V input, 1-V to 6-V output, 2-A step-down module in 4-mm x 6-mm x 1.8-mm package

Approx. price (USD) 1ku | 1.65
TPSM63602 NEW
TPSM63602 ACTIVE

3.6-V to 36-V input, 1-V to 12-V output, 2-A, step-down module in 4-mm x 6-mm x 1.8-mm package

Approx. price (USD) 1ku | 3.28
TPSM63603E NEW
TPSM63603E ACTIVE

36-V, 3-A step-down power module in small 4-mm x 6-mm x 1.8-mm with -55°C extended temperature range

Approx. price (USD) 1ku | 5.48
TLVM13660 NEW
TLVM13660 ACTIVE

36-V input, 1-V to 6-V output, 6-A buck power module in 5-mm x 5.5-mm enhanced HotRod™ QFN

Approx. price (USD) 1ku | 3.55
TLVM13640 NEW
TLVM13640 ACTIVE

36-V input, 1-V to 6-V output, 4-A buck power module in 5-mm x 5.5-mm enhanced HotRod™ QFN

Approx. price (USD) 1ku | 2.95
TPSM63604 NEW
TPSM63604 ACTIVE

36-V input, 16-V output, 4-A synchronous step-down DC-DC power module

Approx. price (USD) 1ku | 5.55
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Benefits of our step-down (buck) modules

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Shrink

With integrated FETs, controller, inductor and passives, DC/DC modules minimize power-supply solution size to help meet challenging PCB area constraints.

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Simplify 

By optimizing internal layout and reducing external component sourcing, integrated-inductor power modules simplify the process of DC/DC and EMI design compared to discrete converters and controllers.

Power trends

Power density

More power, less board space. In addition to being a trend in applications across all markets, it is also one of the key benefits of using a step-down module. Buck modules feature an integrated inductor and FETs to not only minimize power supply size, but also simplify design and help get customers to market faster. On the inside, the centerpiece of each module is a high-efficiency buck regulator surrounded by a layout optimized for thermal performance.  

High-density power modules are a great choice for powering high-current digital loads like FPGAs and processors. Use our processor-attach tool to find the best power supply devices to surround your FPGA or processor. 

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White paper
Benefits and trade-offs of various power-module package options
This white paper discusses a few package options – embedded, leaded and QFN – and the benefits and trade-offs of each in terms of module size, component integration, thermal performance and EMI considerations.
document-pdfAcrobat PDF
Application note
Practical Thermal Design With DC/DC Power Modules (Rev. A)
This application note outlines a design procedure to quickly estimate the minimum required copper area on the PCB for a successful thermal design with DC/DC power modules.
document-pdfAcrobat PDF
White paper
Enabling Small, Cool and Quiet Power Modules with Enhanced HotRod™ QFN Packaging
Learn how our enhanced HotRod™ QFN package technology enables engineers to address design challenges and take advantage of more efficient, cooler and quieter devices in their designs. 
document-pdfAcrobat PDF
Featured products for power density
NEW TPSM82866A ACTIVE 2.4-V to 5.5-V Input, 6-A thin step-down power module with integrated inductor in 3.5-mm x 4-mm QFN
NEW TLVM13630 ACTIVE High-density, 3-V to 36-V input, 1-V to 6-V output, 3-A step-down power module
TPSM5D1806 ACTIVE 4.5-V to 15-V input, dual 6-A, single 12-A, output power module
Low EMI

Mitigating power-supply EMI can be a major challenge for many power-supply designers, so why not make it as simple as possible? With a high level of integration and an internal layout optimized to minimize noise, buck modules are an excellent choice to save design time and help you comply with difficult standards like CISPR 22 Class-B. Take a look below at some of our latest and best DC/DC step-down modules for EMI performance. 

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White paper
Simplify low EMI design with power modules
Learn how the tight integration of a power module helps to not only increase power density, but also simplify EMI design. 
document-pdfAcrobat PDF
Video
Package optimization – HotRod™ and enhanced HotRod QFN packages
HotRod QFN or flip-chip on leadframe QFN packages eliminates the need for bondwires. See how you can use our HotRod QFN package technology to mitigate EMI issues, while additional enhancements can reduce your solution size. 
Application note
Further Optimizing EMI with Spread Spectrum
This application report will focus on understanding the noise origins,the effective construction of our power modules to help with noise reduction, and how the spread spectrum technique helps reduce EMI emissions.
document-pdfAcrobat PDF
Featured products for low EMI
NEW TPSM63606 ACTIVE High-density, 36-V input, 1-V to 16-V output, 6-A power module in 5-mm x 5.5-mm enhanced HotRod™ QFN
TPSM82810 ACTIVE 2.75-V to 6-V, 4-A step-down module with adjustable-frequency & tracking in 3 x 4-mm μSIP package
LMZM23601 ACTIVE 36-V, 1-A Step-Down DC-DC Power Module in 3.8-mm × 3-mm Package

Technical resources

Video
Video
Exploring the value of power modules
In this training series, we discuss the high level of integration of our power modules and the significant implications that this has on power-supply design with respect to solution size, EMI, design time and cost.
Selection guide
Selection guide
Innovative DC/DC Power Modules Selection Guide (Rev. D)
Browse this selection guide to find the latest and best DC/DC power module for your design.
document-pdfAcrobat PDF
Application note
Application note
Soldering Considerations for Power Modules (Rev. B)
We have a large portfolio of power modules offered in different types of packages. This application report provides an overview of several module package types and provides some guidance on soldering topics and considerations.
document-pdfAcrobat PDF

Design & development resources

Design tool
WEBENCH® Power Designer
WEBENCH® Power Designer creates customized power-supply circuits based on your requirements. The environment gives you end-to-end power-supply design capabilities that save you time during all phases of the design process.
Simulation tool
PSpice® for TI design and simulation tool
PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Design tool
Power Stage Designer™ Tool of Most Commonly Used Switch-mode Power Supplies
Power Stage DesignerTM is a JAVA-based tool (requires JAVA 8 or OpenJDK 8) that helps engineers accelerate their power-supply designs by calculating voltages and currents of 20 topologies according to the user’s inputs. Additionally, Power Stage Designer contains a Bode plotting tool and a (...)

Reference designs related to Buck modules (integrated inductor)

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