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DC/DC buck modules

The simplest and smallest option for step-down DC/DC voltage conversion

DC/DC step-down power modules integrate inductors, FETs, compensation, and other passive components into a single package to simplify the design process and speed customer time-to-market with a minimized power supply footprint. We feature the industry's most diverse portfolio of step-down modules, reaching 60 VIN and 60 A with a variety of packaging options to choose from.

Select device by package type

MicroSiP™

Small solution size and high power density for space-constrained applications.

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QFN

QFN modules with leadless packaging provide a small footprint for high-current, high-density designs.

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Open frame

Non-isolated DC/DC converter power modules built on PC board substrates with SMD or through-hole interface pins.

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Leaded

Robust, exposed-lead packaging represents the ultimate in ease-of-use DC/DC design, with low pin-counts and visual inspection capability.

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Featured products

TPSM53604

36-V, 4-A step-down power module in small 5.5-mm x 5-mm x 4-mm RLF QFN package with simple footprint

LMZM23601

36-V, 1-A step-down DC/DC power module in 3.8-mm × 3-mm package

TPSM82822

5.5-V input, 2-A, step-down module with light load mode in 2-mm x 2.5-mm x 1.1-mm LGA package

LMZM33606

4-V to 36-V input, 1-V to 18-V output, 6-A power module in 10-mm x 16-mm x 4-mm QFN package with frequency sync

Why you should choose a TI power module

simplify your DC/DC design

Simplify

Our integrated-inductor step-down power modules greatly simplify the process of DC/DC design compared to discrete converter and controller ICs.

  • Optimal converter selected for the specification
  • Reduced component sourcing and qualification
  • Optimized layout for EMI and thermal performance
  • Fully characterized across the operating range
shrink your DC/DC design

Shrink

DC/DC buck modules minimize power supply solution size to maximize power density and meet challenging PCB area constraints.

  • Integrated controller, FETs, inductor, passives
  • IC package sizes as small as 2.3 mm x 2.9 mm
  • Up to 40% PCB area reduction compared to discrete

Buck modules design resources

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