Buck modules (integrated inductor)
The simplest and smallest option for step-down DC/DC voltage conversion
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MicroSiP™ power modules
Small solution size and high power density for space-constrained applications.
QFN modules with leadless packaging provide a small footprint for high-current and high-density designs.
Buck modules built on PC board substrates with SMD or through-hole interface pins.
Robust, exposed-lead packaging represents the ultimate in ease-of-use DC/DC design, with low pin-counts and visual inspection capability.
Featured buck modules
4-V to 18-V input, advanced current mode, 20-A synchronous SWIFT™ step-down converter
Approx. price (USD) 1ku | 16.45
4-V to 18-V input, advanced current mode, 16-A synchronous SWIFT™ step-down power module
Approx. price (USD) 1ku | 12.8
3-V to 17-V input voltage, 3-A forced-CCM synchronous buck module
Approx. price (USD) 1ku | 0.6
3-V to 17-V input voltage, 3-A Eco-mode synchronous buck module
Approx. price (USD) 1ku | 0.6
3-V to 36-V input, 1-V to 6-V output, 1.5-A synchronous buck power module
Approx. price (USD) 1ku | 0.85
High-density, 36-V input, 1-V to 20-V output, 6-A power module in 7.5-mm x 6.5-mm HotRod™ QFN
Approx. price (USD) 1ku | 7.205
Benefits of our step-down (buck) modules
With integrated FETs, controller, inductor and passives, DC/DC modules minimize power-supply solution size to help meet challenging PCB area constraints.
By optimizing internal layout and reducing external component sourcing, integrated-inductor power modules simplify the process of DC/DC and EMI design compared to discrete converters and controllers.
More power, less board space. In addition to being a trend in applications across all markets, it is also one of the key benefits of using a step-down module. Buck modules feature an integrated inductor and FETs to not only minimize power supply size, but also simplify design and help get customers to market faster. On the inside, the centerpiece of each module is a high-efficiency buck regulator surrounded by a layout optimized for thermal performance.
High-density power modules are a great choice for powering high-current digital loads like FPGAs and processors. Use our processor-attach tool to find the best power supply devices to surround your FPGA or processor.
Benefits and trade-offs of various power-module package options
Practical Thermal Design With DC/DC Power Modules (Rev. A)
Enabling Small, Cool and Quiet Power Modules with Enhanced HotRod™ QFN Packaging
Featured products for power density
Mitigating power-supply EMI can be a major challenge for many power-supply designers, so why not make it as simple as possible? With a high level of integration and an internal layout optimized to minimize noise, buck modules are an excellent choice to save design time and help you comply with difficult standards like CISPR 22 Class-B. Take a look below at some of our latest and best DC/DC step-down modules for EMI performance.
Simplify low EMI design with power modules
Package optimization – HotRod™ and enhanced HotRod QFN packages
Further Optimizing EMI with Spread Spectrum
Featured products for low EMI
Design & development resources
WEBENCH® Power Designer
PSpice® for TI design and simulation tool
Power Stage Designer™ software tool of most commonly used switchmode power supplies
Power Stage Designer is a JAVA-based tool that helps speed up power-supply designs as it calculates voltages and currents of 21 topologies based on user inputs. Additionally, Power Stage Designer contains a Bode plotting tool and a helpful toolbox with various functions to make power supply design (...)