Product details


Number of input channels 256 Resolution (Bits) 16 Interface type SPI/LVDS Features Internal Reference Buffer, Nap Mode, Power Down, X-ray Operating temperature range (C) 0 to 85 open-in-new Find other Digital X-ray AFEs

Package | Pins | Size

COF (TDU) 320 1064 mm² 28 x 38 open-in-new Find other Digital X-ray AFEs


  • 256 Channels
  • On-Chip, 16-Bit ADC
  • Photodiode Short Immunity
  • High Performance:
    • Noise: 750 Electrons RMS
      (1.2-pC Input Charge Range)
    • Low Correlated Noise
    • Integral Nonlinearity:
      ±2 LSB with Internal 16-Bit ADC
    • Scan Time:
      • < 20 µs to 204.8 µs
  • Integration:
    • Six Selectable, Full-Scale Input Ranges:
      0.6 pC (Min) to 9.6 pC (Max)
    • Internal Timing Generator (TG)
    • Built-In Correlated Double Sampler
    • Pipelined Integrate and Read for Improved
      Throughput: Allows Data Read During
    • Serial LVDS Output
  • Simple Power-Supply Scheme:
    • AVDD1 = 1.85 V
    • AVDD2 = 3.3 V
  • Low Power Consumption
  • Nap and Total Power-Down Mode
  • Custom Chip-On-Film (COF) Packages
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The AFE2256 is a 256-channel, analog front-end (AFE) designed to suit the requirements of flat-panel detector (FPD)-based digital x-ray systems. The device includes 256 integrators , a programmable gain amplifier (PGA) for full-scale charge level selection, a correlated double sampler (CDS) with dual banking, and 256:4 analog multiplexers.

The device also features four 16-bit successive-approximation register (SAR) analog-to-digital converters (ADCs). Serial data from the ADCs are available in low-voltage differential signaling (LVDS) format.

The Nap and power-down modes enable substantial power saving that is especially useful in battery-powered systems.

To request a full datasheet or other design resources: request AFE2256

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More information

Full data sheet and other design resources are available under NDA. Request now

Technical documentation

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Type Title Date
* Datasheet AFE2256 256-Channel, Analog Front-End for Digital X-Ray, Flat-Panel Detectors datasheet (Rev. B) May 27, 2016
Technical article Advancements in X-ray imaging Mar. 28, 2017
Technical article Offset correction improves the next generation of heart-rate smart watches Aug. 24, 2015
Technical article A new way to illuminate the human condition Dec. 30, 2013
Technical article Oximeter signaling: There’s more than meets the eye Dec. 04, 2013

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

document-generic User guide

The AFE2256EVM is a compact USB based evaluation kit for evaluating the AFE2256 COF, a 256-channel analog front-end. The EVM is self-contained with DACs and power generation on-board which greatly reduces its dependency on external equipment. The kit consists of an EVM and two separate COF adapters (...)

  • Allows quick evaluation of AFE2256 COF devices (externally detachable)
  • GUI software allows easy control of AFE2256 device modes and functions
  • On board 3.3V and 1.8V DUT power generation
  • On board FPGA based pattern generation and data acquisition
  • Communicates with Personal Computer through a USB 2.0 (...)

Design tools & simulation

PSpice® for TI design and simulation tool
PSPICE-FOR-TI — PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
  • Leverages Cadence PSpice Technology
  • Preinstalled library with a suite of digital models to enable worst-case timing analysis
  • Dynamic updates ensure you have access to most current device models
  • Optimized for simulation speed without loss of accuracy
  • Supports simultaneous analysis of multiple products
  • (...)

CAD/CAE symbols

Package Pins Download
(TDR) 325 View options
COF (TDU) 320 View options

Ordering & quality

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  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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