850 - 950MHz RF front end
Product details
Parameters
Package | Pins | Size
Features
- Seamless Interface to Sub-1 GHz Low Power RF Devices from Texas Instruments
- Up to 27 dBm (0.5 W) Output Power
- 6 dB Typical Sensitivity Improvement with CC11xx and CC430
- Few External Components
- Integrated PA
- Integrated LNA
- Integrated Switches
- Integrated Matching Network
- Integrated Inductors
- Digital Control of LNA and PA Gain by HGM Pin
- 50-nA in Power Down (LNA_EN = PA_EN = 0)
- High Transmit Power Efficiency
- PAE = 50% at 26 dBm Output Power
- Low Receive Current Consumption
- 3 mA for High Gain Mode
- 26 µA for Low Gain Mode
- 2.9 dB LNA Noise Figure, Including Switch and External Antenna Match
- RoHS Compliant 4-mm × 4-mm QFN-16 Package
- 2 V to 3.7 V Operation
- APPLICATIONS
- 850 - 950 MHz ISM Bands Wireless Systems
- Wireless Sensor Networks
- Wireless Industrial Systems
- IEEE 802.15.4 Systems
- Wireless Consumer Systems
- Wireless Metering (AMR/AMI) Systems
- Smart Grid Wireless Networks
Description
CC1190 is a cost-effective and high-performance RF Front End for low-power and low-voltage wireless applications at 850 - 950 MHz.
CC1190 is a range extender for the sub-1 GHz low-power RF transceivers, transmitters, and System-on-Chip devices from Texas Instruments.
CC1190 integrates a power amplifier (PA), a low-noise amplifier (LNA), switches, and RF matching for the design of a high-performance wireless systems.
CC1190 increases the link budget by providing a power amplifier for increased output power, and an LNA with low noise figure for improved receiver sensitivity.
CC1190 provides an efficient and easy-to-use range extender in a compact 4-mm × 4-mm QFN-16 package.
Technical documentation
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The CC1120-CC1190 BoosterPack™ module is designed to use with the MSP-EXP430F5529 and MSP-EXP430G2553 LauchPad™ development kits and to work as a stand-alone module by using SmartRF Studio application software. The module is equipped with an integrated PCB trace antenna which (...)
Features
- Can be used with both LaunchPad and SmartRF Studio applications
- Same design can be used for both 915 MHz and 868 MHz frequecy bands with minor BOM changes
- Same design can be used with CC112x devices and CC12xx devices with minor BOM changes
- Integrated PCB trace Antenna
Description
This new antenna kit allows you to do real-life testing to find the optimal antenna for your application! The antenna kit includes 16 antennas for frequencies from 169MHz to 2.4GHz including PCB antennas, Helical antennas and Chip antennas as well as dual band band antennas for 868/915MHz combined (...)
Features
- 16 Antennas for 169MHz, 315MHz, 433MHz, 868MHz, 915MHz, 2.4GHz
- Compatible with LaunchPad and SensorTag
- Includes everything needed for real-life testing of antennas
Description
The SimpleLink™ Sub-1 GHz CC1310-1190 wireless microcontroller (MCU) LaunchPad™ development kit features CC1310 Sub-1 GHz wireless MCU combined with the CC1190 high-performance RF Front End, offering long-range low power connectivity with up to +27dBm output power.
The CC1310 device is a wireless MCU (...)
Features
- LaunchPad with Sub-1GHz radio and RF Front End for wireless applications with integrated PCB trace antenna and SMA connector
- Access all I/O signals with the BoosterPack connectors
- Broad band antenna supports both 868 MHz ISM band for Europe and 915 MHz ISM band for US with a single board
- On-Board (...)
Design tools & simulation
Features
- Modules listed are based on TI wireless technology supporting Wi-Fi®, Bluetooth®, Zigbee®, Sub-1 GHz, Sigfox, 2.4 GHz, multi-band connectivity and more
- Modules integrate clocks, SPI flash and passive components
- Listings included for hardware customization, software integration and cloud services
- Listings (...)
Features
- Range estimate spreadsheet for Sub-1 GHz and 2.4 GHz devices
- Range debug checklist
- Step 1: Before requesting a review, it is important that to review the technical documentation and design & development resources available on the corresponding product page (see CC1xxx product page links below).
- Step 2 (...)
Reference designs
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| VQFN (RGV) | 16 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.