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CC2564MODA

ACTIVE

Bluetooth® 4.1 with Basic Rate, enhanced data rate, Low Energy (LE) module with integrated antenna

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Data sheet

CC2564MODA

ACTIVE
Data sheet Order now

Product details

Protocols Dual-mode Bluetooth Type Module, Transceiver Features Assisted A2DP/HFP 1.6, BR / EDR / LE, Class 1 TX Power Rating Catalog Security Networking security Sensitivity (best) (dBm) -93 Operating temperature range (°C) -30 to 85
Protocols Dual-mode Bluetooth Type Module, Transceiver Features Assisted A2DP/HFP 1.6, BR / EDR / LE, Class 1 TX Power Rating Catalog Security Networking security Sensitivity (best) (dBm) -93 Operating temperature range (°C) -30 to 85
QFM (MOG) 35 98 mm² 14 x 7
  • Module Solution Based on TI's CC2564B Dual-Mode Bluetooth®, Available in Two Variants:
    • CC2564MODA With Integrated Antenna
    • CC2564MODN With External Antenna
  • Fully Certified Module for FCC, IC, CE, and Bluetooth 4.1
    • FCC (Z64-2564N), IC (451I-2564N) Modular Grant (see Section 6.2.1.3, Section 7.1.1, and Section 7.1.2)
    • CE Certified as Summarized in the Declaration of Conformity (see Section 7.1.3)
    • Bluetooth 4.1 Controller Subsystem Qualified (CC2564MODN: QDID 55257; CC2564MODA: QDID 64631). Compliant up to the HCI Layer
  • Highly Optimized for Design Into Small Form Factor Systems and Flexibility:
    • CC2564MODA
      • Integrated Chip Antenna
      • Module Footprint: 35 Terminals, 0.8-mm Pitch, 7 mm × 14 mm × 1.4 mm (Typical)
    • CC2564MODN
      • Single-Ended 50-Ω RF Interface
      • Module Footprint: 33 Terminals, 0.8-mm Pitch, 7 mm × 7 mm × 1.4 mm (Typical)
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded)
    • Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Support of up to 10 Simultaneous Connections
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1.5 TX Power up to +10 dBm
    • –93 dbm Typical RX Sensitivity
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Provides Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack

All trademarks are the property of their respective owners. All trademarks are the property of their respective owners.
  • Module Solution Based on TI's CC2564B Dual-Mode Bluetooth®, Available in Two Variants:
    • CC2564MODA With Integrated Antenna
    • CC2564MODN With External Antenna
  • Fully Certified Module for FCC, IC, CE, and Bluetooth 4.1
    • FCC (Z64-2564N), IC (451I-2564N) Modular Grant (see Section 6.2.1.3, Section 7.1.1, and Section 7.1.2)
    • CE Certified as Summarized in the Declaration of Conformity (see Section 7.1.3)
    • Bluetooth 4.1 Controller Subsystem Qualified (CC2564MODN: QDID 55257; CC2564MODA: QDID 64631). Compliant up to the HCI Layer
  • Highly Optimized for Design Into Small Form Factor Systems and Flexibility:
    • CC2564MODA
      • Integrated Chip Antenna
      • Module Footprint: 35 Terminals, 0.8-mm Pitch, 7 mm × 14 mm × 1.4 mm (Typical)
    • CC2564MODN
      • Single-Ended 50-Ω RF Interface
      • Module Footprint: 33 Terminals, 0.8-mm Pitch, 7 mm × 7 mm × 1.4 mm (Typical)
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded)
    • Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Support of up to 10 Simultaneous Connections
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1.5 TX Power up to +10 dBm
    • –93 dbm Typical RX Sensitivity
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Provides Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack

All trademarks are the property of their respective owners. All trademarks are the property of their respective owners.

The CC2564MODx module from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI solution that reduces design effort, cost, and time to market. The CC2564MODx module includes TI's seventh-generation core and provides a versatile, product-proven solution that is Bluetooth 4.1-compliant. The module is also certified for FCC, IC, and CE, requiring no prior RF experience to develop with this device; and the device includes a royalty-free software stack compatible with several host MCUs and MPUs. The CC2564MODx module provides best-in-class RF performance with transmit power and receive sensitivity that provides twice the range and higher throughput than other Bluetooth-low-energy-only solutions.

Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for TI's MSP430™ and MSP432™ ARM® Cortex®-M3 and ARM® Cortex®-M4 MCUs, and Linux® based MPUs. Other processors can be supported through TI's third party. The iPod® (MFi) protocol is supported by add-on software packages. Multiple profiles and sample applications, including the following, are supported:

  • Serial port profile (SPP)
  • Advanced audio distribution profile (A2DP)
  • Audio/video remote control profile (AVRCP)
  • Hands-free profile (HFP)
  • Human interface device (HID)
  • Generic attribute profile (GATT)
  • Several Bluetooth low energy profiles and services

For more information, see TI Dual-Mode Bluetooth Stack.

In addition to software, the BOOST-CC2564MODA and CC2564MODxEM evaluation boards are available for each variant. For more information on TI’s wireless platform solutions for Bluetooth, see TI's wireless-connectivity/dual-mode-bluetooth page.

The CC2564MODx module from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI solution that reduces design effort, cost, and time to market. The CC2564MODx module includes TI's seventh-generation core and provides a versatile, product-proven solution that is Bluetooth 4.1-compliant. The module is also certified for FCC, IC, and CE, requiring no prior RF experience to develop with this device; and the device includes a royalty-free software stack compatible with several host MCUs and MPUs. The CC2564MODx module provides best-in-class RF performance with transmit power and receive sensitivity that provides twice the range and higher throughput than other Bluetooth-low-energy-only solutions.

Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for TI's MSP430™ and MSP432™ ARM® Cortex®-M3 and ARM® Cortex®-M4 MCUs, and Linux® based MPUs. Other processors can be supported through TI's third party. The iPod® (MFi) protocol is supported by add-on software packages. Multiple profiles and sample applications, including the following, are supported:

  • Serial port profile (SPP)
  • Advanced audio distribution profile (A2DP)
  • Audio/video remote control profile (AVRCP)
  • Hands-free profile (HFP)
  • Human interface device (HID)
  • Generic attribute profile (GATT)
  • Several Bluetooth low energy profiles and services

For more information, see TI Dual-Mode Bluetooth Stack.

In addition to software, the BOOST-CC2564MODA and CC2564MODxEM evaluation boards are available for each variant. For more information on TI’s wireless platform solutions for Bluetooth, see TI's wireless-connectivity/dual-mode-bluetooth page.
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Technical documentation

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Type Title Date
* Data sheet CC2564MODx Bluetooth® Host Controller Interface (HCI) Module datasheet (Rev. E) 16 Jan 2016
* Radiation & reliability report CC2564MODA Reliability Data – Reliability Estimate 25 Jun 2019
Selection guide CC256x Getting Started Selection Guide (Rev. C) PDF | HTML 13 May 2022
Selection guide Leitfaden zur Auswahl drahtloser Kommunikationstechnologie (Rev. B) 07 Mar 2022
Selection guide 無線連線技術選擇指南 (Rev. B) 07 Mar 2022
Selection guide 무선 연결 기술 선택 가이드 (Rev. B) 07 Mar 2022
Selection guide Wireless Connectivity Technology Selection Guide (Rev. B) 14 Feb 2022
Certificate CC2564MODA EC Declaration of Conformity (DoC) (Rev. A) 03 Mar 2021
User guide Bluetopia Stack Build Guide for Linux PDF | HTML 15 Jan 2021
User guide CC2564x Demo Applications User's Guide PDF | HTML 17 Dec 2020
Application note Bluetooth Basic Rate/Enhanced Data Rate – Bluetooth Impersonation AttackS (BIAS) PDF | HTML 18 May 2020
Application note Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 18 May 2020
Application note Capturing Bluetooth Host Controller Interface (HCI) Logs 07 Jan 2019
White paper Wireless Connectivity For The Internet of Things, One Size Does Not Fit All (Rev. A) 16 Oct 2017
White paper Which TI Bluetooth® solution should I choose? 05 May 2017
White paper White Paper: Why Classic Bluetooth® (BR/EDR)? 04 May 2017
More literature Streamline the challenges of RF design with certified wireless modules 25 Jan 2017
Technical article Maximize your IoT design with new dual-mode Bluetooth® + MSP432™ MCU bundle 22 Dec 2016
Technical article Driving industrial markets with TI’s dual-mode Bluetooth® module 05 May 2016
Technical article The dual-mode Bluetooth® module you’ve been waiting for is here 17 Feb 2016
More literature Dual-mode Bluetooth CC256x solutions (Rev. C) 03 Feb 2016
User guide TI Dual-mode Bluetooth Stack on STM32F4 MCUs User Guide PDF | HTML 08 Jul 2015
User guide Dual-Mode Bluetooth CC2564 Module With Integrated Antenna Evaluation Board 07 Jul 2015
User guide CC2564MODA Evaluation Board Quick Start Guide 01 Jul 2015
Technical article Simplifying your multi-rail power application with one device 27 May 2015
White paper Three Flavors of Bluetooth: Which One to Choose? 25 Mar 2014

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

BOOST-CC2564MODA — TMP107 temperature sensor daisy-chain BoosterPack™ plug-in module

The BOOST-CC2564MODA BoosterPack™ plug-in module is intended for evaluation and design purposes of the dual-mode Bluetooth® CC2564 module with integrated antenna (CC2564MODA).  The CC2564MODA module is based on TI's dual-mode Bluetooth® CC2564B Controller, which reduces design (...)

User guide: PDF
Not available on TI.com
Evaluation board

CC2564MODAEM — Dual-mode Bluetooth® CC2564 Module with Integrated Antenna Evaluation Board

The CC2564MODAEM evaluation board contains the Bluetooth BR/EDR/LE HCI solution. Based on TI's CC2564B dual-mode Bluetooth single-chip device, the bCC2564MODA is intended for evaluation and design purposes, reducing design effort and enabling fast time to market.


For a complete evaluation solution, (...)

User guide: PDF | HTML
Not available on TI.com
Evaluation board

CC2564MODNEM — Dual-mode Bluetooth® CC2564 module evaluation board

The CC2564MODNEM evaluation board contains the CC2564MODN device and is intended for evaluation and design purposes.

For a complete evaluation solution, the CC2564MODNEM board plugs directly into our hardware development kits: MSP-EXP430F5529, MSP-EXP430F5438, DK-TM4C129X and kits for our other (...)

User guide: PDF
Not available on TI.com
Evaluation board

CC256XQFNEM — Dual-mode Bluetooth® CC2564 evaluation board

The CC256XQFNEM evaluation board contains the CC2564B device and is intended for evaluation and design purposes for the CC256x devices.

For a complete evaluation solution, the CC256XQFNEM board plugs directly into the TI hardware development kits: MSP-EXP430F5529, MSP-EXP430F5438, DK-TM4C129X and (...)

User guide: PDF
Not available on TI.com
Evaluation board

DK-TM4C123G — TM4C123G USB+CAN Development Kit

The Tiva C Series TM4C123G Development Kit is a compact and versatile evaluation platform for the Tiva C Series TM4C123G ARM® Cortex™-M4-based microcontroller (MCU). The development kit design highlights the TM4C123G MCU integrated USB 2.0 On-the-Go/Host/Device interface, CAN, precision (...)

User guide: PDF
View options
Evaluation board

MSP-EXP430F5529 — MSP430F5529 USB Experimenter’s Board

Special Note:

The MSP430F5529 USB microcontroller development kit is not supported by the Mac or Linux versions of the Code Composer Studio™ Integrated Development Environment. If you want to work with these operating systems, we suggest you select one of the many MSP LaunchPads.  

The MSP430F5529 (...)

User guide: PDF | HTML
Not available on TI.com
Interface adapter

CC256XSTBTBLESW — TI Dual-mode Bluetooth® Stack on STM32F4 MCUs

TI's Dual-mode Bluetooth stack on STM32F4 MCUs software for Bluetooth + Bluetooth Low Energy enables the STM32 ARM Cortex M4 and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified for CC256XSTBTBLESW (QDID 69887 (...)

User guide: PDF | HTML
View options
Software development kit (SDK)

TIBLUETOOTHSTACK-SDK — TI Dual-Mode Bluetooth® Stack

TI’s dual-mode Bluetooth stack enables Bluetooth + Bluetooth Low Energy and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0/4.1/4.2 specification. The Bluetooth stack is fully Bluetooth Special Interest Group (SIG) qualified, certified and royalty-free, (...)

View options
Driver or library

CC256XB-BT-SP — Bluetooth Service Pack for CC256xB

The package contains Init Scripts (for BT4.0 and BT4.1) and Add-Ons (for Audio/Voice Processing and for BLE support).

CC256x -BT-SP

The CC256x Bluetooth Service Packs (SP) are mandatory initialization scripts that contain bug fixes and platform specific configurations. They must be loaded into the (...)

Download
Driver or library

CC256XM4BTBLESW — TI dual-mode Bluetooth® stack on TM4C MCUs

TI’s Dual-mode Bluetooth stack on TM4C MCUs software for Bluetooth + Bluetooth Low Energy enables the TM4C12x MCU and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID 37180 and QDID 42849), provides (...)
Download
Driver or library

CC256XMS432BTBLESW — TI Dual-mode Bluetooth Stack on MSP432 MCUs

TI’s Dual-mode Bluetooth stack on MSP432 MCUs software for Bluetooth + Bluetooth Low Energy enables the MSP432 MCU and is comprised of Single Mode and Dual-mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID 69887 and QDID 69886), provides (...)
Download
Driver or library

CC256XMSPBTBLESW — TI Dual-mode Bluetooth® stack on MSP430™ MCUs

TI’s Dual-mode Bluetooth stack on MSP430™ MCUs software for Bluetooth + Bluetooth Low Energy enables the MSP430 MCU and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID 37180 and QDID 42849), (...)
Download
Driver or library

TI-BT-STACK-LINUX-ADDON — TI Bluetooth Linux Add-On for AM335x EVM, AM437x EVM and BeagleBone With WL18xx and CC256x

This package contains the install package, pre-compiled object and source of the TI Bluetooth Stack and Platform Manager to easily upgrade the default LINUX EZSDK Binary on a AM437x EVM, AM335x EVM or BeagleBone. The software was built with Linaro GCC 4.7 and can be added to Linux SDKs that use (...)
Download
Certification

CC256X-CERTIFICATION — Radio certification for Dual Mode Bluetooth

Are you looking for CC256x module certification support? CC256x-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
View options
Certification

CC256X-REPORTS — Reports: CC256x Regulatory Certification Reports

Are you looking for CC256x module certification support? CC256x-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
Supported products & hardware

Supported products & hardware

Products
Bluetooth products
CC2564 — Bluetooth® 4.0 with Enhanced Data Rate (EDR), Low Energy (LE) and ANT CC2564C — Bluetooth® 5.1 with Basic Rate (BR), Enhanced Data Rate (EDR), Low Energy (LE) CC2564MODA — Bluetooth® 4.1 with Basic Rate, enhanced data rate, Low Energy (LE) module with integrated antenna CC2564MODN — Bluetooth® 4.1 with Basic Rate (BR), Enhanced Data Rate (EDR), Low Energy (LE) module
Hardware development
BOOST-CC2564MODA — TMP107 temperature sensor daisy-chain BoosterPack™ plug-in module CC2564MODAEM — Dual-mode Bluetooth® CC2564 Module with Integrated Antenna Evaluation Board CC2564MODNEM — Dual-mode Bluetooth® CC2564 module evaluation board CC256XCQFN-EM — CC2564C Dual-Mode Bluetooth® Controller Evaluation Module CC256XQFNEM — Dual-mode Bluetooth® CC2564 evaluation board
Download options
Design tool

DUALMODE-BT-DESIGN-REVIEWS — Hardware design reviews for CC256x devices

To get started with the dual-mode Bluetooth® hardware design review process:
  • Step 1: Before requesting a review, it is important that to review the technical documentation and design & development resources available on the corresponding product page (see CC256x product page links below).
  • Step 2: (...)
User guide: PDF
Request
Gerber file

CC2564MODAEM Design Files

SWRC317.ZIP (1326 KB)
Download
Reference designs

TIDA-00554 — DLP Ultra-mobile NIR Spectrometer for Portable Chemical Analysis with Bluetooth Connectivity

The ultra-mobile near-infrared (NIR) spectrometer reference design utilizes Texas Instruments' DLP technology in conjunction with a single-element InGaAs detector to deliver high performance measurements in a portable form factor that is more affordable than architectures using an expensive InGaAs (...)
Design guide: PDF
Schematic: PDF
Reference designs

BT-MSPAUDSINK-RD — Bluetooth and MSP430 Audio Sink Reference Design

TI's Bluetooth + MSP430 Audio sink reference design can be used by customers to create a variety of applications for low end, low power audio solutions. Some application possibilities - toys, low end bluetooth speakers, audio streaming accessories. This reference design is a cost effective audio (...)
User guide: PDF
Schematic: PDF
Reference designs

CC256XEM-RD — CC256x Bluetooth® Reference Design

This CC256x Bluetooth® evaluation module reference design is an RF reference design with antenna which can be easily connected to many Microcontroller Units (MCUs), such as TI's MSP430 or Tiva C series MCUs. The reference design can be copied into your board, allowing for a cost-effective design (...)
User guide: PDF
Schematic: PDF
Reference designs

BT-MSPAUDSOURCE-RD — Bluetooth and MSP MCU Audio Source Reference Design

The Bluetooth and low-power MSP microcontroller Audio Source reference design can be used by customers to create a variety of applications for low-end, low-power audio source solutions for applications including toys, projectors, smart remotes and any audio streaming accessories. This reference (...)
User guide: PDF
Schematic: PDF
Package Pins Download
QFM (MOG) 35 View options
TI's Standard Terms and Conditions for Evaluation Items apply.

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

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