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CSD95495QVM

ACTIVE

50A Synchronous Buck NexFET Smart Power Stage in small 4x5 SON Package

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CSD95420RCB ACTIVE 50-A peak continuous synchronous buck NexFET™ smart power stage Improved device current rating and efficiency in an industry standard common footprint 4-mm x 5-mm package.

Product details

VDS (V) 20 Power loss (W) 2.3 Ploss current (A) 25 Configuration PowerStage ID - continuous drain current at TA=25°C (A) 50 Operating temperature range (°C) -55 to 150 Features Analog temperature output, Diode emulation mode with FCCM, Integrated current sense, Ultra-low inductance package Rating Catalog
VDS (V) 20 Power loss (W) 2.3 Ploss current (A) 25 Configuration PowerStage ID - continuous drain current at TA=25°C (A) 50 Operating temperature range (°C) -55 to 150 Features Analog temperature output, Diode emulation mode with FCCM, Integrated current sense, Ultra-low inductance package Rating Catalog
VSON-CLIP (DMH) 18 20 mm² 5 x 4
  • 50-A Continuous Operating Current Capability
  • Over 93.5% System Efficiency at 25 A
  • High-Frequency Operation (up to 1.25 MHz)
  • Diode Emulation Function
  • Temperature Compensated Bi-Directional Current Sense
  • Analog Temperature Output
  • Fault Monitoring
  • 3.3-V and 5-V PWM Signal Compatible
  • Tri-State PWM Input
  • Integrated Bootstrap Switch
  • Optimized Dead Time for Shoot-Through Protection
  • High-Density VSON 4-mm × 5-mm Footprint
  • Ultra-Low-Inductance Package
  • System Optimized PCB Footprint
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free
  • 50-A Continuous Operating Current Capability
  • Over 93.5% System Efficiency at 25 A
  • High-Frequency Operation (up to 1.25 MHz)
  • Diode Emulation Function
  • Temperature Compensated Bi-Directional Current Sense
  • Analog Temperature Output
  • Fault Monitoring
  • 3.3-V and 5-V PWM Signal Compatible
  • Tri-State PWM Input
  • Integrated Bootstrap Switch
  • Optimized Dead Time for Shoot-Through Protection
  • High-Density VSON 4-mm × 5-mm Footprint
  • Ultra-Low-Inductance Package
  • System Optimized PCB Footprint
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free

The CSD95495QVM NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 4-mm × 5-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.


The CSD95495QVM NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 4-mm × 5-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.


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Technical documentation

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* Data sheet CSD95495QVM Synchronous Buck NexFET Smart Power Stage datasheet (Rev. A) PDF | HTML 11 Jan 2018

Design & development

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Simulation model

CSD95495QVM PSpice Transient Model

SLPM297.ZIP (41 KB) - PSpice Model
Package Pins Download
VSON-CLIP (DMH) 18 View options

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