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Product details

Parameters

Step-up DC/DC converter 1 LDO 2 Rating Catalog Shutdown current (Typ) (uA) 10 Configurability Factory programmable open-in-new Find other Multi-channel ICs (PMIC)

Package | Pins | Size

DSBGA (YFF) 49 0 mm² 3.194 x 2.998 open-in-new Find other Multi-channel ICs (PMIC)

Features

  • High-Efficiency RGB LED Driver With Buck-Boost DC-to-DC Converter and Integrated MOSFETS
  • Six Low-Impedance (<100 mΩ) MOSFET Switches for Channel Selection
  • Independent, 10-Bit Current Control per Channel
  • DMD Regulators
    • Requires Only a Single Inductor
    • VOFS: 8.5 V
    • VBIAS: 16 V
    • VRST: –10 V
  • Reset Generation and Power Supply Sequencing
  • RGB LED Strobe Decoder Supports:
    • Common-Anode RGBs
    • Cathode-Cathode-Anode RGBs
  • 33-MHz Serial Peripheral Interface (SPI)
  • Multiplexer for Measuring Analog Signals
    • Battery Voltage
    • LED Voltage, LED Current
    • Light Sensor (for White Point Correction)
    • External Temperature Sensor
  • Monitoring and Protection Circuits
    • Hot Die Warning and Thermal Shutdown
    • Low-Battery and Undervoltage Lockout
    • Overcurrent and Undervoltage Protection
  • 49-Ball 0.4-mm Pitch, DSBGA Package

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Description

DLPA1000 is a dedicated PMIC / RGB LED driver for the DLP2000 Digital Micromirror Devices (DMD) when used with a DLPC2607 digital controller. For reliable operation of these chipsets, it is mandatory to use the DLPA1000.

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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 11
Type Title Date
* Datasheet DLPA1000 Power Management and LED Driver IC datasheet (Rev. A) May 30, 2017
Application note DLP System Design: Brightness Requirements and Tradeoffs (Rev. B) Nov. 13, 2019
Application note Getting Started with TI DLP® Display Technology (Rev. D) Nov. 13, 2019
White paper Smart speaker fundamentals: Weighing the many design trade-offs Feb. 25, 2019
White paper TI DLP® Pico™ Technology for smart home applications (Rev. B) Feb. 08, 2019
White paper 智慧型喇叭基本說明: 衡量各種設計優缺點 Feb. 08, 2019
White paper 스마트 스피커 기본 사항: 설계 장단점 따져 보기 Feb. 08, 2019
User guide TI DLP® LightCrafter™ Display 2000 EVM User's Guide (Rev. C) Oct. 11, 2017
Application note DLP Technology for Near Eye Display (NED) (Rev. A) Aug. 04, 2017
Technical articles Visualize new possibilities for digital signage Jul. 14, 2017
Application note DLP Pico Discrete LED driver design guide & LM3434 Application Note (Rev. A) Mar. 15, 2016

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
99
Description

The DLP® LightCrafter Display 2000 Evaluation Module (EVM) is the most affordable, compact, plug-and-play DLP display EVM for many ultra-mobile, ultra-portable display applications like mobile projectors, smart home displays, AR glasses, appliances, and robotics. This EVM features the DLP2000 (nHD (...)

Features
  • Most affordable way for developers to evaluate high-performing DLP display technology
  • Plug and play DLP nHD optical engine that supports up to 30 lumens
  • I2C and 8/16/24-bit parallel RGB video interfaces to support virtually any low cost host processor
  • Compact form factor
  • BeagleBone Black compatibility (...)

Software development

FIRMWARE Download
DLP® Pico™ Firmware Selector
DLP-PICO-FW-SEL — Firmware selector for various DLPC34xx controllers and configurations.

Reference designs

REFERENCE DESIGNS Download
Ultra-Mobile, Low Power nHD Display Reference Design with TI DLP® Technology for Low-Cost Processors
TIDA-01473 — This display reference design is created for a wide array of ultra-mobile and ultra-portable display applications in consumer, wearables, industrial, medical, and Internet of Things (IoT) markets. The design includes the DLP2000 chipset comprising of DLP2000 .2 nHD DMD, DLPC2607 display controller (...)
document-generic Schematic

CAD/CAE symbols

Package Pins Download
DSBGA (YFF) 49 View options

Ordering & quality

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  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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