Packaging information
| Package | Pins SOIC (DW) | 16 |
| Operating temperature range (°C) -55 to 125 |
| Package qty | Carrier 2,000 | LARGE T&R |
Features for the ISO7820
- Signaling Rate: Up to 100Mbps
- Wide Supply Range: 2.25V to 5.5V
- 2.25V to 5.5V Level Translation
- Wide Temperature Range: –55°C to 125°C
- Low Power Consumption, Typical 1.7mA per Channel at 1Mbps
- Low Propagation Delay: 11ns Typical (5V Supplies)
- Industry leading CMTI(Min): ±100kV/µs
- Robust Electromagnetic Compatibility (EMC)
- System-Level ESD, EFT, and Surge Immunity
- Low Emissions
- Isolation Barrier Life: > 25 Years
- SOIC-16 Wide Body (DW) and Extra-Wide Body (DWW) Package Options
- Safety-related certifications:
- DIN EN IEC 60747-17 (VDE 0884-17)
- UL 1577 component recognition program
- IEC 61010-1, IEC 62368-1, IEC 60601-1, and GB 4943.1 certifications
Description for the ISO7820
The ISO7820 is a high-performance, dual-channel digital isolator with 8000VPK isolation voltage. This device has reinforced isolation certifications according to VDE, CSA, CQC, and TUV. The isolator provides high electromagnetic immunity and low emissions at low power consumption, while isolating CMOS or LVCMOS digital I/Os. Each isolation channel has a logic input and output buffer separated by silicon dioxide (SiO2) insulation barrier. ISO7820 has two forward channels and no reverse-direction channel. If the input power or signal is lost, default output is ’high’ for the ISO7820 and ’low’ for the ISO7820F device. Used in conjunction with isolated power supplies, this device prevents noise currents on a data bus or other circuits from entering the local ground and interfering with or damaging sensitive circuitry. Through remarkable chip design and layout techniques, electromagnetic compatibility of ISO7820 has been significantly enhanced to ease system-level ESD, EFT, Surge and Emissions compliance. ISO7820 is available in 16-pin SOIC wide-body (DW) and extra-wide body (DWW) packages. The DWW package option comes with enable pins which can be used to put the respective outputs in high impedance for multi-controller driving applications and to reduce power consumption.