LMG3411R050

ACTIVE

600-V 50mΩ GaN with integrated driver and cycle-by-cycle overcurrent protection

Product details

VDS (max) (V) 600 RDS(on) (mΩ) 50 ID (max) (A) 12 Features Bottom-side cooled, Cycle-by-cycle overcurrent protection, Overtemperature protection Rating Catalog Operating temperature range (°C) -40 to 150
VDS (max) (V) 600 RDS(on) (mΩ) 50 ID (max) (A) 12 Features Bottom-side cooled, Cycle-by-cycle overcurrent protection, Overtemperature protection Rating Catalog Operating temperature range (°C) -40 to 150
VQFN (RWH) 32 64 mm² 8 x 8
  • TI GaN FET reliability qualified with in-application hard-switching accelerated stress profiles
  • Enables high density power conversion designs
    • Superior system performance over cascode or stand-alone GaN FETs
    • Low inductance 8 mm x 8 mm QFN package for ease of design, and layout
    • Adjustable drive strength for switching performance and EMI control
    • Digital fault status output signal
    • Only +12 V unregulated supply needed
  • Integrated gate driver
    • Zero common source inductance
    • 20 ns Propagation delay for MHz operation
    • Trimmed gate bias voltage to compensate for threshold variations ensures reliable switching
    • 25 to 100V/ns User adjustable slew rate
  • Robust protection
    • Requires no external protection components
    • Overcurrent protection with less than 100 ns response
    • Greater than 150 V/ns Slew rate immunity
    • Transient overvoltage immunity
    • Overtemperature protection
    • Under voltage lock out (UVLO) Protection on all supply rails
  • Robust protection
    • LMG3410R050: Latched overcurrent protection
    • LMG3411R050: Cycle-by-cycle overcurrent protection
    • TI GaN FET reliability qualified with in-application hard-switching accelerated stress profiles
    • Enables high density power conversion designs
      • Superior system performance over cascode or stand-alone GaN FETs
      • Low inductance 8 mm x 8 mm QFN package for ease of design, and layout
      • Adjustable drive strength for switching performance and EMI control
      • Digital fault status output signal
      • Only +12 V unregulated supply needed
    • Integrated gate driver
      • Zero common source inductance
      • 20 ns Propagation delay for MHz operation
      • Trimmed gate bias voltage to compensate for threshold variations ensures reliable switching
      • 25 to 100V/ns User adjustable slew rate
    • Robust protection
      • Requires no external protection components
      • Overcurrent protection with less than 100 ns response
      • Greater than 150 V/ns Slew rate immunity
      • Transient overvoltage immunity
      • Overtemperature protection
      • Under voltage lock out (UVLO) Protection on all supply rails
    • Robust protection
      • LMG3410R050: Latched overcurrent protection
      • LMG3411R050: Cycle-by-cycle overcurrent protection

      The LMG341xR050 GaN power stage with integrated driver and protection enables designers to achieve new levels of power density and efficiency in power electronics systems. The LMG341x’s inherent advantages over silicon MOSFETs include ultra-low input and output capacitance, zero reverse recovery to reduce switching losses by as much as 80%, and low switch node ringing to reduce EMI. These advantages enable dense and efficient topologies like the totem-pole PFC.

      The LMG341xR050 provides a smart alternative to traditional cascode GaN and standalone GaN FETs by integrating a unique set of features to simplify design, maximize reliability and optimize the performance of any power supply. Integrated gate drive enables 100 V/ns switching with near zero Vds ringing, less than 100 ns current limiting response self-protects against unintended shoot-through events, overtemperature shutdown prevents thermal runaway, and system interface signals provide self-monitoring capability.

      The LMG341xR050 GaN power stage with integrated driver and protection enables designers to achieve new levels of power density and efficiency in power electronics systems. The LMG341x’s inherent advantages over silicon MOSFETs include ultra-low input and output capacitance, zero reverse recovery to reduce switching losses by as much as 80%, and low switch node ringing to reduce EMI. These advantages enable dense and efficient topologies like the totem-pole PFC.

      The LMG341xR050 provides a smart alternative to traditional cascode GaN and standalone GaN FETs by integrating a unique set of features to simplify design, maximize reliability and optimize the performance of any power supply. Integrated gate drive enables 100 V/ns switching with near zero Vds ringing, less than 100 ns current limiting response self-protects against unintended shoot-through events, overtemperature shutdown prevents thermal runaway, and system interface signals provide self-monitoring capability.

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      Design & development

      For additional terms or required resources, click any title below to view the detail page where available.

      Evaluation board

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      User guide: PDF
      Not available on TI.com
      Daughter card

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      User guide: PDF
      Not available on TI.com
      Daughter card

      LMG3411EVM-018 — LMG3411R050 600-V 50mΩ GaN with cycle-by-cycle overcurrent protection half-bridge daughter card

      LMG3411EVM-018 configures two LMG3411R050 GaN FETs in a half bridge with cycle by cycle over current protection function and all the necessary auxiliary peripheral circuitry.  This EVM is designed to work in conjunction with larger systems.
      User guide: PDF
      Not available on TI.com
      Calculation tool

      LMGXX-GAN-LLC-CALC GaN LLC resonant converter device loss calculator

      Device Loss Calculator can be used to evaluate different devices for different topologies of the LLC Resonant Converter
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      Supported products & hardware

      Supported products & hardware

      Products
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      Supported products & hardware

      Supported products & hardware

      Products
      Gallium nitride (GaN) ICs
      LMG3410R050 600-V 50-mΩ GaN with integrated driver and protection LMG3410R070 600-V 70mΩ GaN with integrated driver and protection LMG3410R150 600-V 150-mΩ GaN with integrated driver and overcurrent protection LMG3411R050 600-V 50mΩ GaN with integrated driver and cycle-by-cycle overcurrent protection LMG3411R070 600-V 70-mΩ GaN with integrated driver and cycle-by-cycle overcurrent protection LMG3411R150 600-V 150-mΩ GaN with integrated driver and cycle-by-cycle overcurrent protection LMG3422R030 600-V 30-mΩ GaN FET with integrated driver, protection and temperature reporting LMG3522R030 650-V 30-mΩ GaN FET with integrated driver, protection and temperature reporting LMG3522R030-Q1 Automotive 650-V 30-mΩ GaN FET with integrated driver, protection and temperature reporting LMG3526R030 650-V 30-mΩ GaN FET with integrated driver, protection and zero-voltage detection
      Calculation tool

      SNOR030 GaN CCM Totem Pole PFC Power Loss Calculation Excel Sheet

      Supported products & hardware

      Supported products & hardware

      Products
      Gallium nitride (GaN) ICs
      LMG3410R050 600-V 50-mΩ GaN with integrated driver and protection LMG3410R070 600-V 70mΩ GaN with integrated driver and protection LMG3410R150 600-V 150-mΩ GaN with integrated driver and overcurrent protection LMG3411R050 600-V 50mΩ GaN with integrated driver and cycle-by-cycle overcurrent protection LMG3411R070 600-V 70-mΩ GaN with integrated driver and cycle-by-cycle overcurrent protection LMG3411R150 600-V 150-mΩ GaN with integrated driver and cycle-by-cycle overcurrent protection LMG3422R030 600-V 30-mΩ GaN FET with integrated driver, protection and temperature reporting LMG3422R050 600-V 50-mΩ GaN FET with integrated driver, protection and temperature reporting LMG3522R030 650-V 30-mΩ GaN FET with integrated driver, protection and temperature reporting LMG3522R030-Q1 Automotive 650-V 30-mΩ GaN FET with integrated driver, protection and temperature reporting LMG3526R030 650-V 30-mΩ GaN FET with integrated driver, protection and zero-voltage detection
      Simulation tool

      PSPICE-FOR-TI — PSpice® for TI design and simulation tool

      PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
      Reference designs

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      This high-frequency resonant converter reference design regulates a 12-V output from a 380-V to 400-V input voltage range using a resonant tank with 500 kHz resonant frequency. A peak efficiency of 96.0% (bias supply included) is achieved with this design using our high-voltage GaN device along (...)
      Test report: PDF
      Schematic: PDF
      Package Pins Download
      VQFN (RWH) 32 View options

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