1-pA on-state leakage current, 36-V, 8:1, 1-channel precision analog multiplexer
Product details
Parameters
Package | Pins | Size
Features
- Low On-Capacitance
- MUX36S08: 9.4 pF
- MUX36D04: 6.7 pF
- Low Input Leakage: 1 pA
- Low Charge Injection: 0.3 pC
- Rail-to-Rail Operation
- Wide Supply Range: ±5 V to ±18 V, 10 V to 36 V
- Low On-Resistance: 125 Ω
- Transition Time: 92 ns
- Break-Before-Make Switching Action
- EN Pin Connectable to VDD
- Logic Levels: 2 V to VDD
- Low Supply Current: 45 µA
- ESD Protection HBM: 2000 V
- Industry-Standard TSSOP and smaller WQFN Package
- For Other Configurations, Refer to:
- TMUX6111/ 12/ 13 (4 ch. SPST)
- TMUX6121/ 22/ 23 (2 ch. SPST)
- TMUX6119 (1 ch. SPDT)
- TMUX6136 (2 ch. SPDT)
- TMUX6104 (1 ch. 4:1)
All trademarks are the property of their respective owners.
Description
The MUX36S08 and MUX36D04 (MUX36xxx) are modern complementary metal-oxide semiconductor (CMOS) analog multiplexers (muxes). The MUX36S08 offers 8:1 single-ended channels, whereas the MUX36D04 offers differential 4:1 or dual 4:1 single-ended channels. The MUX36S08 and MUX36D04 work equally well with either dual supplies (±5 V to ±18 V) or a single supply (10 V to 36 V). They also perform well with symmetric supplies (such as VDD = 12 V, VSS = –12 V), and unsymmetric supplies (such as VDD = 12 V,
VSS = –5 V). All digital inputs have TTL-logic compatible thresholds, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range.
The MUX36S08 and MUX36D04 have very low on and off leakage currents, allowing these multiplexers to switch signals from high input impedance sources with minimal error. A low supply current of 45 µA enables use in portable applications.
Same functionality and pinout but is not an equivalent to the compared device:
Same functionality but is not pin-for-pin or parametrically equivalent to the compared device:
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | MUX36xxx 36-V, low-capacitance, low-leakage-current, precision, analog multiplexers datasheet (Rev. D) | Feb. 25, 2019 |
Application note | Selecting the Right Texas Instruments Signal Switch (Rev. B) | Apr. 02, 2020 | |
Application note | Multiplexers and Signal Switches Glossary | Mar. 06, 2020 | |
Application note | Improve Stability Issues with Low Con Multiplexers (Rev. A) | Dec. 10, 2018 | |
Application note | System Level Protection for High Voltage Analog Multiplexers | Jan. 03, 2017 | |
Technical article | Multiplexers: not so simple | Nov. 18, 2016 | |
User guide | MUX36S08EVM User's Guide (Rev. A) | Mar. 18, 2016 | |
Technical article | Does a low-leakage multiplexer really matter in a high-impedance PLC system? | Feb. 19, 2016 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The MUX36S08EVM-PDK evaluation module (EVM) is a platform for evaluating the performance of the MUX36S08 8-channel single-ended analog multiplexer. The evaluation kit brings out every pin of the MUX36S08 with different connectors for ease of evaluation.
Features
- Compatible with industry standard TSSOP package footprint
- Multiple connectors on input pins for ease of evaluation
- Layout as per the reference layout in the MUX36S08 datasheet
- Cross-talk and off-isolation can be tested using setup shown in the MUX36S08 datasheet
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Design tools & simulation
Reference designs
Design files
-
download TIDA-01333 BOM.pdf (77KB) -
download TIDA-01333 Assembly Drawing.pdf (712KB) -
download TIDA-01333 PCB.pdf (3833KB) -
download TIDA-01333 Altium.zip (2244KB) -
download TIDA-01333 Gerber.zip (623KB)
Design files
-
download TIPD151 Gerber and PADS.zip (476KB) -
download TIPD151 BOM (Rev. B).pdf (120KB)
Design files
-
download TIDA-00764 BOM.pdf (77KB) -
download TIDA-00764 Assembly Drawing .pdf (690KB) -
download TIDA-00764 PCB.pdf (3865KB) -
download TIDA-00764 CAD Files.zip (2326KB) -
download TIDA-00764 Gerber.zip (601KB)
Design files
-
download TIDA-00760 BOM.pdf (63KB) -
download TIDA-00760 Assembly Drawing.pdf (257KB) -
download TIDA-00760 PCB.pdf (2472KB) -
download TIDA-00760 PCB 3D Prints.pdf (2117KB) -
download TIDA-00760 CAD Files.zip (1025KB) -
download TIDA-00760 Gerber.zip (439KB)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
TSSOP (PW) | 16 | View options |
WQFN (RRJ) | 16 | View options |
WQFN (RUM) | 16 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
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