OMAP3525-HIREL OMAP3525-HiRel Applications Processor | TI.com

OMAP3525-HIREL (ACTIVE) OMAP3525-HiRel Applications Processor

 

Description

OMAP3525 and OMAP3530 high-performance, applications processors are based on the enhanced OMAP™ 3 architecture.

The OMAP™ 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:

  • Streaming video
  • 3D mobile gaming
  • Video conferencing
  • High-resolution still image

The device supports high-level operating systems (OSs), such as:

  • Linux
  • Windows CE

This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products.

The following subsystems are part of the device:

  • Microprocessor unit (MPU) subsystem based on the ARM Cortex™-A8 microprocessor
  • IVA2.2 subsystem with a C64x+ digital signal processor (DSP) core
  • POWERVR SGX™ subsystem for 3D graphics acceleration to support display and gaming effects (3530 only)
  • Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensors
  • Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC/PAL video out.
  • Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals

The device also offers:

  • A comprehensive power and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex&trade adaptative voltage control. This power management technique for automatic control of the operating voltage of a module reduces the active power consumption.
  • Memory stacking feature using the package-on-package (POP) implementation (CBB and CBC packages only)

OMAP25 and OMAP3530 devices are available in a 515-pin s-PBGA package (CBB suffix), 515-pin s-PBGA package (CBC suffix), and a 423-pin s-PBGA package (CUS suffix). Some features of the CBB and CBC packages are not available in the CUS package.

Table 1-1 lists the differences between the CBB, CBC, and CUS packages.

Features

  • OMAP325 and OMAP3530 Applications Processor:
    • OMAP™ 3 Architecture
    • MPU Subsystem
      • Up to 600-MHz ARM Cortex™-A8 Core
      • NEON™ SIMD Coprocessor
    • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 520-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • POWERVR SGX™ Graphics Accelerator (OMAP3530 Device Only)
      • Tile Based Architecture Delivering up to 10 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating
        Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
    • Fully Software-Compatible With C64x and C64x and ARM9™
    • Commercial and Extended Temperature Grades
  • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
    • Eight Highly Independent Functional Units
      • +Six ALUs (32-/40-Bit), Each Supports Single 32-Bit, Dual 16-Bit,
        or Quad 8-Bit Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per
        Clock Cycle or Eight 8 x 8-Bit Multiplies (16-Bit Results) per Clock Cycle
    • Load-Store Architecture With Non-Aligned Support
    • 64 32-Bit General-Purpose Registers
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Additional C64x+™ Enhancements
      • Protected Mode Operation
      • Exceptions Support for Error Detection and Program Redirection
      • Hardware Support for Modulo Loop Operation
  • C64x+ L1/L2 Memory Architecture
    • 32K-Byte L1P Program RAM/Cache (Direct Mapped)
    • 80K-Byte L1D Data RAM/Cache (2-Way Set-Associative)
    • 64K-Byte L2 Unified Mapped RAM/Cache (4-Way Set-Associative)
    • 32K-Byte L2 Shared SRAM and 16K-Byte L2 ROM
  • C64x+ Instruction Set Features
    • Byte-Addressable (8-/16-/32-/64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation. Bit-Counting
    • Compact 16-Bit Instructions
    • Additional Instructions to Support Complex Multiplies
  • ARM Cortex™-A8 Core
    • ARMv7 Architecture
      • Trust Zone®
      • Thumb®-2
      • MMU Enhancements
    • In-Order, Dual-Issue, Superscalar Microprocessor Core
    • NEON™ Multimedia Architecture
    • Over 2x Performance of ARMv6 SIMD
    • Supports Both Integer and Floating Point SIMD
    • Jazelle® RCT Execution Environment Architecture
    • Dynamic Branch Prediction with Branch Target Address Cache, Global History Buffer,
      and 8-Entry Return Stack
    • Embedded Trace Macrocell (ETM) Support for Non-Invasive Debug
  • ARM Cortex™-A8 Memory Architecture:
    • 16K-Byte Instruction Cache (4-Way Set-Associative)
    • 16K-Byte Data Cache (4-Way Set-Associative)
    • 256K-Byte L2 Cache
  • 112K-Byte ROM
  • 64K-Byte Shared SRAM
  • Endianess:
    • ARM Instructions - Little Endian
    • ARM Data – Configurable
    • DSP Instruction/Data - Little Endian
  • External Memory Interfaces:
    • SDRAM Controller (SDRC)
      • 16, 32-bit Memory Controller With 1G-Byte Total Address Space
      • Interfaces to Low-Power Double Data Rate (LPDDR) SDRAM
      • SDRAM Memory Scheduler (SMS) and Rotation Engine
    • General Purpose Memory Controller (GPMC)
      • 16-bit Wide Multiplexed Address/Data Bus
      • Up to 8 Chip Select Pins With 128M-Byte Address Space per Chip Select Pin
      • Glueless Interface to NOR Flash, NAND Flash (With ECC Hamming
        Code Calculation), SRAM and Pseudo-SRAM
      • Flexible Asynchronous Protocol Control for Interface to Custom Logic
        (FPGA, CPLD, ASICs, etc.)
      • Nonmultiplexed Address/Data Mode (Limited 2K-Byte Address Space)
    • System Direct Memory Access (sDMA) Controller (32 Logical Channels
      With Configurable Priority)
    • Camera Image Signal Processing (ISP)
      • CCD and CMOS Imager Interface
      • Memory Data Input
      • RAW Data Interface
      • BT.601/BT.656 Digital YCbCr 4:2:2 (8-/10-Bit) Interface
      • A-Law Compression and Decompression
      • Preview Engine for Real-Time Image Processing
      • Glueless Interface to Common Video Decoders
      • Histogram Module/Auto-Exposure, Auto-White Balance, and Auto-Focus Engine
      • Resize Engine
        • Resize Images From 1/4x to 4x
        • Separate Horizontal/Vertical Control
    • Display Subsystem
      • Parallel Digital Output
        • Up to 24-Bit RGB
        • HD Maximum Resolution
        • Supports Up to 2 LCD Panels
        • Support for Remote Frame Buffer Interface (RFBI) LCD Panels
      • 2 10-Bit Digital-to-Analog Converters (DACs) Supporting:
        • Composite NTSC/PAL Video
        • Luma/Chroma Separate Video (S-Video)
      • Rotation 90-, 180-, and 270-degrees
      • Resize Images From 1/4x to 8x
      • Color Space Converter
      • 8-bit Alpha Blending
    • Serial Communication
      • 5 Multichannel Buffered Serial Ports (McBSPs)
        • 512 Byte Transmit/Receive Buffer (McBSP1/3/4/5)
        • 5K-Byte Transmit/Receive Buffer (McBSP2)
        • SIDETONE Core Support (McBSP2 and 3 Only) For Filter, Gain, and Mix Operations
        • Direct Interface to I2S and PCM Device and TDM Buses
        • 128 Channel Transmit/Receive Mode
      • Four Master/Slave Multichannel Serial Port Interface (McSPI) Ports
      • High-Speed/Full-Speed/Low-Speed USB OTG Subsystem (12-/8-Pin ULPI Interface)
      • High-Speed/Full-Speed/Low-Speed Multiport USB Host Subsystem
        • 12-/8-Pin ULPI Interface or 6-/4-/3-Pin Serial Interface
        • Supports Transceiverless Link Logic (TLL)
      • One HDQ/1-Wire Interface
      • Three UARTs (One with Infrared Data Association [IrDA] and Consumer Infrared [CIR] Modes)
      • Three Master/Slave High-Speed Inter-Integrated Circuit (I2C) Controllers
    • Removable Media Interfaces:
      • Three Multimedia Card (MMC)/ Secure Digital (SD) With Secure Data I/O (SDIO)
    • Comprehensive Power, Reset, and Clock Management
      • SmartReflex™ Technology
      • Dynamic Voltage and Frequency Scaling (DVFS)
    • Test Interfaces
      • IEEE-1149.1 (JTAG) Boundary-Scan Compatible
      • Embedded Trace Macro Interface (ETM)
      • Serial Data Transport Interface (SDTI)
    • 12 32-bit General Purpose Timers
    • 2 32-bit Watchdog Timers
    • 1 32-bit 32-kHz Sync Timer
    • Up to 188 General-Purpose I/O (GPIO) Pins (Multiplexed With Other Device Functions)
    • 6 5-nm CMOS Technology
    • Package-On-Package (POP) Implementation for Memory Stacking (Not Available in CUS Package)
    • Discrete Memory Interface (Not Available in CBC Package)
    • Packages:
      • 515-pin s-PBGA package (CBB Suffix), .5mm Ball Pitch (Top), .4mm Ball Pitch (Bottom)
      • 515-pin s-PBGA package (CBC Suffix), .65mm Ball Pitch (Top), .5mm Ball Pitch (Bottom)
      • 423-pin s-PBGA package (CUS Suffix), .65mm Ball Pitch
    • 1.8-V I/O and 3.0-V (MMC1 only),
      0.985-V to 1.35-V Adaptive Processor Core Voltage
      0.985-V to 1.25-V Adaptive Core Logic Voltage
      Note: thee are default Operating Performance Point (OPP) voltages and
      could be optimized to lower values using SmartReflex™ AVS.
    • Applications:
      • Portable Navigation Devices
      • Portable Media Player
      • Advanced Portable Consumer Electronics
      • Digital TV
      • Digital Video Camera
      • Portable Data Collection
      • Point-of-Sale Devices
      • Gaming
      • Web Tablet
      • Smart White Goods
      • Smart Home Controllers
      • Ultra Mobile Devices

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.

Parametrics

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Part number Order Approx. price (US$) Operating systems Arm MHz (Max.) Arm CPU DSP Video port (configurable) USB DRAM SPI I2C UART (SCI) On-chip L2 cache/RAM Operating temperature range (C) Rating Display
OMAP3525-HIREL Order now 92.73 | 100u     Linux
Windows Embedded CE    
600     1 Arm Cortex-A8     1 C64x     1 Dedicated Output
1 Dedicated Input    
2     LPDDR     4     3     3     256 KB (ARM Cortex-A8)
96 KB (DSP)    
-40 to 105     HiRel Enhanced Product      
OMAP3503-HIREL Samples not available 47.60 | 100u     Neutrino
Integrity
Tornado
Windows Embedded CE
Linux
VxWorks    
720     1 Arm Cortex-A8       1 Input
1 Output
1 Dedicated Input    
2     LPDDR     4     3     3     256 KB (ARM Cortex-A8)     0 to 90       DSS    
OMAP3530-HIREL Samples not available 118.78 | 100u     Linux
Windows Embedded CE    
600     1 Arm Cortex-A8     1 C64x     1 Dedicated Output
1 Dedicated Input    
2     LPDDR     4     3     3     256 KB (ARM Cortex-A8)
96 KB (DSP)    
-40 to 105     HiRel Enhanced Product