6 A, 12-V Input Non-Isolated DDR/QDR Memory Bus Termination Module
Same functionality but is not pin-for-pin or parametrically equivalent to the compared device:
PTH12050Y
Product details
Parameters
Package | Pins | Size
Features
- VTT Bus Termination Output (Output Tracks the System VREF)
- 6 A Output Current (8 A Peak)
- 3.3-V, 5-V or 12-V Input Voltage
- DDR and QDR Compatible
- On/Off Inhibit (for VTT Standby)
- Under-Voltage Lockout
- Operating Temp: –40 to +85°C
- Efficiencies up to 88 %
- Output Overcurrent Protection (Non-Latching, Auto-Reset)
- 50 W/in³ Power Density
- Safety Agency Approvals: UL/cUL60950, EN60950, VDE
- Point-of-Load Alliance (POLA™) Compatible
POLA is a trademark of Texas Instruments.
Description
The PTHxx050Y are a series of ready-to-use switching regulator modules from Texas Instruments designed specifically for bus termination in DDR and QDR memory applications. Operating from either a 3.3-V, 5-V or 12-V input, the modules generate a VTT output that will source or sink up to 6 A of current (8 A transient) to accurately track their VREF input. VTT is the required bus termination supply voltage, and VREF is the reference voltage for the memory and chipset bus receiver comparators. VREF is usually set to half the VDDQ power supply voltage.
Both the PTHxx050Y series employs an actively switched synchronous rectifier output to provide state-of-the-art step-down switching conversion. The products are small in size (0.87 in × 0.5 in), and are an ideal choice where space, performance, and high efficiency are desired, along with the convenience of a ready-to-use module.
Operating features include an on/off inhibit and output over-current protection (source mode only). The on/off inhibit feature allows the VTT bus to be turned off to save power in a standby mode of operation.
Package options include both through-hole and surface mount configurations.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | 6-A Non-Isolated DDR/QDR Bus Termination Modules datasheet (Rev. A) | Apr. 28, 2005 |
Selection guide | Power Management Guide 2018 (Rev. R) | Jun. 25, 2018 | |
Application note | High-Temperatures Soldering Requirements for Plug-in Power, Surface-Mount Pdts (Rev. A) | Aug. 13, 2009 | |
Application note | Input and Output Capacitor Selection | Sep. 19, 2005 | |
Application note | New power modules improve surface-mount manufacturability | Jul. 14, 2005 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Design tools & simulation
Features
- Leverages Cadence PSpice Technology
- Preinstalled library with a suite of digital models to enable worst-case timing analysis
- Dynamic updates ensure you have access to most current device models
- Optimized for simulation speed without loss of accuracy
- Supports simultaneous analysis of multiple products
- (...)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
Surface Mount Module (EUV) | 6 | View options |
Through-Hole Module (EUU) | 6 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
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