Product details

Technology family F Function Digital Multiplexer Configuration 4:1 Number of channels 2 Operating temperature range (°C) -55 to 125 Rating Military
Technology family F Function Digital Multiplexer Configuration 4:1 Number of channels 2 Operating temperature range (°C) -55 to 125 Rating Military
CDIP (J) 16 135.3552 mm² 19.56 x 6.92 CFP (W) 16 69.319 mm² 10.3 x 6.73 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • Permits Multiplexing From N Lines to One Line
  • Performs Parallel-to-Serial Conversion
  • Strobe (Enable) Line Provided for Cascading (N Lines to N Lines)
  • Package Options Include Plastic Small-Outline Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-mil DIPs

 

  • Permits Multiplexing From N Lines to One Line
  • Performs Parallel-to-Serial Conversion
  • Strobe (Enable) Line Provided for Cascading (N Lines to N Lines)
  • Package Options Include Plastic Small-Outline Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-mil DIPs

 

These data selectors/multiplexers contain inverters and drivers to supply full binary decoding data selection to the AND-OR gates. Separate strobe (G\) inputs are provided for each of the two 4-line sections.

The SN54F153 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74F153 is characterized for operation from 0°C to 70°C.

 

 

 

These data selectors/multiplexers contain inverters and drivers to supply full binary decoding data selection to the AND-OR gates. Separate strobe (G\) inputs are provided for each of the two 4-line sections.

The SN54F153 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74F153 is characterized for operation from 0°C to 70°C.

 

 

 

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 10
Type Title Date
* Data sheet Dual 1-of-4 Data Selectors/Multiplexers datasheet (Rev. A) 01 Oct 1993
* SMD SN54F153 SMD 5962-97583 21 Jun 2016
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note Designing With Logic (Rev. C) 01 Jun 1997
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Oct 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Package Pins Download
CDIP (J) 16 View options
CFP (W) 16 View options
LCCC (FK) 20 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos