SN54LS365A

ACTIVE

Military 6-ch, 4.5-V to 5.5-V bipolar buffers with 3-state outputs

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Product details

Parameters

Technology Family LS VCC (Min) (V) 4.5 VCC (Max) (V) 5.5 Channels (#) 6 IOL (Max) (mA) 24 ICC (Max) (uA) 77000 IOH (Max) (mA) -2.6 Input type Bipolar Output type 3-State Features High speed (tpd 10-50ns) Data rate (Mbps) 70 Rating Catalog, Military open-in-new Find other Non-Inverting buffer/driver

Package | Pins | Size

CDIP (J) 16 135 mm² 19.65 x 6.92 LCCC (FK) 20 79 mm² 8.89 x 8.89 open-in-new Find other Non-Inverting buffer/driver

Features

  • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
  • Choice of True or Inverting Outputs
  • Package Options Include Plastic “Small Outline" Packages, Ceramic Chip Carriers and Flat Packages, and Plastic and Ceramic DIPs
  • Dependable Texas Instruments Quality and Reliability
  • '365A, '367A, 'LS365A, 'LS367A True Outputs '366A, '368A, 'LS366A, 'LS368A Inverting Outputs

 

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Description

These Hex buffers and line drivers are designed specifically to improve both the performance and density of three-state memory address drivers, clock drivers, and bus oriented receivers and transmitters. The designer has choice of selected combinations of inverting and noninverting outputs, symmetrical G\ (active-low control) inputs.

These devices feature high fan-out, improved fan-in, and can be used to drive terminated lines down to 133 ohms.

The SN54365A thru SN54368A and SN54LS365A thru SN54LS368A are characterized for operation over the full military temperature range of -55°C to 125°C. The SN74365A thru SN74368A and SN74LS365A thru SN74LS368A are characterized for operation from 0°C to 70°C.

 

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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 11
Type Title Date
* Datasheet Hex Bus Drivers With 3-State Outputs datasheet Mar. 01, 1988
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
Application note Designing With Logic (Rev. C) Jun. 01, 1997
Application note Designing with the SN54/74LS123 (Rev. A) Mar. 01, 1997
Application note Input and Output Characteristics of Digital Integrated Circuits Oct. 01, 1996
Application note Live Insertion Oct. 01, 1996

Design & development

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CAD/CAE symbols

Package Pins Download
CDIP (J) 16 View options
LCCC (FK) 20 View options

Ordering & quality

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  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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