GUI for evaluation module (EVM)
Data sheet
SN65HVD11-HT
- Operates With a 3.3-V Supply
- Bus-Pin ESD Protection Exceeds 16-kV Human-
Body Model (HBM) - 1/8 Unit-Load Option Available (up to 256 Nodes
on Bus) - Optional Driver Output Transition Times for
Signaling Rates(1) of 1 Mbps, 10 Mbps,
and 32 Mbps - Based on ANSI TIA/EIA-485-A
- Bus-Pin Short Circuit Protection From
–7 V to 12 V - Open-Circuit, Idle-Bus, and Shorted-Bus Fail-Safe
Receiver - Glitch-Free Power-Up and Power-Down Protection
for Hot-Plugging Applications - SN75176 Footprint
- Supports Extreme Temperature Applications:
- Controlled Baselines
- One Assembly and Test Sites
- One Fabrication Sites
- Available in Extreme (–55°C/210°C)
Temperature Range(2) - Extended Product Life Cycles
- Extended Product-Change Notifications
- Product Traceability
- Texas Instruments’ High Temperature
Products Use Highly Optimized Silicon (Die)
Solutions With Design and Process
Enhancements to Maximize Performance Over
Extended Temperatures.
The SN65HVD11-HT device combines a 3-state differential line driver and differential input line receiver that operates with a single 3.3-V power supply. It is designed for balanced transmission lines and meets or exceeds ANSI TIA/EIA-485-A and ISO 8482:1993, with the exception that the thermal shutdown is removed. This differential bus transceiver is a monolithic integrated circuit designed for bidirectional data communication on multipoint bus-transmission lines. The driver and receiver have active-high and active-low enables, respectively, that can be externally connected together to function as direction control.
The driver differential outputs and receiver differential inputs connect internally to form a differential input/ output (I/O) bus port that is designed to offer minimum loading to the bus when the driver is disabled or VCC = 0.
Technical documentation
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View all 5 | Type | Title | Date | ||
|---|---|---|---|---|
| * | Data sheet | SN65HVD11-HT 3.3-V RS-485 Transceiver datasheet (Rev. F) | PDF | HTML | 30 Nov 2015 |
| * | Radiation & reliability report | SN65HVD11HKJ_HKQ Reliability Reports | 20 Sep 2012 | |
| * | Radiation & reliability report | SN65HVD11JD Reliability Report | 20 Sep 2012 | |
| * | Radiation & reliability report | SN65HVD11HD Reliability Report (Rev. A) | 17 Aug 2012 | |
| EVM User's guide | Harsh Environment Acquisition Terminal (H.E.A.T.) System Evaluation Kit (Rev. D) | 24 Jul 2015 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.
Simulation tool
PSPICE-FOR-TI — PSpice® for TI design and simulation tool
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User guide: PDF
Reference designs
TIDA-00002 — Harsh Environment Acquisition Terminal (HEAT) EVM Platform for High Temperature Applications
The HEATEVM is a MCM intended to provide a high temperature platform for signal conditioning and processor evaluation. The module consists of a complete chain of components designed to withstand extreme operating temperatures up to 200 °C. The PCB is made with polymide material also suited for (...)
| Package | Pins | Download |
|---|---|---|
| CDIP_SB (JDJ) | 8 | View options |
| CFP (HKJ) | 8 | View options |
| CFP (HKQ) | 8 | View options |
| DIESALE (KGD) | — | |
| SOIC (D) | 8 | View options |
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