SN74ABT162500

ACTIVE

18-bit universal bus transceivers with 3-state outputs

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18-bit universal bus transceivers with 3-state outputs

SN74ABT162500

ACTIVE

Product details

Parameters

Technology Family ABT VCC (Min) (V) 4.5 VCC (Max) (V) 5.5 Channels (#) 18 IOL (Max) (mA) 64 IOH (Max) (mA) -32 ICC (uA) 36000 Input type TTL-Compatible CMOS Output type Push-Pull Features Ultra high speed (tpd <5ns), Over-voltage tolerant inputs, Partial power down (Ioff), Damping resistors Rating Catalog Operating temperature range (C) -40 to 85 open-in-new Find other Universal bus transceiver (UBT)

Package | Pins | Size

SSOP (DL) 56 191 mm² 18.42 x 10.35 open-in-new Find other Universal bus transceiver (UBT)

Features

  • Members of the Texas Instruments WidebusTM Family
  • B-Port Outputs Have Equivalent 25- Series Resistors, So No External Resistors Are Required
  • State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
  • UBTTM (Universal Bus Transceiver) Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, or Clocked Mode
  • Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 5 V, TA = 25°C
  • High-Impedance State During Power Up and Power Down
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 500 mA
    Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Package Options Include Plastic Shrink Small-Outline (DL) Package and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

    Widebus, EPIC-IIB, and UBT are trademarks of Texas Instruments Incorporated.

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Description

These 18-bit universal bus transceivers combine D-type latches and D-type flip-flops to allow data flow in transparent, latched, and clocked modes. Data flow in each direction is controlled by output-enable (OEAB and OEBA\), latch-enable (LEAB and LEBA), and clock (CLKAB\ and CLKBA\) inputs.

For A-to-B data flow, the device operates in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB\ is held at a high or low logic level. If LEAB is low, the A data is stored in the latch/flip-flop on the high-to-low transition of CLKAB\. Output-enable OEAB is active high. When OEAB is high, the outputs are active. When OEAB is low, the outputs are in the high-impedance state.

Data flow for B to A is similar to that of A to B but uses OEBA\, LEBA, and CLKBA\. The output enables are complementary (OEAB is active high and OEBA\ is active low).

The B-port outputs, which are designed to source or sink up to 12 mA, include equivalent 25- series resistors to reduce overshoot and undershoot.

When VCC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1 V, OE\ should be tied to VCC through a pullup resistor and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver.

The SN54ABT162500 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT162500 is characterized for operation from -40°C to 85°C.

A-to-B data flow is shown: B-to-A flow is similar but uses OEBA\, LEBA, and CLKBA\.

Output level before the indicated steady-state input conditions were established

§ Output level before the indicated steady-state input conditions were established, provided that CLKAB\ was low before LEAB went low

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Technical documentation

= Top documentation for this product selected by TI
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Type Title Date
* Datasheet 18-Bit Universal Bus Transceivers With 3-State Outputs datasheet (Rev. E) Feb. 19, 1999
Selection guides Logic Guide (Rev. AB) Jun. 12, 2017
Application notes Implications of Slow or Floating CMOS Inputs (Rev. D) Jun. 23, 2016
Application notes Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guides LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
Application notes Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application notes Selecting the Right Level Translation Solution (Rev. A) Jun. 22, 2004
Application notes Quad Flatpack No-Lead Logic Packages (Rev. D) Feb. 16, 2004
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application notes TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
Application notes Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices May 10, 2002
Selection guides Advanced Bus Interface Logic Selection Guide Jan. 09, 2001
Application notes Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) Aug. 01, 1997
Application notes Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B) Jun. 01, 1997
Application notes Designing With Logic (Rev. C) Jun. 01, 1997
Application notes Advanced BiCMOS Technology (ABT) Logic Enables Optimal System Design (Rev. A) Mar. 01, 1997
Application notes Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A) Dec. 01, 1996
Application notes Input and Output Characteristics of Digital Integrated Circuits Oct. 01, 1996
Application notes Live Insertion Oct. 01, 1996
Application notes Understanding Advanced Bus-Interface Products Design Guide May 01, 1996

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