Packaging information
| Package | Pins SSOP (DB) | 20 |
| Operating temperature range (°C) 0 to 70 |
| Package qty | Carrier 2,000 | LARGE T&R |
Features for the SN74F244
- 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
- Package Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs
Description for the SN74F244
These octal buffers and line drivers are designed specifically to
improve both the performance and density of 3-state memory address
drivers, clock drivers, and bus-oriented receivers and transmitters.
Taken together with the ´F240 and ´F241, these devices
provide the choice of selected combinations of inverting and
noninverting outputs, symmetrical 
(active-low output-enable) inputs, and complementary OE
and inputs.
The ´F244 is organized as two 4-bit buffers/line drivers with
separate output enable ()
inputs. When is low, the
device passes data from the A inputs to the Y outputs. When is high, the outputs are in the
high-impedance state.
The SN74F244 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.
The SN54F244 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74F244 is characterized for operation from 0°C to 70°C.