SN74F244

ACTIVE

Octal Buffers/Drivers With 3-State Outputs

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Product details

Parameters

Technology Family F VCC (Min) (V) 4.5 VCC (Max) (V) 5.5 Channels (#) 8 IOL (Max) (mA) 64 ICC (Max) (uA) 90000 IOH (Max) (mA) -15 Input type Bipolar Output type 3-State Features Very high speed (tpd 5-10ns), Over-voltage tolerant inputs Data rate (Mbps) 140 Rating Catalog open-in-new Find other Non-Inverting buffer/driver

Package | Pins | Size

PDIP (N) 20 229 mm² 24.33 x 9.4 SOIC (DW) 20 132 mm² 12.8 x 10.3 SOP (NS) 20 98 mm² 12.6 x 7.8 SSOP (DB) 20 38 mm² 5.3 x 7.2 open-in-new Find other Non-Inverting buffer/driver

Features

  • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
  • Package Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs
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Description

These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Taken together with the ´F240 and ´F241, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical (active-low output-enable) inputs, and complementary OE and inputs.

The ´F244 is organized as two 4-bit buffers/line drivers with separate output enable () inputs. When is low, the device passes data from the A inputs to the Y outputs. When is high, the outputs are in the high-impedance state.

The SN74F244 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54F244 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74F244 is characterized for operation from 0°C to 70°C.

 

 

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Technical documentation

= Top documentation for this product selected by TI
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Type Title Date
* Datasheet Octal Buffers/Drivers With 3-State Outputs datasheet (Rev. A) Oct. 01, 1993
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) Aug. 01, 1997
Application note Designing With Logic (Rev. C) Jun. 01, 1997
Application note Input and Output Characteristics of Digital Integrated Circuits Oct. 01, 1996

Design & development

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Hardware development

EVALUATION BOARD Download
10
Description
This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, P, N, or DGV package in a 14 to 24 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices

Design tools & simulation

SIMULATION MODEL Download
SDFM008A.ZIP (6 KB) - IBIS Model
SIMULATION MODEL Download
SDFM024.ZIP (7 KB) - PSpice Model

CAD/CAE symbols

Package Pins Download
PDIP (N) 20 View options
SO (NS) 20 View options
SOIC (DW) 20 View options
SSOP (DB) 20 View options

Ordering & quality

Information included:
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  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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