Product details

Technology Family LVC Rating Catalog Operating temperature range (C) -40 to 125 IOL (Max) (mA) 24 IOH (Max) (mA) -24
Technology Family LVC Rating Catalog Operating temperature range (C) -40 to 125 IOL (Max) (mA) 24 IOH (Max) (mA) -24
PDIP (N) 20 229 mm² 24.33 x 9.4 SOIC (DW) 20 132 mm² 12.8 x 10.3 SOP (NS) 20 98 mm² 12.6 x 7.8 SSOP (DB) 20 38 mm² 5.3 x 7.2 TSSOP (PW) 20 29 mm² 6.5 x 4.4 TSSOP (PW) 20 29 mm² 4.4 x 6.5 TVSOP (DGV) 20 32 mm² 5 x 6.4 VQFN (RGY) 20 16 mm² 3.5 x 4.5
  • Operates From 1.65 V to 3.6 V
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 6.3 ns at 3.3 V
  • Typical VOLP (Output Ground Bounce)
    < 0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    > 2 V at VCC = 3.3 V, TA = 25°C
  • Ioff Supports Live Insertion, Partial-Power-Down
    Mode and Back Drive protection
  • Supports Mixed-Mode Signal Operation on All
    Ports (5-V Input/Output Voltage With 3.3-V VCC)
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model
    • 1000-V Charged-Device Model
  • Operates From 1.65 V to 3.6 V
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 6.3 ns at 3.3 V
  • Typical VOLP (Output Ground Bounce)
    < 0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    > 2 V at VCC = 3.3 V, TA = 25°C
  • Ioff Supports Live Insertion, Partial-Power-Down
    Mode and Back Drive protection
  • Supports Mixed-Mode Signal Operation on All
    Ports (5-V Input/Output Voltage With 3.3-V VCC)
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model
    • 1000-V Charged-Device Model

These octal bus transceivers are designed for 1.65-V to 3.6-V VCC operation. The ’LVC245A devices are designed for asynchronous communication between data buses.

These octal bus transceivers are designed for 1.65-V to 3.6-V VCC operation. The ’LVC245A devices are designed for asynchronous communication between data buses.

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Technical documentation

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Type Title Date
* Data sheet SN74LVC245A Octal Bus Transceiver With 3-State Outputs datasheet (Rev. X) PDF | HTML 25 Jan 2015
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
More literature Design Summary for WCSP Little Logic (Rev. B) 04 Nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits 06 Nov 2003
More literature Logic Cross-Reference (Rev. A) 07 Oct 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) 18 Dec 2002
Application note Texas Instruments Little Logic Application Report 01 Nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 Jun 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 May 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 May 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 27 Mar 2002
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 Dec 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note LVC Characterization Information 01 Dec 1996
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Oct 1996
Application note Live Insertion 01 Oct 1996
Design guide Low-Voltage Logic (LVC) Designer's Guide 01 Sep 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 May 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

14-24-LOGIC-EVM — Generic Logic EVM Supporting 14 through 24 Pin PW, DB, D, DW, NS, DYY, and DGV Packages

This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, DYY or DGV package in a 14 to 24 pin count.

Not available on TI.com
Evaluation board

14-24-NL-LOGIC-EVM — Generic 14 through 24 pin non-leaded package evaluation module

Flexible EVM designed to support any logic or translation device that has a BQA, BQB, RGY (14-24 pin), RSV, RJW, or RHL package.
Not available on TI.com
Simulation model

IBIS Model of SN74LVC245A (Rev. D)

SCAM006D.ZIP (41 KB) - IBIS Model
Simulation model

HSPICE MODEL OF SN74LVC245A

SCEJ191.ZIP (110 KB) - HSpice Model
Reference designs

TIDEP-01017 — Cascade imaging radar capture reference design using Jacinto™ ADAS processor

The cascade development kit has two main use cases:
  1. To use the MMWCAS-DSP-EVM as a capture card to fully evaluate the AWR2243 four-chip cascade performance by using the mmWave studio tool, please read the TIDEP-01012 design guide.
  2. To use the MMWCAS-DSP-EVM to develop radar real time SW application, (...)
Package Pins Download
PDIP (N) 20 View options
SO (NS) 20 View options
SOIC (DW) 20 View options
SSOP (DB) 20 View options
TSSOP (PW) 20 View options
TVSOP (DGV) 20 View options
VQFN (RGY) 20 View options

Ordering & quality

Information included:
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  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Support & training

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