SN74LVC573A

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Octal Transparent D-Type Latches With 3-State Outputs

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Product details

Parameters

Channels (#) 8 Technology Family LVC VCC (Min) (V) 1.65 VCC (Max) (V) 3.6 Input type Standard CMOS Output type 3-State Clock Frequency (Max) (MHz) 100 IOL (Max) (mA) 24 IOH (Max) (mA) -24 ICC (Max) (uA) 10 Features Balanced outputs, Very high speed (tpd 5-10ns), Over-voltage tolerant inputs, Partial power down (Ioff), Flow-through pinout open-in-new Find other D-type latch

Package | Pins | Size

PDIP (N) 20 229 mm² 24.33 x 9.4 SOIC (DW) 20 132 mm² 12.8 x 10.3 SOP (NS) 20 98 mm² 12.6 x 7.8 SSOP (DB) 20 38 mm² 5.3 x 7.2 TSSOP (PW) 20 42 mm² 6.5 x 6.4 TVSOP (DGV) 20 32 mm² 5 x 6.4 VQFN (RGY) 20 16 mm² 3.5 x 4.5 open-in-new Find other D-type latch

Features

  • Operate From 1.65 V to 3.6 V
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 6.9 ns at 3.3 V
  • Typical VOLP (Output Ground Bounce)
    < 0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    > 2 V at VCC = 3.3 V, TA = 25°C
  • Support Mixed-Mode Signal Operation on All Ports (5-V Input/Output Voltage With 3.3-V VCC)
  • Ioff Supports Live Insertion, Partial Power Down Mode, and Back Drive Protection
  • Latch-Up Performance Exceeds 250 mA
    Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
open-in-new Find other D-type latch

Description

The SN54LVC573A octal transparent D-type latch is designed for 2.7-V to 3.6-V VCC operation, and the SN74LVC573A octal transparent D-type latch is designed for 1.65-V to 3.6-V VCC operation. These devices feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, input/output (I/O) ports, bidirectional bus drivers, and working registers.

open-in-new Find other D-type latch
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Technical documentation

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Type Title Date
* Datasheet SNx4LVC573A Octal Transparent D-Type Latches With 3-State Outputs datasheet (Rev. S) May 30, 2013
Selection guide Little Logic Guide 2018 (Rev. G) Jul. 06, 2018
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note How to Select Little Logic (Rev. A) Jul. 26, 2016
Application note Implications of Slow or Floating CMOS Inputs (Rev. D) Jun. 23, 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
Application note Power-Up Behavior of Clocked Devices (Rev. A) Feb. 06, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
More literature Design Summary for WCSP Little Logic (Rev. B) Nov. 04, 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application note Selecting the Right Level Translation Solution (Rev. A) Jun. 22, 2004
User guide Signal Switch Data Book (Rev. A) Nov. 14, 2003
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits Nov. 06, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) Dec. 18, 2002
Application note Texas Instruments Little Logic Application Report Nov. 01, 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards Jun. 13, 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) May 22, 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices May 10, 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS Mar. 27, 2002
More literature Military Low Voltage Solutions Apr. 04, 2001
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices Dec. 01, 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) Aug. 01, 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) Jun. 01, 1997
Application note LVC Characterization Information Dec. 01, 1996
Application note Input and Output Characteristics of Digital Integrated Circuits Oct. 01, 1996
Application note Live Insertion Oct. 01, 1996
User guide Low-Voltage Logic (LVC) Designer's Guide Sep. 01, 1996
Application note Understanding Advanced Bus-Interface Products Design Guide May 01, 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
10
Description
This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, P, N, or DGV package in a 14 to 24 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices
EVALUATION BOARD Download
20
Description
Flexible EVM designed to support any logic or translation device that has a BQA, BQB, RGY (14-24 pin), RSV, RJW, or RHL package.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic and translation devices with included dual supply support
  • Board has 9 sections that can be broken apart for a smaller form factor

Design tools & simulation

SIMULATION MODEL Download
SCLM056A.ZIP (40 KB) - IBIS Model

Reference designs

REFERENCE DESIGNS Download
Multichannel RF transceiver reference design for radar and electronic warfare applications
TIDA-010132 — This reference design, an 8-channel analog front end (AFE), is demonstrated using two AFE7444 4-channel RF transceivers and a LMK04828-LMX2594 based clocking subsystem which can enable designs to scale to 16 or more channels. Each AFE channel consists of a 14-bit, 9-GSPS DAC and a 3-GSPS ADC that is (...)
document-generic Schematic

CAD/CAE symbols

Package Pins Download
BGA MICROSTAR JUNIOR (ZQN) 20 View options
PDIP (N) 20 View options
SO (NS) 20 View options
SOIC (DW) 20 View options
SSOP (DB) 20 View options
TSSOP (PW) 20 View options
TVSOP (DGV) 20 View options
VQFN (RGY) 20 View options

Ordering & quality

Information included:
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  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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