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TMP007

OBSOLETE

Infrared Thermopile Contactless Temperature Sensor with Integrated Math Engine in WCSP Package

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Data sheet

TMP007

OBSOLETE
Data sheet Order now

Product details

Local sensor accuracy (max) 1 Type Local Operating temperature range (°C) to Supply voltage (min) (V) 2.2 Interface type I2C, SMBus Supply voltage (max) (V) 5.5 Temp resolution (max) (Bits) 14 Rating Catalog
Local sensor accuracy (max) 1 Type Local Operating temperature range (°C) to Supply voltage (min) (V) 2.2 Interface type I2C, SMBus Supply voltage (max) (V) 5.5 Temp resolution (max) (Bits) 14 Rating Catalog
DSBGA (YZF) 8 3.0625 mm² 1.75 x 1.75
  • Integrated MEMS Thermopile for Noncontact Temperature Sensing
  • 14-Bit Local Temperature Sensor for Cold Junction Reference
    • ±1°C (max) from 0°C to +60°C
    • ±1.5°C (max) from –40°C to +125°C
  • Integrated Math Engine
    • Directly Read Object Temperature
    • Programmable Alerts
    • Nonvolatile Memory for Storing Calibration Coefficients
    • Transient Correction
  • Two-Wire Serial Interface Options
    • I2C and SMBus Compatible
    • Eight Programmable Addresses
  • Low Power
    • Supply: 2.5 V to 5.5 V
    • Active Current: 270 µA (typ)
    • 2-µA Shutdown (max)
  • Compact Package
    • 1.9-mm × 1.9-mm × 0.625-mm DSBGA
  • Integrated MEMS Thermopile for Noncontact Temperature Sensing
  • 14-Bit Local Temperature Sensor for Cold Junction Reference
    • ±1°C (max) from 0°C to +60°C
    • ±1.5°C (max) from –40°C to +125°C
  • Integrated Math Engine
    • Directly Read Object Temperature
    • Programmable Alerts
    • Nonvolatile Memory for Storing Calibration Coefficients
    • Transient Correction
  • Two-Wire Serial Interface Options
    • I2C and SMBus Compatible
    • Eight Programmable Addresses
  • Low Power
    • Supply: 2.5 V to 5.5 V
    • Active Current: 270 µA (typ)
    • 2-µA Shutdown (max)
  • Compact Package
    • 1.9-mm × 1.9-mm × 0.625-mm DSBGA

The TMP007 is a fully-integrated microelectro-mechanical system (MEMS) thermopile sensor that measures the temperature of an object without direct contact. The thermopile absorbs passive infrared energy from an object at wavelengths between 4 µm to 16 µm within the end-user defined field of view.

The internal math engine combines the corresponding change in voltage across the thermopile with the internal cold-junction reference temperature sensor to calculate the target object temperature. The TMP007 also provides nonvolatile memory for storing calibration coefficients.

The TMP007 is designed with portability and power in mind, and can easily be placed in the tightest of spaces while using standard surface-mount assembly processes. Low power consumption also makes it well suited for battery-powered applications.

The TMP006 offers a reduced feature set. The TMP006 offers similar performance as the TMP007, but does not contain the math engine or nonvolatile memory.

The Infrared thermopile sensor is specified to operate from –40°C to +125°C. It is possible to measure object temperature beyond the device operating range as long as the device itself does not exceed the operating temperature range (–40°C to +125°C).

The TMP007 is a fully-integrated microelectro-mechanical system (MEMS) thermopile sensor that measures the temperature of an object without direct contact. The thermopile absorbs passive infrared energy from an object at wavelengths between 4 µm to 16 µm within the end-user defined field of view.

The internal math engine combines the corresponding change in voltage across the thermopile with the internal cold-junction reference temperature sensor to calculate the target object temperature. The TMP007 also provides nonvolatile memory for storing calibration coefficients.

The TMP007 is designed with portability and power in mind, and can easily be placed in the tightest of spaces while using standard surface-mount assembly processes. Low power consumption also makes it well suited for battery-powered applications.

The TMP006 offers a reduced feature set. The TMP006 offers similar performance as the TMP007, but does not contain the math engine or nonvolatile memory.

The Infrared thermopile sensor is specified to operate from –40°C to +125°C. It is possible to measure object temperature beyond the device operating range as long as the device itself does not exceed the operating temperature range (–40°C to +125°C).
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* Data sheet TMP007 Infrared Thermopile Sensor with Integrated Math Engine datasheet (Rev. C) PDF | HTML 28 Jul 2015
Technical article Real-time temperature sensing with dual-mode connectivity PDF | HTML 03 Nov 2016
Technical article What puts the 'sensor' in SensorTag? PDF | HTML 22 Jun 2015

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

CC3200STK-WIFIMK — SimpleLink™ Wi-Fi® CC3200 SensorTag

The SimpleLink™ Wi-Fi® CC3200 SensorTag development kit is one of the quickest and easiest ways to connect sensors directly to the cloud!

The new Wi-Fi SensorTag kit is based on the low-power SimpleLink Wi-Fi CC3200 wireless MCU, the industry’s first Wi-Fi CERTIFIED™ single-chip (...)

User guide: PDF
Not available on TI.com
Development kit

CC2650STK — SimpleLink™ Bluetooth low energy/Multi-standard SensorTag

The new SensorTag IoT kit invites you to realize your cloud-connected product idea. The new SensorTag now includes 10 low-power MEMS sensors in a tiny red package. And it is expandable with DevPacks to make it easy to add your own sensors or actuators.

 

Connect to the cloud with Bluetooth low energy (...)

Not available on TI.com
Plug-in

SIMPLELINK-SDK-SENSOR-ACTUATOR-PLUGIN — Sensor and Actuator Plug-in for SimpleLink™ MCU SDKs

The Sensor and Actuator Plugin for SimpleLink™ MCU SDKs provides support for a variety of related components including optical and temperature and humidity sensors, allowing customers to easily add new features to their SimpleLink MCU-based design. API user guides are provided for each (...)

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Supported products & hardware

Supported products & hardware

Products
Digital temperature sensors
TMP006 — Infrared Thermopile Contactless Temperature Sensor in WCSP Package TMP007 — Infrared Thermopile Contactless Temperature Sensor with Integrated Math Engine in WCSP Package TMP116 — 0.2C digital temperature sensor, 64-bit non-volatile memory
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Wi-Fi products
CC3220MODA — SimpleLink™ 32-bit Arm Cortex-M4 Wi-Fi CERTIFIED™ wireless module with antenna CC3220R — SimpleLink™ 32-bit Arm Cortex-M4 Wi-Fi® wireless MCU with 6 TLS/SSL and 256kB RAM CC3220S — SimpleLink™ 32-bit Arm Cortex-M4 Wi-Fi® wireless MCU with secure boot and 256kB RAM CC3220SF — SimpleLink™ 32-bit Arm Cortex-M4 Wi-Fi® wireless MCU with 1MB Flash and 256kB RAM
Linear Hall-effect sensors
DRV5055 — Ratiometric linear hall effect sensor with analog output
Humidity sensors
HDC2010 — 2% RH ultra-small, low-power digital relative humidity sensor HDC2080 — 2% RH ultra-low-power digital relative humidity sensor, interrupt/DRDY
Precision ADCs
ADS7142 — 12-bit 140-kSPS 2-ch nanopower SAR ADC with 1.8-V operation in 1.5-mm x 2-mm QFN package ADS7142-Q1 — Automotive 2-channel 12-bit 140-kSPS I2C-compatible ADC with programmable threshold and host wake-up
Low-power 2.4-GHz products
CC2640R2F — SimpleLink™ 32-bit Arm® Cortex®-M3 Bluetooth® 5.1 Low Energy wireless MCU with 128-kB flash
Light sensors
OPT3001 — Digital ambient light sensor (ALS) with high-precision human-eye response
Hardware development
BOOSTXL-ADS7142-Q1 — ADS7142-Q1 2-channel 12-bit 140-kSPS I2C-compatible ADC BoosterPack™ plug-in module BOOSTXL-BASSENSORS — Sensors BoosterPack plug-in module for building automation BOOSTXL-PGA460 — PGA460-Q1 ultrasonic sensor signal conditioning evaluation module with transducers BOOSTXL-ULN2003 — Dual Stepper Motor Driver BoosterPack featuring ULN2003 and CSD17571Q2 NexFET™ CC3220S-LAUNCHXL — CC3220S LaunchPad™ development kit for Wi-Fi® SimpleLink™ wireless MCU CC3220SF-LAUNCHXL — CC3220SF LaunchPad™ development kit for Wi-Fi® SimpleLink™ wireless MCU LAUNCHXL-CC1310 — CC1310 LaunchPad™ development kit for sub-1-GHz SimpleLink™ wireless MCU LAUNCHXL-CC1352R1 — CC1352R LaunchPad™ development kit for SimpleLink™ multi-band wireless MCU LAUNCHXL-CC2640R2 — CC2640R2 LaunchPad™ development kit for SimpleLink™ Bluetooth® Low Energy wireless MCU LAUNCHXL-CC26X2R1 — CC26x2R LaunchPad™ development kit for multi-standard SimpleLink™ wireless MCU MSP-EXP432E401Y — MSP432E401Y LaunchPad™ development kit for Ethernet SimpleLink™ MCU
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Reference designs

TIDC-CC2650STK-SENSORTAG — SimpleLink™ multi-standard CC2650 SensorTag™ kit reference design

The new SimpleLink™ multi-standard SensorTag kit invites you to realize your Internet of Things (IoT) product idea. Including 10 low-power MEMS sensors in a tiny package, the kit is expandable with DevPacks to make it easy to add your own sensors or actuators.

Connect to the cloud with Bluetooth (...)

User guide: PDF
Schematic: PDF
Package Pins Download
DSBGA (YZF) 8 View options
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