1°C I2C Temperature sensor with performance upgrades to industry standard LM75 / TMP75
Product details
Parameters
Package | Pins | Size
Features
- Accuracy for TMP1075DGK / TMP1075D:
- ±1°C (Maximum) From −40°C to +110°C
- ±2°C (Maximum) From −55°C to +125°C
- Accuracy for TMP1075DSG
- ±1°C (Maximum) From −40°C to +75°C
- ±2°C (Maximum) From −55°C to +125°C
- Low Power Consumption:
- 2.7-µA Average Current
- 0.37-µA Shutdown Current
- Wide Supply Range: 1.7 V to 5.5 V
- Temperature Independent of Supply
- Digital Interface: SMBus, I2C
- 100% software compatibility with industry standard LM75 and TMP75
- Can Coexist in I3C Mixed Fast Mode Bus
- Resolution: 12 Bits
- Supports up to 32 Device Addresses
- Alert Pin Function
- NIST Traceability
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Description
The TMP1075 is the most accurate and lowest power replacement to the industry standard LM75 and TMP75 digital temperature sensors. Available in SOIC-8 and VSSOP-8 packages, the TMP1075 offers pin-to-pin and software compatibility to quickly upgrade any existing xx75 design. An additional new package with the TMP1075 is 2x2 mm DFN reducing the PCB footprint by 79% compared to an SOIC package.
The TMP1075 has a ±1°C accuracy over a wide temperature range and offers an on-chip 12-bit analog-to-digital converter (ADC) providing a temperature resolution of 0.0625°C.
Compatible with two-wire SMBus and I2C interfaces, the TMP1075 supports up to 32 devices address and provides SMBus Reset and Alert function.
The TMP1075 is designed for accurate and cost-effective temperature measurement in virtually any telecommunication, enterprise, industrial and personal electronics equipment.
The TMP1075 devices are specified for operation over a temperature range of −55°C to +125°C.
The TMP1075 units are 100% tested on a production setup that is NIST traceable and verified with equipment that is calibrated to ISO/IEC 17025 accredited standards.

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Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TMP1075 Temperature Sensor With I2C and SMBus Interface in Industry Standard LM75 Form Factor and Pinout datasheet (Rev. D) | Oct. 07, 2019 |
Application note | How to Boost Your CPU, GPU, and SoC Performance Through Thermal Accuracy | Sep. 22, 2020 | |
Technical articles | How to design an infrared thermometer quickly | Apr. 07, 2020 | |
Technical articles | How to choose the right thermistor for your temperature sensing application | Feb. 12, 2020 | |
Technical articles | How to enable thermal safety for automotive infotainment and cluster systems | Oct. 15, 2019 | |
Technical articles | Driving industrial innovation with small-size sensors | Sep. 12, 2019 | |
Application note | Low-Power Design Techniques for Temperature-Sensing Applications | Jun. 06, 2019 | |
User guide | TMP1075 EVM User's Guide (Rev. A) | Apr. 04, 2018 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Features
- Provides GUI for simple and fast setup
- Perforated PCB allows sensor to be placed in user’s system
- Up to ±0.5°C typical accuracy with 0.0625°C resolution (12-bit)
- Example of PCB layout for fast thermal response time
Software development
Linux Mainline Status
Available in Linux Main line: Yes
Available through git.ti.com: N/A
- LM75A
- TMP100
- TMP101
- (...)
Features
- Interactive and intuitive graphical tool for enabling, configuring and generating initialization and runtime code for TI sensors and other signal chain components
- Real-time code preview is available allowing developers to see what code is being generated based on GUI inputs
- Contextual documentation is (...)
Design tools & simulation
Reference designs
Design files
-
download TIDA-010072 BOM.pdf (149KB) -
download TIDA-010072 Assembly Drawing.pdf (498KB) -
download TIDA-010072 PCB.pdf (2120KB) -
download TIDA-010072 CAD Files.zip (8297KB) -
download TIDA-010072 Gerber.zip (2994KB)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
SOIC (D) | 8 | View options |
VSSOP (DGK) | 8 | View options |
WSON (DSG) | 8 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
TI E2E™ forums with technical support from TI engineers
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