36-V Low Ron, 1:1, 4 channel, multiplexer with 1.8V logic control


Product details


Configuration 1:1 SPST Number of channels (#) 4 Power supply voltage - single (V) 12, 16, 20, 36, 5 Ron (Typ) (Ohms) 2 ON-state leakage current (Max) (µA) 0.06 Bandwidth (MHz) 45 Operating temperature range (C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic Input/output continuous current (Max) (mA) 370 Rating Catalog CON (Typ) (pF) 145 Supply current (Typ) (uA) 65 open-in-new Find other Analog switches & muxes

Package | Pins | Size

TSSOP (PW) 16 22 mm² 5 x 4.4 open-in-new Find other Analog switches & muxes


  • Dual Supply Range: ±4.5 V to ±18 V
  • Single Supply Range: 4.5 V to 36 V
  • Low On-Resistance: 2 Ω
  • High current support: 370 mA (Maximum)
  • –40°C to +125°C Operating Temperature
  • 1.8 V Logic Compatible
  • Fail-Safe Logic
  • Rail-to-Rail Operation
  • Bidirectional Operation

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The TMUX6211, TMUX6212, and TMUX6213 are complementary metal-oxide semiconductor (CMOS) switches with four independently selectable 1:1, single-pole, single-throw (SPST) switch channels. The devices work with a single supply (4.5 V to 36 V), dual supplies (±4.5 V to ±18 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5 V). The TMUX621x supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins ranging from VSS to VDD.

The switches of the TMUX621x are controlled with appropriate logic control inputs on the SELx pins. The TMUX621x are part of the precision switches and multiplexers family of devices and have very low on and off leakage currents allowing them to be used in high precision measurement applications.

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Technical documentation

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* Datasheet TMUX621x36 V, Low-RON, 1:1 (SPST), 4-Channel Precision Switches with 1.8-V Logic datasheet (Rev. A) Jan. 19, 2021

Design & development

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Hardware development

document-generic User guide

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel

Design tools & simulation

SCDM253.ZIP (175 KB) - IBIS Model

CAD/CAE symbols

Package Pins Download
TSSOP (PW) 16 View options
WQFN (RUM) 16 View options

Ordering & quality

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