2.1-W Stereo Class-D Audio Amplifier with Gain Select (TPA2012)
Product details
Parameters
Package | Pins | Size
Features
- Output Power By Package:
- WQFN:
- 2.1 W/Ch Into 4 Ω at 5 V
- 1.4 W/Ch Into 8 Ω at 5 V
- 720 mW/Ch Into 8 Ω at 3.6 V
- DSBGA:
- 1.2 W/Ch Into 4 Ω at 5 V
(Thermally Limited) - 1.3 W/Ch Into 8 Ω at 5 V
- 720 mW/Ch Into 8 Ω at 3.6 V
- 1.2 W/Ch Into 4 Ω at 5 V
- WQFN:
- Only Two External Components Required
- Power Supply Range: 2.5 V to 5.5 V
- Independent Shutdown Control for Each Channel
- Selectable Gain of 6, 12, 18, and 24 dB
- Internal Pulldown Resistor on Shutdown Pins
- High PSRR: 77 dB at 217 Hz
- Fast Start-Up Time (3.5 ms)
- Low Supply Current
- Low Shutdown Current
- Short-Circuit and Thermal Protection
- Space-Saving Packages
- 2.01-mm × 2.01-mm NanoFree™ DSBGA (YZH)
- 4-mm × 4-mm Thin WQFN (RTJ) With PowerPAD™
All trademarks are the property of their respective owners.
Description
The TPA2012D2 is a stereo, filter-free, Class-D audio amplifier (Class-D amp) available in a DSBGA or WQFN package. The TPA2012D2 only requires two external components for operation.
The TPA2012D2 features independent shutdown controls for each channel. The gain can be selected to 6, 12, 18, or 24 dB using the G0 and G1 gain select pins. High PSRR and differential architecture provide increased immunity to noise and RF rectification. In addition to these features, a fast start-up time and small package size make the TPA2012D2 class-D amp an ideal choice for both cellular handsets and PDAs.
The TPA2012D2 is capable of driving 1.4 W/Ch at
5 V or 720 mW/Ch at 3.6 V into 8 Ω. The TPA2012D2 is also capable of driving 4 Ω. The TPA2012D2 is thermally limited in DSBGA and may not achieve
2.1 W/Ch for 4 Ω. The maximum output power in the DSBGA is determined by the ability of the circuit board to remove heat. Figure 33 shows thermally limited region of the DSBGA in relation to the WQFN package. The TPA2012D2 provides thermal and short-circuit protection.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TPA2012D2 2.1-W/Channel Stereo Filter-Free Class-D Audio Power Amplifier datasheet (Rev. F) | Mar. 14, 2017 |
Application note | Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) | Aug. 26, 2019 | |
Application note | AN-1849 An Audio Amplifier Power Supply Design (Rev. C) | Jun. 27, 2019 | |
Application note | AN-1737 Managing EMI in Class D Audio Applications (Rev. A) | May 01, 2013 | |
More literature | TPA2012D2_NanoEVM_ Schematic | Feb. 13, 2007 | |
More literature | TPA2012D2_NanoEVM_OV | Jan. 29, 2007 | |
Application note | Measuring Class-D Amplifiers for Audio Speaker Overstress Testing | Oct. 28, 2005 | |
User guide | TPA2012D2EVM - User Guide (Rev. A) | Apr. 07, 2005 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The SimpleLink™ Wi-Fi® CC3200 Audio BoosterPack enables the evaluation and development with the digital audio peripheral [I2S] present on the SimpleLink™ Wi-Fi® CC3200 device. It contains a Class-D power amplifier to drive speakers and an ultra-low power audio codec, TLV320AIC3254, supporting (...)
Features
- 1 Microphone
- 1 audio 3.5 mono jack
- 2 audio 3.5 mm stereo jack (in and out)
- Onboard speaker connector using terminal blocks (stereo)
- Onboard audio codec (TLV320AIC3254)
- Onboard class-D audio power amplifier (TPA2012D2)
Description
The TPA2012D2 EVM is a Pb-free, highly-efficient, filter-free stereo audio power amplifier evaluation module. It consists of the TI TPA2012D2 1.65 W low-voltage stereo Class-D audio power amplifier IC in a very small NanoFree™ wafer chip scale package (WCSP). All devices including the (...)
Features
- Includes a 2 mm x 2 mm NanoFree™ WSCP IC
- Independent Shutdown Control for Each Channel
- 1.65 W Output Power Into 4 Ohms at 5 V, BTL
- Wide Supply Voltage Range (2.5 V to 5.5 V)
- Internal depop and quick start-up circuitry
- Internal thermal and short-circuit protection
- Module gain is set at 5 V/V
- Completely Pb Free
Design tools & simulation
Features
- Leverages Cadence PSpice Technology
- Preinstalled library with a suite of digital models to enable worst-case timing analysis
- Dynamic updates ensure you have access to most current device models
- Optimized for simulation speed without loss of accuracy
- Supports simultaneous analysis of multiple products
- (...)
Reference designs
Design files
-
download Wi-Fi Audio Streaming Application for CC3200 Launchpad Bill of Materials (BOM).pdf (87KB) -
download Wi-Fi Audio Streaming Application for CC3200 Launchpad Gerber Design Files.zip (1355KB) -
download Wi-Fi Audio Streaming Application for CC3200 Launchpad Layer Plots (PCB Layouts).zip (181KB) -
download Wi-Fi Audio Streaming Application for CC3200 Launchpad Assembly Drawings.zip (149KB) -
download Three Output Smart Power Strip CAD Files.zip (847KB) -
download SimpleLink Wi-Fi CC3200 LaunchPad Gerber Files.zip (457KB) -
download SimpleLink Wi-Fi CC3200 LaunchPad Layer Plots (PCB Layout).zip (500KB) -
download SimpleLink Wi-Fi CC3200 LaunchPad Assembly Drawings.pdf (389KB) -
download SimpleLink Wi-Fi CC3200 LaunchPad CAD Files.zip (1792KB)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
DSBGA (YZH) | 16 | View options |
QFN (RTJ) | 20 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.