|Package | Pins TO-252 (KVU) | 5|
|Operating temperature range (°C) -40 to 150|
|Package qty | Carrier 2,500 | LARGE T&R|
Features for the TPS7B86-Q1
- AEC-Q100 qualified for automotive applications:
- Temperature grade 1: –40°C to +125°C, TA
- Junction temperature: –40°C to +150°C, TJ
- Input voltage range: 3 V to 40 V (42 V max)
- Output voltage range:
- Adjustable output: 1.2 V to 18 V
- Fixed 3.3-V and 5-V output
- Maximum output current: 500 mA
- Output voltage accuracy: ±0.85% (max)
- Low dropout voltage:
- 475 mV (max) at 450 mA (VOUT ≥ 3.3 V)
- Low quiescent current:
- 17 µA (typ) at light loads
- 5 µA (max) when disabled
- Excellent line transient response:
- ±2% VOUT deviation during cold-crank
- ±2% VOUT deviation (1-V/µs VIN slew rate)
- Power-good with programmable delay period
- Stable with a 2.2-µF or larger capacitor
- Functional Safety-Capable
- Package options:
- 5-pin TO-252 package: 29.7°C/W RθJA
- 8-pin HSOIC-8 package with thermal pad: 41.8°C/W RθJA
Description for the TPS7B86-Q1
The TPS7B86-Q1 is a low-dropout linear regulator designed to connect to the battery in automotive applications. The device has an input voltage range extending to 40 V, which allows the device to withstand transients (such as load dumps) that are anticipated in automotive systems. With only a 17-µA quiescent current at light loads, the device is an optimal solution for powering always-on components such as microcontrollers (MCUs) and controller area network (CAN) transceivers in standby systems.
The device has state-of-the-art transient response that allows the output to quickly react to changes in load or line (for example, during cold-crank conditions). Additionally, the device has a novel architecture that minimizes output overshoot when recovering from dropout. During normal operation, the device has a tight DC accuracy of ±0.85% over line, load, and temperature.
The power-good delay can be adjusted by external components, allowing the delay time to be configured to fit application-specific systems.
The device is available in thermally conductive packaging to allow the device components to efficiently transfer heat to the circuit board.