The TPSI2140-Q1 is an isolated solid state relay designed for high voltage automotive and industrial applications. The TPSI2140-Q1 uses TIs high reliability capacitive isolation technology in combination with internal back-to-back MOSFETs to form a completely integrated solution requiring no secondary side power supply.
The entire primary side of the device requires only 9 mA of input current, enabling the user to drive both the VDD and EN pins from a single microcontroller GPIO and eliminating the need for an external low side switch used in photo relay solutions. The user can also choose to connect the VDD pin to a system supply between 5 V–20 V and drive the EN pin from a GPIO. The EN pin is fail-safe preventing any possibility of back powering the VDD supply.
The secondary side consists of back-to-back MOSFETs with a standoff voltage of ±1.2 kV from S1 to S2. The TPSI2140-Q1 MOSFETs avalanche robustness and thermally conscious package design allow it to survive system level High Potential (HiPot) screening and DC fast charger surge currents of up to 2 mA without requiring any external components.
The TPSI2140-Q1 is an isolated solid state relay designed for high voltage automotive and industrial applications. The TPSI2140-Q1 uses TIs high reliability capacitive isolation technology in combination with internal back-to-back MOSFETs to form a completely integrated solution requiring no secondary side power supply.
The entire primary side of the device requires only 9 mA of input current, enabling the user to drive both the VDD and EN pins from a single microcontroller GPIO and eliminating the need for an external low side switch used in photo relay solutions. The user can also choose to connect the VDD pin to a system supply between 5 V–20 V and drive the EN pin from a GPIO. The EN pin is fail-safe preventing any possibility of back powering the VDD supply.
The secondary side consists of back-to-back MOSFETs with a standoff voltage of ±1.2 kV from S1 to S2. The TPSI2140-Q1 MOSFETs avalanche robustness and thermally conscious package design allow it to survive system level High Potential (HiPot) screening and DC fast charger surge currents of up to 2 mA without requiring any external components.