TPSM53602

• 5-mm × 5.5-mm × 4-mm routable lead-frame (RLF) QFN package
  • 85-mm² solution size (single sided)
  • Low EMI: Meets CISPR11 radiated emissions
  • Excellent thermal performance:
    Up to 14 W output power at 85ºC, no airflow
  • Standard footprint: single large thermal pad and all pins accessible from perimeter
• 3.8 V to 36 V input voltage range
• Output voltage range: 1 V to 7 V
• Efficiency up to 95%
• Power-good flag
• Precision enable
• Built-in hiccup-mode short-circuit protection, over-temperature protection, start-up into pre-bias output, soft start, and UVLO
• Operating IC junction range: –40°C to +125°C
• Operating ambient range: –40°C to +105°C
• Shock and vibration tested to Mil-STD-883D
• Pin compatible with: 3-A TPSM53603
  and 4-A TPSM53604
• Create a custom design using the TPSM53602 with the WEBENCH^® Power Designer

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The TPSM53602 power module is a highly integrated 2-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin QFN package uses routable lead-frame technology for enhanced thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.

The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53602 an excellent device for powering a wide range of applications.