36-V, 2-A step-down power module in small 5.5 x 5 x 4-mm Enhanced HotRod™ QFN with simple footprint
Product details
Parameters
Package | Pins | Size
Features
- 5-mm × 5.5-mm × 4-mm Enhanced HotRod QFN package
- 85-mm2 solution size (single sided)
- Low EMI: Meets CISPR11 radiated emissions
- Excellent thermal performance: Up to 14 W output power at 85°C, no airflow
- Standard footprint: single large thermal pad and all pins accessible from perimeter
- Input voltage range: 3.8 V to 36 V
- Output voltage range: 1 V to 7 V
- Efficiency up to 95%
- Power-good flag
- Precision enable
- Built-in hiccup-mode short-circuit protection, over-temperature protection, start-up into pre-bias output, soft start, and UVLO
- Operating IC junction range: –40°C to +125°C
- Operating ambient range: –40°C to +105°C
- Shock and vibration tested to Mil-STD-883D
- Pin compatible with: 3-A TPSM53603 and 4-A TPSM53604
- Create a custom design using the TPSM53602 with the WEBENCH Power Designer
- Download the EVM Design Files for fast board design
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Description
The TPSM53602 power module is a highly integrated 2-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package uses Enhanced HotRod QFN technology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.
The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53602 an excellent device for powering a wide range of applications.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TPSM53602 36-V Input, 2-A Power Module in Enhanced HotRod™ QFN Package datasheet (Rev. A) | Aug. 13, 2020 |
Application note | Soldering Requirements for BQFN Packages (Rev. C) | Mar. 05, 2020 | |
User guide | Using the TPSM53604EVM, TPSM53603EVM, and TPSM53602EVM (Rev. B) | Dec. 13, 2019 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Features
- 3.8-V to 36-V input voltage range
- Up to 2 A of output current
- 1-V to 7-V output voltage
- 5 mm x 5.5 mm QFN package
Design tools & simulation
Features
- Leverages Cadence PSpice Technology
- Preinstalled library with a suite of digital models to enable worst-case timing analysis
- Dynamic updates ensure you have access to most current device models
- Optimized for simulation speed without loss of accuracy
- Supports simultaneous analysis of multiple products
- (...)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
B3QFN (RDA) | 15 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
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Support & training
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