TI E2E™ forums with technical support from TI engineers
|*||Data sheet||TPSM53604 36-V Input, 4-A Power Module in Enhanced HotRod™ QFN Package datasheet (Rev. C)||30 Sep 2021|
|White paper||Addressing Factory Automation Challenges with Innovations in Power Design||28 Sep 2021|
|Functional safety information||TPSM53604 Functional Safety, FIT Rate, Failure Mode Distribution, and Pin FMA||24 Aug 2021|
|Application note||Soldering Considerations for Power Modules (Rev. B)||17 May 2021|
|Technical article||Powering medical imaging applications with DC/DC buck converters||24 Nov 2020|
|Application note||Soldering Requirements for BQFN Packages (Rev. C)||05 Mar 2020|
|Technical article||35 years later, APEC continues to set the tone for innovation in power management||27 Feb 2020|
|EVM User's guide||Using the TPSM53604EVM, TPSM53603EVM, and TPSM53602EVM (Rev. B)||13 Dec 2019|
|Application note||Practical Thermal Design With DC/DC Power Modules (Rev. A)||20 Nov 2019|
|White paper||Enabling Small, Cool and Quiet Power Modules with Enhanced HotRod™ QFN Packaging||19 Nov 2019|
|Application note||Using the TPSM5360x for an Inverting Buck-Boost Application||29 Oct 2019|
For additional terms or required resources, click any title below to view the detail page where available.
|B3QFN (RDA)||15||View options|
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.