TS5A2053

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5-V, 2:1 (SPDT), 1-channel general-purpose analog switch (8-pin DSBGA, SSOP, VSSOP packages)

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Product details

Parameters

Configuration 2:1 SPDT Number of channels (#) 1 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Ron (Typ) (Ohms) 7.5 ON-state leakage current (Max) (µA) 0.2 Bandwidth (MHz) 330 Operating temperature range (C) -40 to 85 Input/output continuous current (Max) (mA) 50 Rating Catalog CON (Typ) (pF) 18 Supply current (Typ) (uA) 0.1 open-in-new Find other Analog switches & muxes

Package | Pins | Size

SSOP (DCT) 8 8 mm² 3 x 2.8 SSOP (DCT) 8 8 mm² 2.95 x 2.80 VSSOP (DCU) 8 6 mm² 2 x 3.1 open-in-new Find other Analog switches & muxes

Features

  • Low ON-State Resistance (10 )
  • Control Inputs Are 5-V Tolerant
  • Low Charge Injection
  • Excellent ON-Resistance Matching
  • Low Total Harmonic Distortion (THD)
  • 1.65-V to 5.5-V Single-Supply Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Applications
    • Cell Phones
    • Portable Audio Video Equipment
    • Battery-Powered Equipment
    • Low-Voltage Data Acquisition Systems
    • Test Equipment
    • Communication Circuits

open-in-new Find other Analog switches & muxes

Description

The TS5A2053 is a single-pole double-throw (SPDT) analog switch that is designed to operate from 1.65 V to 5.5 V. This device can handle both digital and analog signals, and signals up to V+ can be transmitted in either direction.

open-in-new Find other Analog switches & muxes
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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 6
Type Title Date
* Datasheet TS5A2053 datasheet (Rev. A) May 18, 2005
* Errata Datasheet Errata for TS5A2053 Device Type Jan. 31, 2006
Application note Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application note Multiplexers and Signal Switches Glossary Mar. 06, 2020
Application note Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

INTERFACE ADAPTER Download
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


Design tools & simulation

SIMULATION MODEL Download
SCDM082.ZIP (99 KB) - IBIS Model

CAD/CAE symbols

Package Pins Download
SM8 (DCT) 8 View options
VSSOP (DCU) 8 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

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