Product details

Protocols Analog Audio Configuration 2:1 SPDT Number of channels (#) 2 Bandwidth (MHz) 18.3 Supply voltage (Max) (V) 5.5 Supply voltage (Min) (V) 2.3 Ron (Typ) (Ohms) 0.52 Input/ouput voltage (Min) (V) -3.2 Input/ouput voltage (Max) (V) 5.5 Supply current (Typ) (uA) 0.1 ESD HBM (Typ) (kV) 2.5 Operating temperature range (C) -40 to 85 Crosstalk (dB) -78 ESD CDM (kV) 1.5 ICC (Typ) (uA) 0.2 Input/output continuous current (Max) (mA) 350 COFF (Typ) (pF) 70 CON (Typ) (pF) 370 Off isolation (Typ) (dB) -68 OFF-state leakage current (Max) (µA) 0.375 Ron (Max) (Ohms) 1.3 Ron channel match (Max) (Ohms) 0.15 RON flatness (Typ) (Ohms) 0.076 Turn off time (disable) (Max) (ns) 70 Turn on time (enable) (Max) (ns) 120 VIH (Min) (V) 1.4 VIL (Max) (V) 0.8
Protocols Analog Audio Configuration 2:1 SPDT Number of channels (#) 2 Bandwidth (MHz) 18.3 Supply voltage (Max) (V) 5.5 Supply voltage (Min) (V) 2.3 Ron (Typ) (Ohms) 0.52 Input/ouput voltage (Min) (V) -3.2 Input/ouput voltage (Max) (V) 5.5 Supply current (Typ) (uA) 0.1 ESD HBM (Typ) (kV) 2.5 Operating temperature range (C) -40 to 85 Crosstalk (dB) -78 ESD CDM (kV) 1.5 ICC (Typ) (uA) 0.2 Input/output continuous current (Max) (mA) 350 COFF (Typ) (pF) 70 CON (Typ) (pF) 370 Off isolation (Typ) (dB) -68 OFF-state leakage current (Max) (µA) 0.375 Ron (Max) (Ohms) 1.3 Ron channel match (Max) (Ohms) 0.15 RON flatness (Typ) (Ohms) 0.076 Turn off time (disable) (Max) (ns) 70 Turn on time (enable) (Max) (ns) 120 VIH (Min) (V) 1.4 VIL (Max) (V) 0.8
DSBGA (YZP) 10 3 mm² 1.9 x 1.4 VSON (DRC) 10 9 mm² 3.00 x 3.00 VSON (DRC) 10 9 mm² 3 x 3 VSSOP (DGS) 10 9 mm² 3 x 3
  • Specified break-before-make switching
  • Negative signaling capability: maximum swing from –2.75 V to 2.75 V (VCC = 2.75 V)
  • Low ON-state resistance (0.65 Ω typical)
  • Low charge injection
  • Excellent ON-state resistance matching
  • 2.3-V to 5.5-V Power supply (VCC)
  • Latch-Up performance exceeds 100 mA Per JESD 78, Class II
  • ESD Performance tested per JESD 22
    • 2500-V Human-body model
      (A114-B, class II)
    • 1500-V Charged-device model (C101)
    • 200-V Machine model (A115-A)
  • Specified break-before-make switching
  • Negative signaling capability: maximum swing from –2.75 V to 2.75 V (VCC = 2.75 V)
  • Low ON-state resistance (0.65 Ω typical)
  • Low charge injection
  • Excellent ON-state resistance matching
  • 2.3-V to 5.5-V Power supply (VCC)
  • Latch-Up performance exceeds 100 mA Per JESD 78, Class II
  • ESD Performance tested per JESD 22
    • 2500-V Human-body model
      (A114-B, class II)
    • 1500-V Charged-device model (C101)
    • 200-V Machine model (A115-A)

The TS5A22362 is a bidirectional, 2-channel single-pole double-throw (SPDT) analog switch designed to operate from 2.3 V to 5.5 V. The device features negative signal swing capability that allows signals below ground to pass through the switch without distortion. The break-before-make feature prevents signal distortion during the transferring of a signal from one path to another. Low ON-state resistance, excellent channel-to-channel ON-state resistance matching, and minimal total harmonic distortion (THD) performance are ideal for audio applications. The 3.00 mm × 3.00 mm DRC package is also available as a nonmagnetic package for medical imaging application.

The TS5A22362 is a bidirectional, 2-channel single-pole double-throw (SPDT) analog switch designed to operate from 2.3 V to 5.5 V. The device features negative signal swing capability that allows signals below ground to pass through the switch without distortion. The break-before-make feature prevents signal distortion during the transferring of a signal from one path to another. Low ON-state resistance, excellent channel-to-channel ON-state resistance matching, and minimal total harmonic distortion (THD) performance are ideal for audio applications. The 3.00 mm × 3.00 mm DRC package is also available as a nonmagnetic package for medical imaging application.

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Technical documentation

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Type Title Date
* Data sheet TS5A22362 0.65-Ω 2-channel SPDT Analog Switches With Negative Signaling Capability datasheet (Rev. E) 25 Sep 2019
Application note Selecting the Right Texas Instruments Signal Switch (Rev. C) 06 Aug 2021
Application note Multiplexers and Signal Switches Glossary (Rev. A) 09 Jun 2021
Application note 1.8 V Logic for Muxes and Signal (Rev. A) 06 Jan 2021
Application note Preventing Excess Power Consumption on Analog Switches 03 Jul 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004

Design & development

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Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

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LEADLESS-ADAPTER1 — Surface mount to DIP header adapter for testing of TI's 6,8,10,12,14,16, & 20-pin leadless packages

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
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Simulation model

TS5A22362 IBIS Model

SCDM120.ZIP (68 KB) - IBIS Model
Simulation model

HSPICE Model for TS5A22362

SCDM121.ZIP (105 KB) - HSpice Model
Package Pins Download
DSBGA (YZP) 10 View options
VSON (DRC) 10 View options
VSSOP (DGS) 10 View options

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