TS5A3159A

ACTIVE

1-Ω, 5-V, 2:1 (SPDT), 1-channel general-purpose analog switch with powered-off protection

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Product details

Parameters

Configuration 2:1 SPDT Number of channels (#) 1 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Ron (Typ) (Ohms) 0.7 ON-state leakage current (Max) (µA) 0.1 Bandwidth (MHz) 100 Operating temperature range (C) -40 to 85 Features Powered-off protection, Break-before-make Input/output continuous current (Max) (mA) 200 Rating Catalog CON (Typ) (pF) 84 Supply current (Typ) (uA) 0.01 open-in-new Find other Analog switches & muxes

Package | Pins | Size

DSBGA (YZP) 6 2 mm² .928 x 1.428 SOT-23 (DBV) 6 5 mm² 2.9 x 1.6 SOT-SC70 (DCK) 6 4 mm² 2 x 2.1 open-in-new Find other Analog switches & muxes

Features

  • Specified Break-Before-Make Switching
  • Isolation in Power-Down Mode, V+ = 0
  • Terminal Compatible With TS5A3159 Device
  • Low ON-State Resistance (1 Ω)
  • Control Inputs are 5.5-V Tolerant
  • Low Charge Injection
  • Excellent On-State Resistance Matching
  • Low Total Harmonic Distortion (THD)
  • 1.65-V to 5.5-V Single-Supply Operation
  • Latch-Up Performance Exceeds 100 mA
    Per JESD 78, Class II
  • ESD Performance Tested Per JESD
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)

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Description

The TS5A3159A device is a single-pole double-throw (SPDT) analog switch that is designed to operate from 1.65 V to 5.5 V. The device offers low on-state resistance and excellent ON-state resistance matching with the break-before-make feature, to prevent signal distortion during the transferring of a signal from one channel to another. The device has an excellent total harmonic distortion (THD) performance and consumes very low power. These features make this device suitable for portable audio applications.

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Technical documentation

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Type Title Date
* Datasheet TS5A3159A 1-Ω SPDT Analog Switch 5-V and 3.3-V Single-Channel 2:1 Multiplexer and Demultiplexer datasheet (Rev. F) Jan. 29, 2018
Application note High-Efficiency Charging for TWS Using a 2-Pin Interface Application Report Jun. 18, 2020
Application note Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application note Multiplexers and Signal Switches Glossary Mar. 06, 2020
Application note Eliminate power Sequencing with powered-off protection signal switches (Rev. B) Jan. 15, 2019
Application note Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

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Hardware development

EVALUATION BOARD Download
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Features
  • Simplifies prototyping of SMT IC’s
  • Supports 6 common package types
  • Low Cost
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The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
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  • Supports TI's 16 most popular leadless packages with a single panel

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CAD/CAE symbols

Package Pins Download
DSBGA (YZP) 6 View options
SC70 (DCK) 6 View options
SOT-23 (DBV) 6 View options

Ordering & quality

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  • MSL rating/Peak reflow
  • MTBF/FIT estimates
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  • Qualification summary
  • Ongoing reliability monitoring

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