Automotive USB 2.0 480Mbps High Speed Signal Conditioner
Product details
Parameters
Package | Pins | Size
Features
- AEC-Q100 Qualified for Automotive Applications
- Device Temperature: –60°C to 150°C Ambient
- Device HBM Classification Level: ±3000 V
- Device CDM Classification Level: ±1000 V
- Compatible with USB 2.0, OTG 2.0 and BC 1.2
- Support for LS, FS, HS signaling
- Active Power Consumption of 55 mW (Typical) with 3.3-V Single Supply
- Selectable Signal Gain Via External Pulldown Resistor
- Does Not Break DP, DM Trace
- Scalable Solution – Daisy Chain Device for High Loss Applications
- Compact 1.6 mm x 1.6 mm QFN Package
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Description
The TUSB211-Q1 is a USB High-Speed (HS) signal conditioner, designed to compensate for ISI signal loss in a transmission channel.
The device has a patent-pending design which is agnostic to USB Low Speed (LS) and Full Speed (FS) signals. LS and FS signal characteristics are unaffected by the TUSB211-Q1. HS signals are compensated.
Programmable signal gain permits fine tuning device performance to optimize High Speed signals at the connector. This helps to pass USB High Speed electrical compliance tests.
The footprint of TUSB211-Q1 does not break the continuity of the DP/DM signal path. This permits risk free system design of a complete USB channel.
In addition, TUSB211-Q1 is compatible with the USB On-The-Go (OTG) and Battery Charging (BC) protocols
Technical documentation
= Top documentation for this product selected by TI
| Type | Title | Date | |
|---|---|---|---|
| * | Datasheet | TUSB211-Q1 USB 2.0 High Speed Signal Conditioner datasheet | Oct. 11, 2017 |
| White papers | Strengthening the USB Type-C signal chain through redrivers | Aug. 21, 2017 | |
| Technical articles | How to deliver clean USB Type-C™ signals | Aug. 07, 2017 | |
| White papers | Alternate Mode for USB Type-C™: Going Beyond USB | Sep. 26, 2016 | |
| User guides | TUSB211 PICO Evaluation Module User's Guide | May 24, 2016 | |
| Technical articles | How USB will enable the future of automotive infotainment | Oct. 08, 2015 | |
| White papers | Transition existing products from USB 2.0 OTG to USB Type-C | Jul. 10, 2015 | |
| White papers | Low-cost implementation of USB Type-C | Jul. 07, 2015 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
TUSB211PICO-EVM
Description
The TUSB211PICO-EVM evaluation module (EVM) is designed to provide a simple means of demonstrating the signal conditioning capability of the TUSB211 device on an existing board designed without the TUSB211 footprint. The EVM is preconfigured and simply connects DP and DM signals (...)
Features
- Plug-and-play design
- EQ setting configurable through resistor
- The TUSB211 Pico EVM includes headers for different power options to provide power to the device
- Is pre-configured simple DP and DM connections
- Powered from the VBUS or an external 3.3-V supply
TUSB211RPTREVM
Description
The TUSB211RPTREVM is designed to provide a simple means of demonstrating the signal conditioning capability of the TUSB211. The EVM is pre-configured and simply connects the Type B connector on the EVM to the Type A receptacle found on a Host PC with a standard USB cable, a USB device would (...)
Features
- Plug and Play design
- The TUSB211RPTREVM requires no external power as the EVM will be powered from VBUS sourced from the Host port
- Five sets of switches to facilitate configuration changes
- Includes headers for monitoring some device pins of The TUSB211 as well as power to The device
USB-REDRIVER-EVM
Description
This USB 2.0, USB 3.0 redriver dongle design connects directly to a host USB port and redrives the high-speed or SuperSpeed signals to the downstream port to enable a long cable connection to a SuperSpeed or high-speed device. The dongle is powered from the VBUS pin provided by the host and passes (...)
Features
- Plug-and-play design
- VBUS powered
- USB2.0 and USB3.0 redriver
- Low-cost solution
Design tools & simulation
PSPICE-FOR-TI — PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Features
- Leverages Cadence PSpice Technology
- Preinstalled library with a suite of digital models to enable worst-case timing analysis
- Dynamic updates ensure you have access to most current device models
- Optimized for simulation speed without loss of accuracy
- Supports simultaneous analysis of multiple products
- (...)
TINA-TI — TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
Reference designs
TIDA-01432 — This automotive reference design demonstrates a unique approach for media ports that require data transfers. This design has the capability to support USB 2.0 through a 15-W USB Type-C™ port. Customers can accelerate their media port systems by taking advantage of a complete reference design (...)
Design files
-
download TIDA-01432 BOM.pdf (13KB) -
download TIDA-01432 Assembly Drawing.pdf (1616KB) -
download TIDA-01432 PCB.pdf (585KB) -
download TIDA-01432 CAD Files.zip (1992KB) -
download TIDA-01432 Gerber.zip (914KB)
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| X2QFN (RWB) | 12 | View options |
Ordering & quality
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
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