Automotive USB 2.0 480Mbps High Speed Signal Conditioner
Product details
Parameters
Package | Pins | Size
Features
- AEC-Q100 Qualified for Automotive Applications
- Device Temperature: –60°C to 150°C Ambient
- Device HBM Classification Level: ±3000 V
- Device CDM Classification Level: ±1000 V
- Compatible with USB 2.0, OTG 2.0 and BC 1.2
- Support for LS, FS, HS signaling
- Active Power Consumption of 55 mW (Typical) with 3.3-V Single Supply
- Selectable Signal Gain Via External Pulldown Resistor
- Does Not Break DP, DM Trace
- Scalable Solution – Daisy Chain Device for High Loss Applications
- Compact 1.6 mm x 1.6 mm QFN Package
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Description
The TUSB211-Q1 is a USB High-Speed (HS) signal conditioner, designed to compensate for ISI signal loss in a transmission channel.
The device has a patent-pending design which is agnostic to USB Low Speed (LS) and Full Speed (FS) signals. LS and FS signal characteristics are unaffected by the TUSB211-Q1. HS signals are compensated.
Programmable signal gain permits fine tuning device performance to optimize High Speed signals at the connector. This helps to pass USB High Speed electrical compliance tests.
The footprint of TUSB211-Q1 does not break the continuity of the DP/DM signal path. This permits risk free system design of a complete USB channel.
In addition, TUSB211-Q1 is compatible with the USB On-The-Go (OTG) and Battery Charging (BC) protocols
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TUSB211-Q1 USB 2.0 High Speed Signal Conditioner datasheet | Oct. 11, 2017 |
White paper | Strengthening the USB Type-C signal chain through redrivers | Aug. 21, 2017 | |
Technical article | How to deliver clean USB Type-C™ signals | Aug. 07, 2017 | |
White paper | Alternate Mode for USB Type-C™: Going Beyond USB | Sep. 26, 2016 | |
User guide | TUSB211 PICO Evaluation Module User's Guide | May 24, 2016 | |
Technical article | How USB will enable the future of automotive infotainment | Oct. 08, 2015 | |
White paper | Transition existing products from USB 2.0 OTG to USB Type-C | Jul. 10, 2015 | |
White paper | Low-cost implementation of USB Type-C | Jul. 07, 2015 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Features
- Plug-and-play design
- EQ setting configurable through resistor
- The TUSB211 Pico EVM includes headers for different power options to provide power to the device
- Is pre-configured simple DP and DM connections
- Powered from the VBUS or an external 3.3-V supply
Description
The TUSB211RPTREVM is designed to provide a simple means of demonstrating the signal conditioning capability of the TUSB211. The EVM is pre-configured and simply connects the Type B connector on the EVM to the Type A receptacle found on a Host PC with a standard USB cable, a USB device would (...)
Features
- Plug and Play design
- The TUSB211RPTREVM requires no external power as the EVM will be powered from VBUS sourced from the Host port
- Five sets of switches to facilitate configuration changes
- Includes headers for monitoring some device pins of The TUSB211 as well as power to The device
Description
Features
- Plug-and-play design
- VBUS powered
- USB2.0 and USB3.0 redriver
- Low-cost solution
Design tools & simulation
Features
- Leverages Cadence PSpice Technology
- Preinstalled library with a suite of digital models to enable worst-case timing analysis
- Dynamic updates ensure you have access to most current device models
- Optimized for simulation speed without loss of accuracy
- Supports simultaneous analysis of multiple products
- (...)
Reference designs
Design files
-
download TIDA-01432 BOM.pdf (13KB) -
download TIDA-01432 Assembly Drawing.pdf (1616KB) -
download TIDA-01432 PCB.pdf (585KB) -
download TIDA-01432 CAD Files.zip (1992KB) -
download TIDA-01432 Gerber.zip (914KB)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
X2QFN (RWB) | 12 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
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