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TX73H32

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32-channel, three -level transmitter with 2A pulser and integrated transmit beamformer

Product details

Device type Transmitter Number of input channels 32 Active supply current (typ) (mA) 10 Supply voltage (max) (V) 5.5 Operating temperature range (°C) 0 to 70 Interface type Serial Rating Catalog
Device type Transmitter Number of input channels 32 Active supply current (typ) (mA) 10 Supply voltage (max) (V) 5.5 Operating temperature range (°C) 0 to 70 Interface type Serial Rating Catalog
FCCSP (ACP) 196 144 mm² 12 x 12
  • Transmitter supports:
    • 32-channel 3-level pulser and active transmit/ receive (T/R) switch
  • 3-level pulser:
    • Maximum output voltage: ±100V
    • Minimum output voltage: ±2V
    • Maximum output current: 2A
    • True return to zero to discharge output to ground
    • Second harmonic of –43dBc at 5MHz
    • –3-dB Bandwidth with 220Ω || 220pF load
      • 19MHz for a ±100V supply
    • Very low receive power: 0.4mW/ch
  • Active transmit/receive (T/R) switch with:
    • Turn on resistance of 13Ω
    • Turn on and Turn off time: 100ns
    • Transient glitch: 20mVPP
  • On-chip beam former with:
    • Channel based T/R switch on and off controls
    • Delay resolution: half beamformer clock period, minimum 2.5ns
    • Maximum delay: 214 beamformer clock period
    • Maximum beamformer clockspeed: 200MHz
    • On-Chip RAM for pattern and delay profile
    • One 512 × 32 memory to store beam-former pattern and delay for a group of 2 channels
    • Global repeat feature present, enabling long-duration patterns
  • High-speed (400MHz maximum), 2-lane LVDS serial programming interface.
    • Low programming time: ≈1µs for delay profile update
    • 32-bit Checksum to detect wrong SPI writes
  • Supports CMOS serial programming interface (50MHz maximum)
  • High-reliability features:
    • Internal temperature sensor and automatic thermal shutdown
    • No specific power sequencing requirement
    • Error flag register to detect faulty conditions
    • Integrated passives for the floating supplies and bias voltages
    • Small package: FC-BGA-196 (12mm × 12mm) with 0.8mm pitch
  • Transmitter supports:
    • 32-channel 3-level pulser and active transmit/ receive (T/R) switch
  • 3-level pulser:
    • Maximum output voltage: ±100V
    • Minimum output voltage: ±2V
    • Maximum output current: 2A
    • True return to zero to discharge output to ground
    • Second harmonic of –43dBc at 5MHz
    • –3-dB Bandwidth with 220Ω || 220pF load
      • 19MHz for a ±100V supply
    • Very low receive power: 0.4mW/ch
  • Active transmit/receive (T/R) switch with:
    • Turn on resistance of 13Ω
    • Turn on and Turn off time: 100ns
    • Transient glitch: 20mVPP
  • On-chip beam former with:
    • Channel based T/R switch on and off controls
    • Delay resolution: half beamformer clock period, minimum 2.5ns
    • Maximum delay: 214 beamformer clock period
    • Maximum beamformer clockspeed: 200MHz
    • On-Chip RAM for pattern and delay profile
    • One 512 × 32 memory to store beam-former pattern and delay for a group of 2 channels
    • Global repeat feature present, enabling long-duration patterns
  • High-speed (400MHz maximum), 2-lane LVDS serial programming interface.
    • Low programming time: ≈1µs for delay profile update
    • 32-bit Checksum to detect wrong SPI writes
  • Supports CMOS serial programming interface (50MHz maximum)
  • High-reliability features:
    • Internal temperature sensor and automatic thermal shutdown
    • No specific power sequencing requirement
    • Error flag register to detect faulty conditions
    • Integrated passives for the floating supplies and bias voltages
    • Small package: FC-BGA-196 (12mm × 12mm) with 0.8mm pitch

TX73H32 is a highly integrated, high-performance transmitter device for ultrasound imaging system. The device has a total of 32 pulser circuits, 32 transmit/ receive switches (referred to as T/R or TR switches) and supports on-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high-voltage power supplies.

TX73H32 has a pulser circuit that generates three-level high voltage pulses (up to ±100V) that is used to excite multiple channels of an ultrasound transducer. The device supports total 32 outputs. The maximum output current is 2A.

Device can be used as a transmitter for many applications like ultrasound imaging, non-destructive testing, SONAR, LIDAR, marine navigation system, brain imaging systems and so on.

TX73H32 is a highly integrated, high-performance transmitter device for ultrasound imaging system. The device has a total of 32 pulser circuits, 32 transmit/ receive switches (referred to as T/R or TR switches) and supports on-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high-voltage power supplies.

TX73H32 has a pulser circuit that generates three-level high voltage pulses (up to ±100V) that is used to excite multiple channels of an ultrasound transducer. The device supports total 32 outputs. The maximum output current is 2A.

Device can be used as a transmitter for many applications like ultrasound imaging, non-destructive testing, SONAR, LIDAR, marine navigation system, brain imaging systems and so on.

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Technical documentation

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Type Title Date
* Data sheet TX73H32 3-Level, 32-Channel Transmitter with On-Chip Beamformer, T/R Switch datasheet (Rev. A) PDF | HTML 25 Nov 2024
Product overview Optimizing the Size of Handheld Ultrasound Front-End Circuit Designs PDF | HTML 15 Dec 2023
Application brief Building High-Performance NDT Systems with Ultrasound Transmitters and Receivers PDF | HTML 04 Aug 2023

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TX73H32-DESIGN TX73H32 design resources

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Ultrasound AFEs
TX73H32 32-channel, three -level transmitter with 2A pulser and integrated transmit beamformer
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