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Product details

Parameters

Number of channels (#) 2 Power switch MOSFET, IGBT Peak output current (A) 4 Input VCC (Min) (V) 4 Input VCC (Max) (V) 15 Features Enable Pin Operating temperature range (C) -40 to 105 Rise time (ns) 20 Fall time (ns) 15 Prop delay (ns) 25 Input threshold CMOS, TTL Channel input logic Non-Inverting Input negative voltage (V) 0 Rating Catalog open-in-new Find other Low-side drivers

Package | Pins | Size

HVSSOP (DGN) 8 9 mm² 3 x 3 PDIP (P) 8 93 mm² 9.81 x 9.43 SOIC (D) 8 19 mm² 3.91 x 4.9 SOIC (D) 8 19 mm² 4.9 x 3.9 open-in-new Find other Low-side drivers

Features

  • Industry-Standard Pin-Out
  • Enable Functions for Each Driver
  • High Current Drive Capability of ±4 A
  • Unique BiPolar and CMOS True Drive Output
    Stage Provides High Current at MOSFET Miller
    Thresholds
  • TTL/CMOS Compatible Inputs Independent of
    Supply Voltage
  • 20-ns Typical Rise and 15-ns Typical Fall Times
    with 1.8-nF Load
  • Typical Propagation Delay Times of 25 ns with
    Input Falling and 35 ns with Input Rising
  • 4-V to 15-V Supply Voltage
  • Dual Outputs Can Be Paralleled for Higher Drive
    Current
  • Available in Thermally Enhanced MSOP
    PowerPAD™ Package
  • Rated From –40°C to 125°C
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Description

The UCC2742x family of high-speed dual MOSFET drivers can deliver large peak currents into capacitive loads. Three standard logic options are offered – dual-inverting, dual-noninverting, and one-inverting and one-noninverting driver. The thermally enhanced 8-pin PowerPAD™ MSOP package (DGN) drastically lowers the thermal resistance to improve long-term reliability. It is also offered in the standard SOIC-8 (D) or PDIP-8 (P) packages.

Using a design that inherently minimizes shoot-through current, these drivers deliver 4A of current where it is needed most at the Miller plateau region during the MOSFET switching transition. A unique BiPolar and MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages.

The UCC2742x provides enable (ENB) functions to have better control of the operation of the driver applications. ENBA and ENBB are implemented on pins 1 and 8 which were previously left unused in the industry standard pin-out. They are internally pulled up to VDD for active high logic and can be left open for standard operation.

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UCC27524A ACTIVE 5-A/5-A dual-channel gate driver with 5-V UVLO, enable, and negative input voltage handling This product has higher drive current with 5-A sink/source, as well as faster propagation delay (13-ns) , rise time (7-ns) and fall time (6-ns).

Technical documentation

= Top documentation for this product selected by TI
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Type Title Date
* Datasheet UCC2742x Dual 4-A High Speed Low-Side MOSFET Drivers With Enable datasheet (Rev. E) Dec. 31, 2015
Application note External Gate Resistor Selection Guide (Rev. A) Feb. 28, 2020
Application note Understanding Peak IOH and IOL Currents (Rev. A) Feb. 28, 2020
More literature Fundamentals of MOSFET and IGBT Gate Driver Circuits (Replaces SLUP169) (Rev. A) Oct. 29, 2018
Technical articles How to achieve higher system robustness in DC drives, part 3: minimum input pulse Sep. 19, 2018
Selection guide Power Management Guide 2018 (Rev. R) Jun. 25, 2018
Technical articles How to achieve higher system robustness in DC drives, part 2: interlock and deadtime May 30, 2018
Technical articles Boosting efficiency for your solar inverter designs May 24, 2018
Technical articles How to achieve higher system robustness in DC drives, part 1: negative voltage Apr. 17, 2018

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
49
Description
The UCC2742xQ1 EVM is a high-speed dual MOSFET evaluation module that provides a test platform for a quick and easy startup of the UCC2742xQ1 driver. Powered by a single 4V to 15V external supply, and featuring a comprehensive set of test points and jumpers. All of the devices have separate input (...)
Features
  • Three different UCC2742x-Q1 devices
  • Independent signal inputs
  • Common enable pin
  • Output FET support

Design tools & simulation

SIMULATION MODEL Download
SLUM322.ZIP (40 KB) - PSpice Model
SIMULATION MODEL Download
SLUM439.TSC (82 KB) - TINA-TI Reference Design
SIMULATION MODEL Download
SLUM440.ZIP (15 KB) - TINA-TI Spice Model
SIMULATION MODEL Download
SLUM508.ZIP (2 KB) - PSpice Model
SIMULATION TOOL Download
PSpice® for TI design and simulation tool
PSPICE-FOR-TI — PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Features
  • Leverages Cadence PSpice Technology
  • Preinstalled library with a suite of digital models to enable worst-case timing analysis
  • Dynamic updates ensure you have access to most current device models
  • Optimized for simulation speed without loss of accuracy
  • Supports simultaneous analysis of multiple products
  • (...)

Reference designs

REFERENCE DESIGNS Download
Digitally Controlled Non-Isolated DC/DC Buck Converter Reference Design
TIDM-DC-DC-BUCK The purpose of this design is to demonstrate digital power control using a C2000™ microcontroller and evaluate the powerSUITE Digital Power software tools. The design consists of two separate boards:
document-generic Schematic
REFERENCE DESIGNS Download
360W Digital Controlled Phase Shift Full Bridge Converter Reference Design
TIDA-00412 DC-DC power converter with digital control using UCD3138CC64EVM-030 daughter-card. The daughter-card  with preloaded firmware providing the required control functions for a Phase Shift Full Bridge converter.  The TIDA-00412 (UCD3138PSFBEVM-027) accepts a DC input from 370 to 400 VDC, and (...)
document-generic Schematic

CAD/CAE symbols

Package Pins Download
HVSSOP (DGN) 8 View options
PDIP (P) 8 View options
SOIC (D) 8 View options

Ordering & quality

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  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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