Información de empaque
| Encapsulado | Pines BGA (NXA) | 292 |
| Rango de temperatura de funcionamiento (℃) -40 to 85 |
| Cant. de paquetes | Transportador 40 | JEDEC TRAY (10+1) |
Características para ADC12D1600
- Configurable to Either 2.0/3.2 GSPS Interleaved
or 1.0/1.6 GSPS Dual ADC - Pin-Compatible With ADC10D1x00 and
ADC12D1x00 - Internally Terminated, Buffered, Differential
Analog Inputs - Interleaved Timing Automatic and Manual Skew
Adjust - Test Patterns at Output for System Debug
- Programmable 15-bit Gain and 12-bit Plus Sign
Offset - Programmable tAD Adjust Feature
- 1:1 Non-demuxed or 1:2 Demuxed LVDS Outputs
- AutoSync Feature for Multi-Chip Systems
- Single 1.9-V ± 0.1-V Power Supply
Descripción de ADC12D1600
The 12-bit, 2.0/3.2 GSPS ADC12D1x00 device is the latest advance in TI’s Ultra High-Speed ADC family and builds upon the features, architecture, and functionality of the 10-bit GHz family of ADCs.
The ADC12D1x00 provides a flexible LVDS interface which has multiple SPI programmable options to facilitate board design and FPGA/ASIC data capture. The LVDS outputs are compatible with IEEE 1596.3-1996 and support programmable common-mode voltage.
The ADC12D1x00 is packaged in a leaded or lead-free 292-pin thermally enhanced BGA package over the rated industrial temperature range of –40°C to 85°C.