Información de empaque
| Encapsulado | Pines X2SON (DQE) | 8 |
| Rango de temperatura de funcionamiento (℃) -40 to 85 |
| Cant. de paquetes | Empresa de transporte 5,000 | LARGE T&R |
Características para SN74AUP2G126
- Available in the Texas Instruments NanoStar™ Package
- Low Static-Power Consumption
(ICC = 0.9 µA Max) - Low Dynamic-Power Consumption
(Cpd = 4 pF Typ at 3.3 V) - Low Input Capacitance (Ci = 1.5 pF Typ)
- Low Noise – Overshoot and Undershoot
<10% of VCC - Input-Disable Feature Allows Floating Input Conditions
- Ioff Supports Partial-Power-Down Mode Operation
- Input Hysteresis Allows Slow Input Transition and
Better Switching Noise Immunity at Input - Wide Operating VCC Range of 0.8 V to 3.6 V
- Optimized for 3.3-V Operation
- 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- tpd = 9.9 ns Max at 3.3 V
- Suitable for Point-to-Point Applications
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 2000-V Human-Body Model
NanoStar is a trademark of Texas Instruments.
Descripción de SN74AUP2G126
The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see Figure 1 and Figure 2).
The SN74AUP2G126 is a dual bus driver/line driver with 3-state outputs, designed for 0.8-V to 3.6-V VCC operation. The outputs are disabled when the associated output-enable (OE) input is low. This device has the input-disable feature, which allows floating input signals.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.