196-pin (ZCH) package image

TMS320C5504AZCHA10 ACTIVO

DSP de punto fijo C55x de baja potencia y hasta 150MHz, con USB

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Información de calidad

Calificación Catalog
RoHS
REACH
Clasificación MSL / reflujo máximo Level-3-260C-168 HR
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Información incluida:

  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo / material de la bola
  • Clasificación MSL / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
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Información incluida:

  • Lugar de fabricación
  • Lugar de ensamblaje
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  • US ECCN: 3A991A2

Información de empaque

Encapsulado | Pines NFBGA (ZCH) | 196
Rango de temperatura de funcionamiento (℃) -40 to 85
Cant. de paquetes | Transportador 184 | JEDEC TRAY (5+1)

Características para TMS320C5504

  • High-Performance, Low-Power, TMS320C55x™ Fixed-Point Digital Signal Processor
    • 16.67-, 13.33-, 10-, 8.33-, 6.66-ns Instruction Cycle Time
    • 60-, 75-, 100-, 120-, 150-MHz Clock Rate
    • One/Two Instructions Executed per Cycle
    • Dual Multipliers [Up to 200, 240, or 300 Million Multiply-Accumulates per Second (MMACS)]
    • Two Arithmetic/Logic Units (ALUs)
    • Three Internal Data/Operand Read Buses and Two Internal Data/Operand Write Buses
    • Software-Compatible With C55x Devices
    • Industrial Temperature Devices Available
  • 256K Bytes Zero-Wait State On-Chip RAM, Composed of:
    • 64K Bytes of Dual-Access RAM (DARAM), 8 Blocks of 4K x 16-Bit
    • 192K Bytes of Single-Access RAM (SARAM), 24 Blocks of 4K x 16-Bit
  • 128K Bytes of Zero Wait-State On-Chip ROM
    (4 Blocks of 16K x 16-Bit)
  • 4M x 16-Bit Maximum Addressable External Memory Space (SDRAM/mSDRAM)
  • 16-/8-Bit External Memory Interface (EMIF) with Glueless Interface to:
    • 8-/16-Bit NAND Flash, 1- and 4-Bit ECC
    • 8-/16-Bit NOR Flash
    • Asynchronous Static RAM (SRAM)
    • 16-bit SDRAM/mSDRAM (1.8-, 2.5-, 2.75-, and 3.3-V)
  • Direct Memory Access (DMA) Controller
    • Four DMA With 4 Channels Each (16-Channels Total)
  • Three 32-Bit General-Purpose Timers
    • One Selectable as a Watchdog and/or GP
  • Two MultiMedia Card/Secure Digital (MMC/SD) Interfaces
  • Universal Asynchronous Receiver/Transmitter (UART)
  • Serial-Port Interface (SPI) With Four Chip-Selects
  • Master/Slave Inter-Integrated Circuit (I2C Bus™)
  • Four Inter-IC Sound (I2S Bus™) for Data Transport
  • Device USB Port With Integrated 2.0 High-Speed PHY that Supports:
    • USB 2.0 Full- and High-Speed Device
  • Real-Time Clock (RTC) With Crystal Input, With Separate Clock Domain and Power Supply
  • Four Core Isolated Power Supply Domains: Analog, RTC, CPU and Peripherals, and USB
  • Four I/O Isolated Power Supply Domains: RTC I/O, EMIF I/O, USB PHY, and DVDDIO
  • One integrated LDO (ANA_LDO) to power DSP PLL (VDDA_PLL)
  • Low-Power S/W Programmable Phase-Locked Loop (PLL) Clock Generator
  • On-Chip ROM Bootloader (RBL) to Boot From NAND Flash, NOR Flash, SPI EEPROM, SPI Serial Flash or I2C EEPROM
  • IEEE-1149.1 (JTAG)
    Boundary-Scan-Compatible
  • Up to 26 General-Purpose I/O (GPIO) Pins
    (Multiplexed With Other Device Functions)
  • 196-Terminal Pb-Free Plastic BGA (Ball Grid Array) (ZCH Suffix)
  • 1.05-V Core (60 or 75 MHz), 1.8-V, 2.5-V, 2.75-V, or 3.3-V I/Os
  • 1.3-V Core (100, 120 MHz), 1.8-V, 2.5-V, 2.75-V, or 3.3-V I/Os
  • 1.4-V Core (150 MHz), 1.8-V, 2.5-V, 2.75-V or 3.3-V I/Os

All trademarks are the property of their respective owners. All trademarks are the property of their respective owners.

Descripción de TMS320C5504

The device is a member of TI's TMS320C5000™ fixed-point Digital Signal Processor (DSP) product family and is designed for low-power applications.

The fixed-point DSP is based on the TMS320C55x™ DSP generation CPU processor core. The C55x™ DSP architecture achieves high performance and low power through increased parallelism and total focus on power savings. The CPU supports an internal bus structure that is composed of one program bus, one 32-bit data read bus and two 16-bit data read buses, two 16-bit data write buses, and additional buses dedicated to peripheral and DMA activity. These buses provide the ability to perform up to four 16-bit data reads and two 16-bit data writes in a single cycle. The device also includes four DMA controllers, each with 4 channels, providing data movement for 16-independent channel contexts without CPU intervention. Each DMA controller can perform one 32-bit data transfer per cycle, in parallel and independent of the CPU activity.

The C55x CPU provides two multiply-accumulate (MAC) units, each capable of 17-bit x 17-bit multiplication and a 32-bit add in a single cycle. A central 40-bit arithmetic/logic unit (ALU) is supported by an additional 16-bit ALU. Use of the ALUs is under instruction set control, providing the ability to optimize parallel activity and power consumption. These resources are managed in the Address Unit (AU) and Data Unit (DU) of the C55x CPU.

The C55x CPU supports a variable byte width instruction set for improved code density. The Instruction Unit (IU) performs 32-bit program fetches from internal or external memory and queues instructions for the Program Unit (PU). The Program Unit decodes the instructions, directs tasks to the Address Unit (AU) and Data Unit (DU) resources, and manages the fully protected pipeline. Predictive branching capability avoids pipeline flushes on execution of conditional instructions.

Serial media is supported through two MultiMedia Card/Secure Digital (MMC/SD) peripherals, four Inter-IC Sound (I2S Bus™) modules, one Serial-Port Interface (SPI) with up to 4 chip selects, one I2C multi-master and slave interface, and a Universal Asynchronous Receiver/Transmitter (UART) interface.

The device peripheral set includes an external memory interface (EMIF) that provides glueless access to asynchronous memories like EPROM, NOR, NAND, and SRAM, as well as to high-speed, high-density memories such as synchronous DRAM (SDRAM) and mobile SDRAM (mSDRAM). Additional peripherals include: a high-speed Universal Serial Bus (USB2.0) device mode only, and a real-time clock (RTC). This device also includes three general-purpose timers with one configurable as a watchdog timer, and an analog phase-locked loop (APLL) clock generator.

The device includes one integrated LDO (ANA_LDO) to provide regulated 1.3 V to the DSP PLL (VDDA_PLL). Note: ANA_LDO can only provide a regulated 1.3 V. When the DSP PLL requires 1.4 V (PLLOUT > 120 MHz), an external supply is required to supply 1.4 V to the DSP PLL (VDDA_PLL).

The device is supported by the industry’s award-winning eXpressDSP™, Code Composer Studio™ Integrated Development Environment (IDE), DSP/BIOS™, Texas Instruments’ algorithm standard, and the industry’s largest third-party network. Code Composer Studio IDE features code generation tools including a C Compiler and Linker, RTDX™, XDS100™, XDS510™, XDS560™ emulation device drivers, and evaluation modules. The device is also supported by the C55x DSP Library which features more than 50 foundational software kernels (FIR filters, IIR filters, and various math functions) as well as chip support libraries.

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Opciones de transportador

Puede elegir diferentes opciones de transportador según la cantidad de piezas, incluido carrete completo, carrete personalizado, cinta cortada, tubo o bandeja.

Un carrete personalizado es un trozo continuo de cinta cortada de un carrete para mantener la trazabilidad del código de lote y fecha, construido para la cantidad exacta solicitada. Siguiendo los estándares de la industria, una chapa de latón conecta una cabecera y cola de 18 pulgadas a ambos extremos de la cinta cortada para alimentar directamente las máquinas de ensamblaje automatizadas. TI incluye una tarifa de preparación de carretes para los pedidos de carretes personalizados.

La cinta cortada es un trozo de cinta cortada de un carrete. TI puede cumplir con los pedidos utilizando múltiples tiras de cintas cortadas o cajas para satisfacer la cantidad solicitada.

TI suele enviar los dispositivos de tubo o bandeja dentro de una caja o en el tubo o la bandeja, dependiendo de la disponibilidad de inventario. Embalamos todas las cintas, tubos o cajas de muestras de acuerdo con los requisitos de descarga electrostática interna y de protección del nivel de sensibilidad a la humedad.

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