- Allows testing of most TI ESD devices
- Many footprints to allow testing of each part
- S-parameter testing for signal integrity
Texas Instrument's ESDEVM evaluation module allows the evaluation of most of TI's ESD portfolio. The board comes with all traditional ESD footprints in order to be able to test any number of devices. Devices that need to be tested can be soldered onto their respect footprint and then tested. For the typical high speed ESD devices, an impedance controlled layout is implemented to be able to take the S-parameter and de-embed the board trace. For the non-high speed ESD diodes, footprints with traces going to test points are provided to easily run DC tests such as breakdown voltage, holding voltage, leakage, etc. The board layout also makes it easy to connect any of the device's pins to either power (VCC) or ground by shorting the signal pin to which every the signal is.