제품 상세 정보

Sensor resolution 80 x 60 Pixel pitch (µm) 30 Type System-on-Chip (SoC) Interface type CMOS Parallel Interface, DVP, SSI Output format Depth Data Frame rate (max) (FPS) 1000 Operating temperature range (°C) 0 to 70 Rating Catalog
Sensor resolution 80 x 60 Pixel pitch (µm) 30 Type System-on-Chip (SoC) Interface type CMOS Parallel Interface, DVP, SSI Output format Depth Data Frame rate (max) (FPS) 1000 Operating temperature range (°C) 0 to 70 Rating Catalog
COG (NBP) 56 42.88726 mm² 5.321 x 8.06
  • Imaging Array:
    • 80 × 60 Array
    • 1/6” Sensor Format
    • Pixel Pitch: 30 µm
    • Frame Rate: Scalable Up to 1000-FPS Depth Output Rate with an Internal Raw Rate of 4000 FPS
  • Optical Properties:
    • Responsivity: 0.35 A/W at 850 nm
    • Demodulation Contrast: 70% at 50 MHz
    • Demodulation Frequency: 10 MHz to 100 MHz
  • Output Interface:
    • Digital Video Port (DVP): 8 Data Lanes,
      HD and VD Pins, and Clock
    • Synchronous Serial Interface (SSI):
      1 Data Lane, Clock, and Chip Select
  • Timing Generator:
    • Sensor Addressing Engine
    • Modulation Control
    • De-Aliasing
    • Master, Slave Sync Operation
    • High Dynamic Range Operation
  • Depth Engine:
    • Pixel Binning
    • De-Aliasing
    • Histogram
    • Calibration
  • Power Supply:
    • 3.3-V I/O, Analog
    • 1.8-V Analog, Digital, I/O
    • 1.8-V Demodulation (Typical)
  • Optimized Optical Package (COG-56):
    • 8.03 mm × 5.32 mm × 0.745 mm
    • Integrated Optical Band-Pass Filter
      (830 nm to 867 nm)
    • Optical Fiducials for Easy Alignment
  • Built-In Illumination Driver for Low-Power Applications
  • Operating Temperature: 0°C to 70°C
  • Imaging Array:
    • 80 × 60 Array
    • 1/6” Sensor Format
    • Pixel Pitch: 30 µm
    • Frame Rate: Scalable Up to 1000-FPS Depth Output Rate with an Internal Raw Rate of 4000 FPS
  • Optical Properties:
    • Responsivity: 0.35 A/W at 850 nm
    • Demodulation Contrast: 70% at 50 MHz
    • Demodulation Frequency: 10 MHz to 100 MHz
  • Output Interface:
    • Digital Video Port (DVP): 8 Data Lanes,
      HD and VD Pins, and Clock
    • Synchronous Serial Interface (SSI):
      1 Data Lane, Clock, and Chip Select
  • Timing Generator:
    • Sensor Addressing Engine
    • Modulation Control
    • De-Aliasing
    • Master, Slave Sync Operation
    • High Dynamic Range Operation
  • Depth Engine:
    • Pixel Binning
    • De-Aliasing
    • Histogram
    • Calibration
  • Power Supply:
    • 3.3-V I/O, Analog
    • 1.8-V Analog, Digital, I/O
    • 1.8-V Demodulation (Typical)
  • Optimized Optical Package (COG-56):
    • 8.03 mm × 5.32 mm × 0.745 mm
    • Integrated Optical Band-Pass Filter
      (830 nm to 867 nm)
    • Optical Fiducials for Easy Alignment
  • Built-In Illumination Driver for Low-Power Applications
  • Operating Temperature: 0°C to 70°C

The OPT8320 time-of-flight (ToF) sensor is part of the TI 3D ToF image sensor family. The device is a high-performance, highly-integrated, complete system-on-chip (SoC) for array depth sensing, consisting of a versatile timing generator (TG), an optimally designed analog-to-digital converter (ADC), a depth engine, and an illumination driver.

The programmability of the built-in TG offers the flexibility to optimize for various depth-sensing performance metrics [such as power, motion robustness, signal-to-noise ratio (SNR), and ambient cancellation]. The built-in depth engine computes the depth data from the digitized sensor data. In addition to the phase data, the depth engine provides auxiliary information consisting of amplitude, ambient, and flags for each pixel and the full-array statistical information in the form of a histogram.

The OPT8320 time-of-flight (ToF) sensor is part of the TI 3D ToF image sensor family. The device is a high-performance, highly-integrated, complete system-on-chip (SoC) for array depth sensing, consisting of a versatile timing generator (TG), an optimally designed analog-to-digital converter (ADC), a depth engine, and an illumination driver.

The programmability of the built-in TG offers the flexibility to optimize for various depth-sensing performance metrics [such as power, motion robustness, signal-to-noise ratio (SNR), and ambient cancellation]. The built-in depth engine computes the depth data from the digitized sensor data. In addition to the phase data, the depth engine provides auxiliary information consisting of amplitude, ambient, and flags for each pixel and the full-array statistical information in the form of a histogram.

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기술 자료

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
7개 모두 보기
유형 직함 날짜
* Data sheet OPT8320 3D Time-of-Flight Sensor (Short) datasheet 2018/04/24
E-book E-book: An engineer’s guide to industrial robot designs 2020/02/12
EVM User's guide OPT8320-CDK-EVM User's Guide (Rev. A) 2017/02/02
Application note Sensor Optics Selection Guide for 3D ToF Camera Systems PDF | HTML 2016/07/22
White paper Filtering for 3D Time-of-Flight Sensors 2016/01/21
Design guide Introduction to Time-of-Flight (ToF) System Design (Rev. D) 2014/05/13
White paper Introduction to Time-of-Flight Camera (Rev. B) 2014/05/07

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

시뮬레이션 모델

OPT8320 IBIS Model

SBAM256.ZIP (88 KB) - IBIS Model
계산 툴

SBAC124 3D ToF System Estimator Tool

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
근접 센서
OPT8241 QVGA 해상도 3D Time-of-Flight(ToF) 센서 OPT8320 3D ToF(Time of Flight) 센서 및 컨트롤러 OPT9221 OPT8241을 위한 ToF(비행 시간) 컨트롤러
패키지 CAD 기호, 풋프린트 및 3D 모델
COG (NBP) 56 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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지원 및 교육

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