176-pin (ZRH) package image

74SSTUB32868AZRHR 現行

28 位元至 56 位元暫存緩衝器,具位址奇偶測試且適用高負載 DDR2 暫存 DIMM

現行 custom-reels 客製 可提供客製捲盤

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品質資訊

等級 Catalog
RoHS
REACH
引腳鍍層 / 焊球材質 SNAGCU
MSL 等級 / 迴焊峰值 Level-3-260C-168 HR
品質、可靠性
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  • RoHS
  • REACH
  • 產品標記
  • 引腳鍍層 / 焊球材質
  • MSL 等級 / 迴焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中可靠性監測
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其他製造資訊

內含資訊:

  • 晶圓廠位置
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出口分類

*僅供參考

  • 美國 ECCN:EAR99

封裝資訊

封裝 | 引腳 NFBGA (ZRH) | 176
作業溫度範圍 (°C) -40 to 85
包裝數量 | 運送包裝 1,000 | LARGE T&R

74SSTUB32868A 的特色

  • Member of the Texas Instruments Widebus+™ Family
  • Pinout Optimizes DDR2 DIMM PCB Layout
  • 1-to-2 Outputs Support Stacked DDR2 DIMMs
  • One Device Per DIMM Required
  • Chip-Select Inputs Gate the Data Outputs from Changing State and Minimizes System Power Consumption
  • Output Edge-Control Circuitry Minimizes Switching Noise in an Unterminated Line
  • Supports SSTL_18 Data Inputs
  • Differential Clock (CLK and CLK) Inputs
  • Supports LVCMOS Switching Levels on the Chip-Select Gate-Enable, Control, and RESET Inputs
  • Checks Parity on DIMM-Independent Data Inputs
  • Supports industrial temperature range (-40°C to 85°C)
  • RESET Input Disables Differential Input Receivers, Resets All Registers, and Forces All Outputs Low, Except QERR
  • APPLICATIONS
    • Heavily loaded DDR2 registered DIMM

Widebus+ is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners

74SSTUB32868A 的說明

This 28-bit 1:2 configurable registered buffer is designed for 1.7-V to 1.9-V VCC operation. One device per DIMM is required to drive up to 18 stacked SDRAM loads or two devices per DIMM are required to drive up to 36 stacked SDRAM loads.

All inputs are SSTL_18, except the chip-select gate-enable (CSGEN), control (C), and reset (RESET) inputs, which are LVCMOS. All outputs are edge-controlled circuits optimized for unterminated DIMM loads, and meet SSTL_18 specifications, except the open-drain error (QERR) output.

The 74SSTUB32868A operates from a differential clock (CLK and CLK). Data are registered at the crossing of CLK going high and CLK going low.

The 74SSTUB32868A accepts a parity bit from the memory controller on the parity bit (PAR_IN) input, compares it with the data received on the DIMM-independent D-inputs (D1-D5, D7, D9-D12, D17-D28 when C = 0; or D1-D12, D17-D20, D22, D24-D28 when C = 1) and indicates whether a parity error has occurred on the open-drain QERR pin (active low). The convention is even parity; that is, valid parity is defined as an even number of ones across the DIMM-independent data inputs combined with the parity input bit. To calculate parity, all DIMM-independent D-inputs must be tied to a known logic state.

The 74SSTUB32868A includes a parity checking function. Parity, which arrives one cycle after the data input to which it applies, is checked on the PAR_IN input of the device. Two clock cycles after the data are registered, the corresponding QERR signal is generated.

If an error occurs and the QERR output is driven low, it stays latched low for a minimum of two clock cycles or until RESET is driven low. If two or more consecutive parity errors occur, the QERR output is driven low and latched low for a clock duration equal to the parity error duration or until RESET is driven low. If a parity error occurs on the clock cycle before the device enters the low-power mode (LPM) and the QERR output is driven low, it stays latched low for the LPM duration plus two clock cycles or until RESET is driven low. The DIMM-dependent signals (DCKE0, DCKE1, DODT0, DODT1, DCS0 and DCS1) are not included in the parity check computation.

The C input controls the pinout configuration from register-A configuration (when low) to register-B configuration (when high). The C input should not be switched during normal operation. It should be hard-wired to a valid low or high level to configure the register in the desired mode.

In the DDR2 RDIMM application, RESET is specified to be completely asynchronous with respect to CLK and CLK. Therefore, no timing relationship can be ensured between the two. When entering reset, the register is cleared and the data outputs is driven low quickly, relative to the time to disable the differential input receivers. However, when coming out of reset, the register becomes active quickly, relative to the time to enable the differential input receivers. As long as the data inputs are low, and the clock is stable during the time from the low-to-high transition of RESET until the input receivers are fully enabled, the design of the 74SSTUB32868A must ensure that the outputs remain low, thus ensuring no glitches on the output.

To ensure defined outputs from the register before a stable clock has been supplied, RESET must be held in the low state during power up.

The device supports low-power standby operation. When RESET is low, the differential input receivers are disabled, and undriven (floating) data, clock, and reference voltage (VREF) inputs are allowed. In addition, when RESET is low, all registers are reset and all outputs are forced low except QERR. The LVCMOS RESET and C inputs always must be held at a valid logic high or low level.

The device also supports low-power active operation by monitoring both system chip select (DCS0 and DCS1) and CSGEN inputs and will gate the Qn outputs from changing states when CSGEN, DCS0, and DCS1 inputs are high. If CSGEN, DCS0 or DCS1 input is low, the Qn outputs function normally. Also, if both DCS0 and DCS1 inputs are high, the device will gate the QERR output from changing states. If either DCS0 or DCS1 is low, the QERR output functions normally. The RESET input has priority over the DCS0 and DCS1 control and when driven low forces the Qn outputs low, and the QERR output high. If the chip-select control functionality is not desired, then the CSGEN input can be hard-wired to ground, in which case, the setup-time requirement for DCS0 and DCS1 would be the same as for the other D data inputs. To control the low-power mode with DCS0 and DCS1 only, then the CSGEN input should be pulled up to VCC through a pullup resistor.

The two VREF pins (A5 and AB5) are connected together internally by approximately 150 . However, it is necessary to connect only one of the two VREF pins to the external VREF power supply. An unused VREF pin should be terminated with a VREF coupling capacitor.

定價

數量 價格
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包裝類型選項

您可依零件數量選擇不同包裝類型選項,包含完整捲盤、客製化捲盤、剪切捲帶、承載管或盤。

客製化捲盤是從一個捲盤上剪切下來的連續剪切捲帶,以維持批次和日期代碼可追溯性,依要求剪切至確切數量。依照業界標準,銅墊片會在剪切捲帶兩側連接 18 英吋前後導帶,以直接送至自動組裝機器。針對客製化捲盤訂單,TI 將酌收捲帶封裝費用。

剪切捲帶是從捲盤剪切下來的一段捲帶。TI 可能使用多條剪切捲帶或承載盒,以滿足訂單要求數量。

TI 常以盒裝或管裝、盤裝方式運送承載管裝置,視現有庫存而定。所有捲帶、管或樣本盒之封裝,皆符合公司內部靜電放電與防潮保護包裝要求。

進一步了解

可提供批次和日期代碼選擇

在購物車中加入數量,並開始結帳流程以檢視可用選項,從現有庫存中選擇批次或日期代碼。

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