DS90LV027AQ-Q1
- AECQ-100 Grade 1
- >600 Mbps (300MHz) Switching Rates
- 0.3 ns Typical Differential Skew
- 0.7 ns Maximum Differential Skew
- 3.3V Power Supply Design
- Low Power Dissipation (46 mW @ 3.3V Static)
- Flow-Through Design Simplifies PCB Layout
- Power Off Protection (Outputs in High Impedance)
- Conforms to TIA/EIA-644 Standard
- 8-Lead SOIC Package Saves Space
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The DS90LV027AQ is a dual LVDS driver device optimized for high data rate and low power applications. The device is designed to support data rates in excess of 600Mbps (300MHz) utilizing Low Voltage Differential Signaling (LVDS) technology. The DS90LV027AQ is a current mode driver allowing power dissipation to remain low even at high frequency. In addition, the short circuit fault current is also minimized.
The device is in a 8-lead SOIC package. The DS90LV027AQ has a flow-through design for easy PCB layout. The differential driver outputs provides low EMI with its typical low output swing of 360 mV. It is perfect for high speed transfer of clock and data. The DS90LV027AQ can be paired with its companion dual line receiver, the DS90LV028AQ, or with any of TI's LVDS receivers, to provide a high-speed point-to-point LVDS interface.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | DS90LV027AQ Automotive LVDS Dual Differential Driver datasheet (Rev. D) | 2013年 4月 17日 | |
Application brief | LVDS to Improve EMC in Motor Drives | 2018年 9月 27日 | ||
Application brief | How Far, How Fast Can You Operate LVDS Drivers and Receivers? | 2018年 8月 3日 | ||
Application brief | How to Terminate LVDS Connections with DC and AC Coupling | 2018年 5月 16日 | ||
Application note | An Overview of LVDS Technology | 1998年 10月 5日 |
設計與開發
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DS90LV027A-28AEVM — 二通道 LVDS 驅動器和接收器評估模組
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。