16-pin (W) package image

5962-1124201VFA 現行

2x2 交叉點開關:LVDS 輸出

現行 barcode 批次/日期 可提供批次和日期代碼選擇

定價

數量 價格
+

品質資訊

等級 Space
RoHS
REACH 受影響
引腳鍍層 / 焊球材質 SNPB
MSL 等級 / 迴焊峰值 N/A for Pkg Type
品質、可靠性
及包裝資訊

內含資訊:

  • RoHS
  • REACH
  • 產品標記
  • 引腳鍍層 / 焊球材質
  • MSL 等級 / 迴焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中可靠性監測
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其他製造資訊

內含資訊:

  • 晶圓廠位置
  • 組裝地點
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出口分類

*僅供參考

  • 美國 ECCN:5A991B1

封裝資訊

封裝 | 引腳 CFP (W) | 16
作業溫度範圍 (°C) -55 to 125
包裝數量 | 運送包裝 25 | TUBE

SN55LVCP22-SP 的特色

  • High Speed (>1000 Mbps) Upgrade for DS90CP22 2x2 LVDS
    Crosspoint Switch
  • Low-Jitter Fully Differential Data Path
  • 50 ps (Typ), of Peak-to-Peak Jitter With PRBS = 223–1 Pattern
  • Less Than 200 mW (Typ), 300 mW (Max) Total Power Dissipation
  • Output (Channel-to-Channel) Skew Is 80 ps (Typ)
  • Configurable as 2:1 Mux, 1:2 Demux, Repeater or 1:2 Signal Splitter
  • Inputs Accept LVDS, LVPECL, and CML Signals
  • Fast Switch Time of 1.7 ns (Typ)
  • Fast Propagation Delay of 0.65 ns (Typ)
  • Available in 16 pin CFP Package
  • Inter-Operates With TIA/EIA-644-A LVDS Standard
  • Military Temperature Range: –55°C to 125°C

SN55LVCP22-SP 的說明

The SN55LVCP22 is a 2×2 crosspoint switch providing greater than 1000 Mbps operation for each path. The dual channels incorporate wide common-mode (0 V to 4 V) receivers, allowing for the receipt of LVDS, LVPECL, and CML signals. The dual outputs are LVDS drivers to provide low-power, low-EMI, high-speed operation. The SN55LVCP22 provides a single device supporting 2:2 buffering (repeating), 1:2 splitting, 2:1 multiplexing, 2×2 switching, and LVPECL/CML to LVDS level translation on each channel. The flexible operation of the SN55LVCP22 provides a single device to support the redundant serial bus transmission needs (working and protection switching cards) of fault-tolerant switch systems found in optical networking, wireless infrastructure, and data communications systems. TI offers additional gigabit repeater/ translator and crosspoint products in the SN65LVDS100 and SN65LVDS122.

The SN55LVCP22 uses a fully differential data path to ensure low-noise generation, fast switching times, low pulse width distortion, and low jitter. Output channel-to- channel skew is 80 ps (typ) to ensure accurate alignment of outputs in all applications. Both SOIC and TSSOP package options are available to allow easy upgrade for existing solutions, and board area savings where space is critical.

定價

數量 價格
+

包裝類型選項

您可依零件數量選擇不同包裝類型選項,包含完整捲盤、客製化捲盤、剪切捲帶、承載管或盤。

客製化捲盤是從一個捲盤上剪切下來的連續剪切捲帶,以維持批次和日期代碼可追溯性,依要求剪切至確切數量。依照業界標準,銅墊片會在剪切捲帶兩側連接 18 英吋前後導帶,以直接送至自動組裝機器。針對客製化捲盤訂單,TI 將酌收捲帶封裝費用。

剪切捲帶是從捲盤剪切下來的一段捲帶。TI 可能使用多條剪切捲帶或承載盒,以滿足訂單要求數量。

TI 常以盒裝或管裝、盤裝方式運送承載管裝置,視現有庫存而定。所有捲帶、管或樣本盒之封裝,皆符合公司內部靜電放電與防潮保護包裝要求。

進一步了解

可提供批次和日期代碼選擇

在購物車中加入數量,並開始結帳流程以檢視可用選項,從現有庫存中選擇批次或日期代碼。

進一步了解