SN65LV1023A
- 100-Mbps to 660-Mbps Serial LVDS Data Payload Bandwidth at 10-MHz
to 66-MHz System Clock - Pin-Compatible Superset of DS92LV1023/DS92LV1224
- Chipset (Serializer/Deserializer) Power Consumption <450 mW (Typ) at 66 MHz
- Synchronization Mode for Faster Lock
- Lock Indicator
- No External Components Required for PLL
- 28-Pin SSOP and Space Saving 5 × 5 mm QFN Packages Available
- Industrial Temperature Qualified,
TA = −40°C to 85°C - Programmable Edge Trigger on Clock
- Flow-Through Pinout for Easy PCB Layout
- APPLICATIONS
- Wireless Base Station
- Backplane Interconnect
- DSLAM
The SN65LV1023A serializer and SN65LV1224B deserializer comprise a 10-bit serdes chipset designed to transmit and receive serial data over LVDS differential backplanes at equivalent parallel word rates from 10 MHz to 66 MHz. Including overhead, this translates into a serial data rate between 120-Mbps and 792-Mbps payload encoded throughput.
Upon power up, the chipset link can be initialized via a synchronization mode with internally generated SYNC patterns or the deserializer can be allowed to synchronize to random data. By using the synchronization mode, the deserializer establishes lock within specified, shorter time parameters.
The device can be entered into a power-down state when no data transfer is required. Alternatively, a mode is available to place the output pins in the high-impedance state without losing PLL lock.
The SN65LV1023A and SN65LV1224B are characterized for operation over ambient air temperature of –40°C to 85°C.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | 10-MHz to 66-MHz, 10:1-LVDS Serializer/Deserializer datasheet (Rev. E) | 2009年 12月 7日 | |
* | Errata | SN65LV1023A Sync Pattern Generation Logic Error | 2003年 6月 26日 | |
Application note | Applications of Low-Voltage Differential Signaling (LVDS) in LED Walls | 2020年 10月 29日 | ||
Application brief | Migrating from DS92LV1021A/1212A 10-bit SerDes to SN65LV1023A/1224B | 2018年 11月 15日 | ||
User guide | 10:1 Serializer/Deserializer Evaluation Board | 2013年 11月 20日 |
設計與開發
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TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SSOP (DB) | 28 | Ultra Librarian |
VQFN (RHB) | 32 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。