封裝資訊
| 封裝 | 引腳 HTQFP (PZP) | 100 |
| 作業溫度範圍 (°C) -40 to 85 |
| 包裝數量 | 運送包裝 1,000 | LARGE T&R |
TFP401A-Q1 的特色
- Qualified for automotive applications
- AEC-Q100 qualified with the following results:
- Device temperature grade 3: –40°C to 85°C ambient operating temperature range
- Device HBM ESD classification level H2
- Device CDM ESD classification level C3B
- Supports pixel rates up to 165 MHz (including 1080p and WUXGA at 60 Hz)
- Digital visual interface (DVI) specification compliant(1)
- True-Color, 24-bit/pixel, 16.7M colors at 1 or 2 pixels per clock
- Laser-trimmed internal termination resistors for optimum fixed impedance matching
- Skew tolerant up to one pixel-clock cycle
- 4× oversampling
- Reduced power consumption: 1.8-V core operation with 3.3-V I/Os and supplies(2)
- Reduced ground bounce using time-staggered pixel outputs
- Low noise and good power dissipation using TI PowerPAD™ packaging
- Advanced technology using TI 0.18-µm EPIC-5™ CMOS process
- TFP401A-Q1 Incorporates HSYNC Jitter Immunity(3)
(1)The TFP401A-Q1 device incorporates additional circuitry to create a stable HSYNC from DVI transmitters that introduce undesirable jitter on the transmitted HSYNC signal.
(2)The TFP401A-Q1 device has an internal voltage regulator that provides the 1.8-V core power supply from the external 3.3-V supplies.
(3)The Digital Visual Interface Specification, DVI, is an industry standard developed by the Digital Display Working Group (DDWG) for high-speed digital connection to digital displays. The TFP401A-Q1 is compliant with the DVI Specification Rev. 1.0.
TFP401A-Q1 的說明
The Texas Instruments TFP401A-Q1 device is a TI Panelbus™ flat-panel display product, and is part of a comprehensive family of end-to-end DVI 1.0-compliant solutions. Targeted primarily at desktop LCD monitors and digital projectors, the TFP401A-Q1 device finds applications in any design requiring high-speed digital interface.
The TFP401A-Q1 device supports display resolutions up to 1080p and WUXGA in 24-bit true-color pixel format. It also offers design flexibility to drive one or two pixels per clock, supports TFT or DSTN panels, and provides an option for time-staggered pixel outputs for reduced ground bounce.
PowerPAD advanced packaging technology results in best-of-class power dissipation, footprint, and ultralow ground inductance.
The TFP401A-Q1 combines Panelbus circuit innovation with TI’s advanced 0.18-µm EPIC-5™ CMOS process technology, along with TI PowerPAD package technology to achieve a reliable, low-powered, low-noise, high-speed digital interface solution.