TLK2201BRCP 1.0 至 1.6 GB 乙太網路收發器 | RCP | 64 | 0 to 70 package image

TLK2201BRCP 最後一次購買

1.0 至 1.6 GB 乙太網路收發器

定價

數量 價格
+

額外包裝數量 | 包裝類型選項 這些產品完全相同,但包裝類型不同

TLK2201BRCPR 最後一次購買 custom-reels 客製 可提供客製捲盤
包裝數量 | 運送包裝 1,000 | LARGE T&R
庫存
數量 | 價格 1ku | +

品質資訊

等級 Catalog
RoHS
REACH
引腳鍍層 / 焊球材質 NIPDAU
MSL 等級 / 迴焊峰值 Level-3-260C-168 HR
品質、可靠性
及包裝資訊

內含資訊:

  • RoHS
  • REACH
  • 產品標記
  • 引腳鍍層 / 焊球材質
  • MSL 等級 / 迴焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中可靠性監測
檢視或下載
其他製造資訊

內含資訊:

  • 晶圓廠位置
  • 組裝地點
檢視

出口分類

*僅供參考

  • 美國 ECCN:5A991B1

封裝資訊

封裝 | 引腳 HVQFP (RCP) | 64
作業溫度範圍 (°C) 0 to 70
包裝數量 | 運送包裝 160 | JEDEC TRAY (10+1)

TLK2201B 的特色

  • 1 to 1.6 Gigabits Per Second (Gbps) Serializer/Deserializer (TLK2201B)
  • 1.2 to 1.6 Gigabits Per Second (Gbps) Serializer/Deserializer (TLK2201BI)
  • Low Power Consumption <200 mW at 1.25 Gbps
  • LVPECL Compatible Differential I/O on High Speed Interface
  • Single Monolithic PLL Design
  • Support For 10 Bit Interface or Reduced Interface 5 Bit DDR (Double Data Rate) Clocking
  • Receiver Differential Input Thresholds 200 mV Minimum
  • Industrial Temperature Range From -40°C to 85°C (TLK2201BI)
  • IEEE 802.3 Gigabit Ethernet Compliant
  • Advanced 0.25 µm CMOS Technology
  • No External Filter Capacitors Required
  • Comprehensive Suite of Built-In Testability
  • IEEE 1149.1 JTAG Support
  • 2.5-V Supply Voltage for Lowest Power Operation
  • 3.3-V Tolerant on LVTTL Inputs
  • Hot Plug Protection
  • 64-Pin VQFP With Thermally Enhanced Package (PowerPAD™)

PowerPAD is a trademark of Texas Instruments.

TLK2201B 的說明

The TLK2201B and TLK2201BI gigabit ethernet transceivers provide for ultrahigh-speed full-duplex point-to-point data transmissions. These devices are based on the timing requirements of the 10-bit interface specification by the IEEE 802.3 Gigabit Ethernet specification. The TLK2201B supports data rates from 1.0 Gbps through 1.6 Gbps and the TLK2201BI supports data rates from 1.2 Gbps through 1.6 Gbps.

The primary application of these devices is to provide building blocks for point-to-point baseband data transmission over controlled impedance media of 50 . The transmission media can be printed-circuit board traces, copper cables or fiber-optical media. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment.

The TLK2201B and TLK2201BI perform the data serialization, deserialization, and clock extraction functions for a physical layer interface device. The transceiver operates at 1.25 Gbps (typical), providing up to 1 Gbps of data bandwidth over a copper or optical media interface.

The TLK2201B and TLK2201BI support both the defined 10-bit interface (TBI) and a reduced 5-bit interface utilizing double data rate (DDR) clocking. In the TBI mode the serializer/deserializer (SERDES) accepts 10-bit wide 8b/10b parallel encoded data bytes. The parallel data bytes are serialized and transmitted differentially at PECL compatible voltage levels. The SERDES extracts clock information from the input serial stream and deserializes the data, outputting a parallel 10-bit data byte.

In the DDR mode the parallel interface accepts 5-bit wide 8b/10b encoded data aligned to both the rising and falling edge of the reference clock. The data is clocked most significant bit first, (bits 0-4 of the 8b/10b encoded data) on the rising edge of the clock and the least significant bits (bits 5-9 of the 8b/10b encoded data) are clocked on the falling edge of the clock.

The TLK2201B and TLK2201BI provide a comprehensive series of built-in tests for self-test purposes including loopback and pseudorandom binary sequence (PRBS) generation and verification. An IEEE 1149.1 JTAG port is also supported.

The TLK2201B and TLK2201BI are housed in a high performance, thermally enhanced, 64-pin VQFP PowerPAD package. Use of the PowerPAD package does not require any special considerations except to note that the PowerPAD, which is an exposed die pad on the bottom of the device, is a metallic thermal and electrical conductor. It is recommended that the TLK2201B and TLK2201BI PowerPADs be soldered to the thermal land on the board.

The TLK2201B is characterized for operation from 0°C to 70°C. The TLK2201BI is characterized for operation from -40°C to 85°C.

The TLK2201B and TLK2201BI use a 2.5-V supply. The I/O section is 3.3-V compatible. With the 2.5-V supply the chipset is very power-efficient, dissipating less than 200 mW typical power when operating at 1.25 Gbps.

The TLK2201B and TLK2201BI are designed to be hot plug capable. A power-on reset causes RBC0, RBC1, the parallel output signal terminals, TXP, and TXN to be held in high-impedance state.

定價

數量 價格
+

額外包裝數量 | 包裝類型選項 這些產品完全相同,但包裝類型不同

TLK2201BRCPR 最後一次購買 custom-reels 客製 可提供客製捲盤
包裝數量 | 運送包裝 1,000 | LARGE T&R
庫存
數量 | 價格 1ku | +

包裝類型選項

您可依零件數量選擇不同包裝類型選項,包含完整捲盤、客製化捲盤、剪切捲帶、承載管或盤。

客製化捲盤是從一個捲盤上剪切下來的連續剪切捲帶,以維持批次和日期代碼可追溯性,依要求剪切至確切數量。依照業界標準,銅墊片會在剪切捲帶兩側連接 18 英吋前後導帶,以直接送至自動組裝機器。針對客製化捲盤訂單,TI 將酌收捲帶封裝費用。

剪切捲帶是從捲盤剪切下來的一段捲帶。TI 可能使用多條剪切捲帶或承載盒,以滿足訂單要求數量。

TI 常以盒裝或管裝、盤裝方式運送承載管裝置,視現有庫存而定。所有捲帶、管或樣本盒之封裝,皆符合公司內部靜電放電與防潮保護包裝要求。

進一步了解

可提供批次和日期代碼選擇

在購物車中加入數量,並開始結帳流程以檢視可用選項,從現有庫存中選擇批次或日期代碼。

進一步了解